NXP Semiconductors MC9S08DN16MLF
- Part No.:
- MC9S08DN16MLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S08DN16MLF.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08DN16MLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM. It features a 40-MHz CPU core (20-MHz bus), 12-bit 16-channel ADC, dual analog comparators, SPI/I²C/SCI interfaces, two TPM modules (6+2 channels), RTC, and real-time interrupt capability. It targets low-power industrial control and sensor interface applications requiring deterministic timing and robust system protection.
For engineers reviewing the MC9S08DN16MLF datasheet, MC9S08DN16MLF pinout, MC9S08DN16MLF application, or MC9S08DN16MLF equivalent, key selection criteria include Flash size (16 KB), EEPROM endurance (100K erase/write cycles), 53 GPIO with configurable slew rate and pull devices, single-wire background debug support, and compatibility with LIN 2.0 and SAE J2602 protocols via SCI1.
Technical Context
The MC9S08DN16MLF implements the HCS08 CPUV3 core with HC08 instruction set extension including BGND for debug entry. Its Multi-Purpose Clock Generator (MCG) supports FLL (±1.5% accuracy with internal temperature compensation) and PLL modes, plus factory-trimmed internal reference clock with stored trim value in Flash.
System-level protection includes COP watchdog with dual-clock source (1 kHz internal or bus clock), low-voltage detect with reset/interrupt options, illegal opcode/address detection, Flash block protect, and loss-of-lock monitoring - all designed for reliable operation in automotive-adjacent and industrial environments without external supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU running at 40 MHz (20 MHz bus); executes HC08 ISA + BGND instruction |
| Flash Memory | 16 KB on-chip Flash with read/program/erase over full voltage/temperature range; supports program/erase while executing |
| EEPROM | 2 KB in-circuit programmable EEPROM; 8-byte single-page or 4-byte dual-page erase sectors |
| ADC | 12-bit, 16-channel SAR ADC with 2.5 μs conversion time; includes internal bandgap reference and temperature sensor channel |
| Timers | TPM1 (6-channel) and TPM2 (2-channel); each supports input capture, output compare, and edge-aligned PWM |
| Clock Sources | XOSC (31.25 kHz–16 MHz crystal/resonator) + MCG with FLL/PLL; internal 1 kHz RTC oscillator for wake-up in Stop modes |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all inputs have hysteresis and configurable pull; outputs support slew rate and drive strength control |
Pinout & Package
MC9S08DN16MLF is housed in a 48-pin LQFP package (7×7 mm, 0.5 mm pitch), compatible with standard surface-mount reflow processes. Pin assignments follow Freescale's MC9S08DNxx series layout per Data Sheet Rev 3 (2008), Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply domains: VDD (core/analog I/O), VSS (digital/analog ground); decoupling required per Section 2.2.1 |
| XTAL, EXTAL | Crystal/resonator connection | Connects to external 31.25 kHz–16 MHz crystal or ceramic resonator for XOSC clock source |
| RESET | Active-low reset input | Asynchronous reset assertion; internal pull-up; supports external reset generator or manual push-button |
| BKGD/MS | Single-wire background debug | Shared pin for debug communication and mode selection; requires open-drain driver for multi-drop BDM |
| VREFH/VREFL | ADC reference inputs | Accept external reference or connect to internal bandgap; define full-scale ADC conversion range |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 GPIO grouped into Ports A–G; individually configurable as digital input/output or peripheral function (SCI, SPI, TPM, etc.) |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt (RTI) | Enables cyclic wake-up from Run, Wait, or Stop modes using internal 1 kHz oscillator - no external crystal needed for low-power scheduling |
| Flash security | Block protection and flash security byte prevent unauthorized read-out or reprogramming - essential for firmware IP protection in deployed systems |
| LIN 2.0 & J2602 support | SCI1 hardware implements master extended break generation and slave extended break detection - eliminates software overhead for LIN physical layer compliance |
| In-circuit EEPROM | 2 KB EEPROM supports field updates of calibration data or configuration parameters without requiring Flash reprogramming or system reset |
| Low-power stop modes | Stop2 and Stop3 modes draw sub-1 µA current while retaining RAM and register contents - suitable for battery-powered sensor nodes with long sleep intervals |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Brushless DC motor commutation in HVAC blowers or power seat actuators using Hall-effect feedback. IC Role / Device Role / Timing Role: MCU executes closed-loop speed control, drives gate drivers via PWM outputs, and monitors current/voltage via ADC. Use Value: TPM1's 6-channel PWM with dead-time insertion and synchronized ADC sampling enables precise phase current measurement and torque ripple reduction. | Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN communication to body controller. IC Role / Device Role / Timing Role: LIN slave node managing local I/O, executing diagnostics, and relaying commands over SCI1. Use Value: Hardware LIN 2.0 support ensures protocol-compliant timing and error handling without CPU intervention, reducing firmware complexity and jitter. |
| Smart Sensor Node | Medical Diagnostic Equipment |
