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NXP Semiconductors MC9S08DN32AMLC
- Part No.:
- MC9S08DN32AMLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DN32AMLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,415
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Product details
Overview
MC9S08DN32AMLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB RAM, and 2 KB EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC12 (12-bit, 16-channel), dual analog comparators, SCI with LIN 2.0 support, SPI, I²C, two TPM modules (6+2 channels), RTC, and real-time interrupt capability - deployed in automotive body control modules and industrial sensor nodes.
For engineers reviewing the MC9S08DN32AMLC datasheet, MC9S08DN32AMLC pinout, MC9S08DN32AMLC application, or MC9S08DN32AMLC equivalent, key selection criteria include Flash size (32 KB), EEPROM endurance (100K erase/write cycles), 53 GPIO with configurable slew rate and hysteresis, and support for Stop3/Stop2 low-power modes with RTC wake-up - critical for battery-powered embedded control.
Technical Context
The MC9S08DN32AMLC implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and single-wire background debug. Its MCG module provides FLL and PLL clock generation with ±1.5% accuracy using internal temperature-compensated reference, factory-trimmed and stored in Flash.
Peripherals include a 12-bit ADC with 2.5 μs conversion time, automatic compare, and integrated temperature sensor; dual ACMPs with edge-selectable interrupts and bandgap reference option; and SCI1 compliant with LIN 2.0 and SAE J2602 - enabling robust serial communication in noisy automotive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3, 40-MHz max CPU clock (20-MHz bus) |
| Flash Memory | 32 KB on-chip Flash with program/erase over full voltage/temperature range |
| RAM / EEPROM | 2 KB RAM; 2 KB EEPROM with 4-/8-byte sector erase and program-while-execute capability |
| ADC | 12-bit resolution, 16-channel, 2.5 μs conversion time, internal bandgap and temperature sensor channels |
| Timers | TPM1 (6-channel) and TPM2 (2-channel) supporting input capture, output compare, and edge-aligned PWM |
| Low-Power Modes | Stop3, Stop2, Wait, and Real-Time Interrupt wake-up from all modes using 1-kHz internal oscillator |
| Communication | SCI1 (LIN 2.0/J2602), SPI (master/slave, double-buffered), I²C (100 kbps, multi-master) |
Pinout & Package
MC9S08DN32AMLC is housed in a 32-pin LQFP (7×7 mm) package with 29 general-purpose I/O pins, 4 dedicated analog inputs (AD0–AD3), VDD/VSS power rails, reset (RESET), background debug (BKGD/MS), and oscillator connections (XTAL/EXTAL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Asynchronous hardware reset; internal pull-up; compatible with open-drain external reset supervisors |
| BKGD/MS | Single-wire background debug / mode select | Enables on-chip debugging and programming without dedicated JTAG pins; bidirectional, 5-V tolerant |
| VDD, VSS | Core power supply and ground | Separate analog/digital power domains not implemented; single 2.7–5.5 V supply supports mixed-signal operation |
| XTAL / EXTAL | Crystal/resonator oscillator terminals | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; internal load capacitors eliminate need for external caps in many designs |
| AD0–AD3 | Analog input channels | Dedicated pins for ADC; share functions with Port A; support internal temperature sensor and bandgap reference routing |
Key Features
| Feature | Design Value |
|---|---|
| Flash security and protection | Block-level flash protection and security byte prevent unauthorized read-out or reprogramming of firmware |
| Real-time interrupt (RTI) | Free-running 1-kHz internal oscillator enables periodic wake-up from Stop/Wait modes without external crystal or timing components |
| Configurable I/O drive strength | Output pins support selectable drive strength and slew rate - reduces EMI and improves signal integrity on long PCB traces |
| Low-voltage detection (LVD) | Programmable trip points (2.5 V, 2.7 V, 3.0 V, 3.3 V) with reset or interrupt output - prevents erratic operation during brownout conditions |
| On-chip COP watchdog | Watchdog timer with independent 1-kHz internal clock source ensures reliable recovery even if main clock fails |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main system MCU executing real-time control logic, managing LIN communication with slave actuators, and monitoring switch inputs via GPIO with interrupt-on-change. Use Value: Integrated LIN-compliant SCI, 32 KB Flash for feature-rich firmware, and Stop3 mode with RTI wake-up enable <10 μA sleep current - extending battery life during vehicle standby. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in remote industrial facilities. IC Role / Device Role / Timing Role: Data acquisition controller interfacing with analog sensors via ADC12 and digital sensors via I²C, logging to EEPROM, and transmitting via UART to gateway. Use Value: On-chip temperature sensor + 12-bit ADC eliminates external sensing ICs; 2 KB EEPROM stores calibration data and event logs; RTC + RTI enables precise time-stamped sampling intervals without external timing circuitry. |
| Home Appliance Motor Control | Medical Diagnostic Handheld |
