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NXP Semiconductors MC9S08DN16CLC

Part No.:
MC9S08DN16CLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08DN16CLC.pdf
Description:
IC MCU 8BIT 16KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,303

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Product details

Overview

MC9S08DN16CLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 2 KB RAM, and 2 KB EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC (12-bit, 16-channel), dual analog comparators, SCI (LIN 2.0/J2602 compliant), SPI, I²C, two TPM modules, RTC, and real-time interrupt capability - deployed in automotive body control modules and industrial sensor nodes.

For engineers reviewing the MC9S08DN16CLC datasheet, MC9S08DN16CLC pinout, MC9S08DN16CLC application, or MC9S08DN16CLC equivalent, key selection criteria include Flash size (16 KB), EEPROM endurance (100K erase/write cycles), 53 GPIO with configurable slew rate and pull devices, and support for Stop3/Stop2 low-power modes with RTC wake-up.

Technical Context

The MC9S08DN16CLC implements the S08CPUV3 core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with factory-trimmed internal reference and ±1.5% FLL accuracy over temperature.

Peripherals include a 12-bit ADC with 2.5 μs conversion time and internal temperature sensor, two analog comparators with bandgap reference option, and SCI1 with LIN 2.0 master/slave break generation/detection - all functional in Run, Wait, and Stop3 modes with selective peripheral clock gating.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV3, 40-MHz max CPU clock, 20-MHz bus clock
Flash Memory16 KB on-chip Flash with block protection, program/erase during execution
RAM / EEPROM2 KB SRAM; 2 KB EEPROM with 4-/8-byte sector erase and in-circuit programmability
ADC16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor channel
TimersTPM1 (6-channel) and TPM2 (2-channel); input capture, output compare, edge-aligned PWM
Low-Power ModesStop3 (deep sleep, RTC active), Stop2 (RTC + LPR), Wait (clock-gated CPU), real-time interrupt wake-up
Package48-pin LQFP (7×7 mm), lead-free, RoHS-compliant

Pinout & Package

MC9S08DN16CLC is housed in a 48-pin low-profile quad flat-pack (LQFP), 7 mm × 7 mm, 0.5 mm pitch, thermally enhanced for industrial ambient operation (–40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 2.7–5.5 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) with separate filtering paths
XTAL, EXTALCrystal/resonator interfaceSupports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; connects directly to MCG oscillator circuit
BKGD/MSSingle-wire debug and mode selectActive-low background debug entry; multiplexed with GPIO during normal operation
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external debounced signal or power-on reset assertion
AD0–AD15Analog input channels16 of 53 GPIO pins configurable as ADC inputs; share pins with Port A, B, C, D, E, F, G
SCI1_TX, SCI1_RXUART serial interfaceFull-duplex NRZ communication; supports LIN 2.0 extended break generation/detection
TPM1_CH0–CH5PWM/capture outputs6 dedicated TPM1 channels; each configurable as input capture, output compare, or buffered PWM

Key Features

FeatureDesign Value
On-chip EEPROM2 KB in-circuit programmable memory with 4-byte dual-page or 8-byte single-page erase sectors - enables field firmware updates without external storage
Real-time interrupt (RTI)Configurable 8-bit modulus counter with binary/decimal prescaler - delivers precise cyclic wake-up from Stop/Wait modes without external crystal
ADC temperature sensorIntegrated silicon diode sensor with calibration data stored in Flash - provides system-level thermal monitoring without external components
Low-voltage detection (LVD)Selectable trip points (e.g., 2.5 V, 2.7 V, 3.0 V) with reset or interrupt output - protects against brown-out during battery-powered operation
Flash securityBlock-level protection and flash security byte - prevents unauthorized read-out of firmware while allowing debug access via BKGD if enabled

Applications

Automotive Body Control UnitIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle systems.

IC Role / Device Role / Timing Role: Main MCU executing CAN/LIN gateway logic, PWM motor control, and ADC-based position sensing.

Use Value: 16 KB Flash accommodates LIN protocol stack + application code; Stop3 mode with RTC enables <1.5 µA sleep current for battery longevity.

Use Scenario: Wireless-capable environmental monitor measuring temperature, humidity, and voltage in factory automation cabinets.

IC Role / Device Role / Timing Role: Sensor fusion controller interfacing with analog sensors, managing SPI-connected transceivers, and scheduling periodic wake-up via RTC.

Use Value: Integrated 12-bit ADC with internal temperature sensor eliminates discrete sensor; EEPROM stores calibration coefficients across power cycles.

Smart Appliance Control PanelMedical Diagnostic Handheld

Use Scenario: User interface and motor sequencing in washing machines, dishwashers, and HVAC fan controllers.

IC Role / Device Role / Timing Role: Real-time task scheduler coordinating display updates, keypad scanning, and multi-phase motor drive timing.

Use Value: Dual TPM modules generate synchronized PWM waveforms for BLDC commutation; 53 GPIO support matrix keypad + LED drivers + status indicators.