Use Scenario: Battery-powered environmental sensor (temp/humidity/pressure) transmitting data via UART to gateway. IC Role / Device Role / Timing Role: Low-power MCU acquires analog sensor signals, performs basic filtering, and manages wireless link duty cycling. Use Value: Real-time interrupt wake-up from Stop3 mode every 100 ms allows 99.9% duty-cycled operation while maintaining accurate time-stamped measurements. | Use Scenario: Portable blood glucose meter requiring precision analog front-end and secure calibration storage. IC Role / Device Role / Timing Role: ADC reads electrochemical sensor output; EEPROM stores factory calibration coefficients and usage logs. Use Value: 12-bit ADC with internal bandgap reference and temperature sensor enables <±1°C accuracy across operating temperature without external components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DN16F1MLF | Same die, newer mask set; adds enhanced ESD rating (±8 kV HBM) and updated MCG initialization sequence per Rev 4 errata | Identical peripheral set and memory map; validated for higher-reliability automotive interiors (e.g., HVAC controls) | Select when AEC-Q100 Grade 2 qualification or improved ESD robustness is required; pin-compatible with MC9S08DN16MLF |
| MC9RS08LA8CP | RS08 core (simpler ISA, lower code density); 8 KB Flash, 512 B RAM; no EEPROM; single TPM (2-channel) | Limited peripheral count and memory; lacks LIN support and RTC; intended for cost-sensitive, low-complexity functions | Choose only for non-LIN, non-RTC applications where BOM cost is critical and firmware fits within 8 KB Flash |
Compared with S9S08DN16F1MLF and MC9RS08LA8CP, the MC9S08DN16MLF offers balanced performance for mid-tier embedded control: sufficient Flash and EEPROM for field-updatable firmware, LIN-ready SCI, and real-time interrupt capability - making it optimal for applications needing protocol compliance, data logging, and low-power scheduling without RS08's architectural constraints or F1MLF's qualification overhead.
Availability
MC9S08DN16MLF is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart sensor nodes, and portable medical diagnostics requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08DN16MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications. Formerly Freescale Semiconductor, it acquired the HCS08 portfolio in 2015.
The MC9S08DNxx family was designed for cost-effective, low-power embedded control in automotive body electronics and industrial automation - emphasizing robust clocking, integrated analog peripherals, and debug-friendly architecture for rapid development.
FAQ
What is the maximum operating frequency of the MC9S08DN16MLF CPU core?
The MC9S08DN16MLF CPU core operates at up to 40 MHz, delivering a 20-MHz bus frequency. This is achieved via the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode. The core maintains full instruction execution integrity at this speed across its specified voltage (2.7–5.5 V) and temperature (−40°C to +105°C) range, as verified in Freescale's MC9S08DN60 Series Data Sheet Rev 3, Section 8.4.1.
Does the MC9S08DN16MLF support LIN 2.0 communication natively?
Yes, the MC9S08DN16MLF supports LIN 2.0 natively through its SCI1 peripheral. Hardware features include master extended break generation and slave extended break detection, enabling compliant physical layer timing without CPU overhead. This capability is documented in Section 13 of the MC9S08DN60 Series Data Sheet Rev 3 and applies identically to the MC9S08DN16MLF variant.
How much EEPROM does the MC9S08DN16MLF include, and what is its erase granularity?
The MC9S08DN16MLF includes 2 KB of in-circuit programmable EEPROM. Erase operations are performed in sectors: 8-byte single-page erase or 4-byte dual-page erase. This fine-grained granularity allows efficient updates of small calibration or configuration records without disturbing adjacent data, as specified in Section 4.5.2 of the official datasheet.
Can the MC9S08DN16MLF operate from internal clock sources only - without an external crystal?
Yes, the MC9S08DN16MLF can operate entirely from internal clock sources. Its MCG supports FLL mode using the factory-trimmed internal reference clock (IRC), and the RTC module includes a dedicated 1 kHz low-power oscillator for wake-up during Stop modes. External crystals are optional and used only when higher accuracy or specific frequency requirements apply.
What debug interface does the MC9S08DN16MLF provide, and what hardware is required?
The MC9S08DN16MLF provides a single-wire background debug (BDM) interface via the BKGD/MS pin. Debugging requires a compatible BDM pod (e.g., P&E Micro USB-ML-12 or Cyclone Universal) and OpenSDA-compatible toolchain. No additional pins or level-shifting circuitry are needed - the interface uses open-drain signaling and shares the BKGD pin with mode selection functionality.
MC9S08DN16MLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DN16MLF FAQ
1.How can I place an order for MC9S08DN16MLF through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DN16MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DN16MLF reliable?
The price and inventory of MC9S08DN16MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN16MLF is usually 5 days.
3.What payment methods are accepted for MC9S08DN16MLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN16MLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DN16MLF?
MC9S08DN16MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DN16MLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DN16MLF?
For technical support, including MC9S08DN16MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN16MLF requirements.
6.How does Aetrix verify that MC9S08DN16MLF is sourced from the original manufacturer or authorized distributors?
All MC9S08DN16MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN16MLF meets industry standards.
7.What is the process for return or replacement of MC9S08DN16MLF?
All MC9S08DN16MLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN16MLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DN16MLF part is unused and in its original packaging.
Return procedure for MC9S08DN16MLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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