Use Scenario: Fan speed regulation and safety interlock monitoring in HVAC systems and kitchen appliances. IC Role / Device Role / Timing Role: Dedicated motor control MCU generating PWM signals via TPM modules, reading hall-effect feedback, and detecting overcurrent via analog comparator thresholds. Use Value: Dual ACMPs with programmable hysteresis detect fault conditions (e.g., stalled motor); buffered edge-aligned PWM ensures clean gate drive; low-power Stop2 mode extends standby duration between operational cycles. | Use Scenario: Portable blood glucose meter or pulse oximeter requiring accurate analog measurement and secure firmware storage. IC Role / Device Role / Timing Role: Signal conditioning and processing unit acquiring analog biosensor outputs, performing calibration math, and storing patient history in protected EEPROM. Use Value: 12-bit ADC with internal bandgap reference achieves ±1 LSB INL across temperature; flash block protection prevents tampering with medical algorithm code; single-wire debug enables field firmware updates without exposing test pads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DN48AMLC | 48 KB Flash, same peripherals and pinout; higher memory headroom for complex control algorithms | Suitable where firmware size exceeds 32 KB or future feature expansion is planned | Select when additional Flash and EEPROM capacity is required without changing PCB layout |
| S9S08DN32F1MLC | NXP rebranded version with identical architecture, Flash/RAM/EEPROM, and qualification (AEC-Q100 Grade 2) | Same functional and electrical behavior; intended for automotive production programs requiring updated part numbering | Preferred for new automotive designs requiring current NXP part numbering and lifecycle support |
Compared with MC9S08DN32AMLC, MC9S08DN48AMLC offers +16 KB Flash for larger firmware images while retaining identical peripheral sets and power profiles; S9S08DN32F1MLC provides identical functionality under NXP's current automotive part numbering scheme, ensuring long-term supply continuity and AEC-Q100 compliance documentation.
Availability
MC9S08DN32AMLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor control, and portable medical diagnostics requiring stable component supply across extended product lifecycles.
Supply support for MC9S08DN32AMLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DN series was designed as cost-optimized, AEC-Q100 qualified 8-bit microcontrollers targeting body electronics, sensor interfaces, and distributed control units where deterministic real-time response and low-power operation are essential.
FAQ
What is the maximum operating frequency of the MC9S08DN32AMLC CPU core?
The MC9S08DN32AMLC features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus clock. This frequency is achievable across the full industrial temperature range (–40°C to +105°C) and supply voltage range (2.7 V to 5.5 V), with timing validated per Freescale's Rev 3 datasheet. The MC9S08DN32AMLC uses internal clock generation via its MCG module to derive stable system clocks without external high-frequency oscillators.
Does the MC9S08DN32AMLC support LIN 2.0 communication natively?
Yes, the MC9S08DN32AMLC includes SCI1 hardware that fully supports LIN 2.0 protocol and SAE J2602 conformance, including master extended break generation and slave extended break detection. This capability is implemented in silicon and does not require software emulation. The MC9S08DN32AMLC's SCI module also supports standard UART/NRZ framing, making it suitable for both LIN network nodes and generic serial communication tasks.
How much EEPROM endurance does the MC9S08DN32AMLC provide?
The MC9S08DN32AMLC guarantees 100,000 erase/write cycles for its 2 KB on-chip EEPROM, with 4-byte dual-page or 8-byte single-page erase sectors. Erase operations can be aborted, and program/erase functions operate independently of CPU execution - enabling firmware updates or data logging while application code runs. This endurance rating is specified across the full operating temperature and voltage range and is validated per Freescale's characterization data.
What low-power modes are available on the MC9S08DN32AMLC?
The MC9S08DN32AMLC supports three primary low-power modes: Wait (reduced power), Stop2 (very low power), and Stop3 (ultra-low power). All modes retain RAM and register contents. Stop3 draws less than 10 μA typical with RTI enabled, using the internal 1-kHz oscillator for wake-up - eliminating need for external timing components. These modes are controlled via SPMSC1/SPMSC2 registers and are fully documented in Chapter 3 of the MC9S08DN32AMLC datasheet.
Is the MC9S08DN32AMLC pin-compatible with other devices in the DN-series?
The MC9S08DN32AMLC in the 32-pin LQFP package shares identical pinout with MC9S08DN16AMLC and MC9S08DN48AMLC in the same 32-pin variant, including function mapping for RESET, BKGD/MS, XTAL/EXTAL, ADC inputs, and GPIO. However, it is not pin-compatible with 48-pin or 64-pin DN-series variants due to differing pin counts and peripheral routing. Always verify package-specific pin assignments using Freescale's MC9S08DN60 Series Data Sheet, Section 2.1.
MC9S08DN32AMLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 1.5K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DN32AMLC FAQ
1.How can I place an order for MC9S08DN32AMLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DN32AMLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DN32AMLC reliable?
The price and inventory of MC9S08DN32AMLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN32AMLC is usually 5 days.
3.What payment methods are accepted for MC9S08DN32AMLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN32AMLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DN32AMLC?
MC9S08DN32AMLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DN32AMLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DN32AMLC?
For technical support, including MC9S08DN32AMLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN32AMLC requirements.
6.How does Aetrix verify that MC9S08DN32AMLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DN32AMLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN32AMLC meets industry standards.
7.What is the process for return or replacement of MC9S08DN32AMLC?
All MC9S08DN32AMLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN32AMLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DN32AMLC part is unused and in its original packaging.
Return procedure for MC9S08DN32AMLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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