Use Scenario: Portable blood glucose meter or pulse oximeter requiring precision analog measurement and low-power operation.

IC Role / Device Role / Timing Role: Signal acquisition MCU performing ADC sampling, comparator-based threshold detection, and USB/HID report generation.

Use Value: 12-bit ADC with internal bandgap reference ensures stable measurement accuracy; LVD interrupt triggers graceful shutdown before battery depletion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08DN32CLC32 KB Flash, same peripherals and package; higher code density margin for complex LIN stacks or bootloader + app partitioningPreferred where firmware growth risk exists or dual-bank OTA update capability is requiredSelect when >16 KB Flash headroom needed without changing PCB layout or toolchain
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core; 128 KB Flash, 16 KB RAM, higher performance but different architecture and toolchainTargeting next-gen designs requiring RTOS, USB, or floating-point math not feasible on HCS08Choose for migration path beyond 8-bit constraints; requires full firmware rewrite and new debug infrastructure

Compared with MC9S08DN32CLC, the MC9S08DN16CLC trades Flash capacity for cost-sensitive volume production; versus S9KEAZ128AMLH, it retains legacy toolchain compatibility and deterministic 8-bit real-time behavior at lower power and BOM cost.

Availability

MC9S08DN16CLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control panels, and medical handheld diagnostics requiring stable component supply across long product lifecycles.

Supply support for MC9S08DN16CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.

The MC9S08DN16CLC belongs to the HCS08 DN-series - designed specifically for cost-optimized, low-power automotive and industrial control applications requiring integrated analog peripherals, robust EMC performance, and long-term supply assurance.

FAQ

What is the maximum operating frequency of the MC9S08DN16CLC CPU and bus?

The MC9S08DN16CLC features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding maximum bus clock frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full industrial temperature range (–40°C to +85°C) and supply voltage (2.7–5.5 V). The MC9S08DN16CLC datasheet specifies these values in Section 8.1.1 and Appendix A.

Does the MC9S08DN16CLC support LIN 2.0 communication natively?

Yes, the MC9S08DN16CLC includes SCI1 hardware that fully supports LIN 2.0 Protocol and SAE J2602 compliance. It provides dedicated features including master extended break generation, slave extended break detection, and wakeup on active edge - all implemented in hardware without CPU intervention. These capabilities are documented in Section 13 of the MC9S08DN16CLC datasheet and require no external transceiver for basic node operation.

How much EEPROM does the MC9S08DN16CLC provide, and what are its endurance specifications?

The MC9S08DN16CLC integrates 2 KB of on-chip EEPROM with in-circuit programmability. It supports 4-byte dual-page or 8-byte single-page erase sectors and guarantees a minimum of 100,000 erase/write cycles per sector. Erase abort functionality allows interruption of ongoing operations, and program/erase can occur while executing Flash code. These characteristics are specified in Section 4.5 of the MC9S08DN16CLC datasheet.

What low-power modes are available on the MC9S08DN16CLC, and which peripherals remain active in Stop3 mode?

The MC9S08DN16CLC offers Stop3, Stop2, Wait, and Run modes. In Stop3 mode - the deepest sleep state - only the Real-Time Interrupt (RTI) module, Low-Voltage Detect (LVD), and internal 1-kHz COP clock remain active. All other clocks are gated, CPU and peripherals halt, yet RTC and RTI retain functionality for timed wake-up. This behavior is detailed in Section 3.6.1 and Table 3-2 of the MC9S08DN16CLC datasheet.

Is the MC9S08DN16CLC pin-compatible with other members of the DN-series such as MC9S08DN32CLC or MC9S08DN48CLC?

Yes, the MC9S08DN16CLC in the 48-pin LQFP package shares identical pinout, electrical characteristics, and peripheral mapping with MC9S08DN32CLC and MC9S08DN48CLC in the same package variant. This allows direct substitution in existing designs where Flash size requirements permit - confirmed by Freescale's MC9S08DN60 Series Data Sheet Rev 3, Section 1.1 and Appendix C mechanical drawings.

MC9S08DN16CLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DN16CLC FAQ

1.How can I place an order for MC9S08DN16CLC through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DN16CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DN16CLC reliable?

The price and inventory of MC9S08DN16CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN16CLC is usually 5 days.

3.What payment methods are accepted for MC9S08DN16CLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN16CLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DN16CLC?

MC9S08DN16CLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DN16CLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DN16CLC?

For technical support, including MC9S08DN16CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN16CLC requirements.

6.How does Aetrix verify that MC9S08DN16CLC is sourced from the original manufacturer or authorized distributors?

All MC9S08DN16CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN16CLC meets industry standards.

7.What is the process for return or replacement of MC9S08DN16CLC?

All MC9S08DN16CLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN16CLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DN16CLC part is unused and in its original packaging.

Return procedure for MC9S08DN16CLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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