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NXP Semiconductors MC9S08DN32AMLF

Part No.:
MC9S08DN32AMLF
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixMC9S08DN32AMLF.pdf
Description:
IC MCU 8BIT 32KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,017

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Product details

Overview

MC9S08DN32AMLF from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 2 KB RAM, and 2 KB EEPROM, featuring a 40-MHz CPU core (20-MHz bus), integrated 12-bit ADC, dual analog comparators, SCI with LIN 2.0 support, SPI, I²C, two TPM modules, RTC, and real-time interrupt capability. It targets automotive body electronics and industrial control systems requiring robust on-chip memory and mixed-signal peripherals.

For engineers reviewing the MC9S08DN32AMLF datasheet, MC9S08DN32AMLF pinout, MC9S08DN32AMLF application, or MC9S08DN32AMLF equivalent, key selection criteria include flash/EEPROM size, 12-bit ADC channel count and conversion time, LIN-capable SCI interface, low-power stop modes, and LQFP-48 package compatibility for space-constrained automotive modules.

Technical Context

The MC9S08DN32AMLF implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.

On-chip peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and internal temperature sensor, two analog comparators with bandgap reference option, one LIN 2.0–compliant SCI, full-duplex SPI with double buffering, I²C at up to 100 kbps, and two Timer Pulse-Width Modulators (TPM1: 6-channel; TPM2: 2-channel) supporting input capture, output compare, and PWM generation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core, 40-MHz operation (20-MHz bus speed); enables deterministic real-time control in cost-sensitive embedded applications.
Flash Memory32 KB on-chip flash with read/program/erase over full voltage/temperature range; supports in-circuit reprogramming and flash block protection.
RAM / EEPROM2 KB RAM for runtime variables; 2 KB EEPROM with 4-/8-byte erase sectors and program/erase while executing flash - critical for data logging and calibration storage.
ADC16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor, and automatic compare function - suitable for precision sensor interfacing without external signal conditioning.
CommunicationSCI with LIN 2.0/SAE J2602 compliance, SPI (master/slave, double-buffered), and I²C (100 kbps, multi-master) - enables interoperability in automotive sub-networks and sensor hubs.
Power ModesTwo very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and 1-kHz real-time interrupt - extends battery life in always-on vehicle modules like door controllers.

Pinout & Package

MC9S08DN32AMLF is packaged in a 48-pin LQFP (7×7 mm, 0.5 mm pitch), with 53 general-purpose I/O pins and 1 dedicated input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength; 24 pins support edge-selectable interrupts.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD (core/digital I/O), VSS (digital ground); separate analog supply (VDDAD/VSSAD) required for ADC/ACMP noise immunity.
VREFH / VREFLAnalog reference inputsExternal or internal (bandgap) reference selection for ADC and ACMP; enables ratiometric measurements and stable threshold detection.
XTAL / EXTALCrystal oscillator terminalsSupports 1–16 MHz crystal or ceramic resonator; feeds MCG module for precise system clock generation and RTC timebase.
PTA0–PTA7Port A I/O8-bit general-purpose port with interrupt capability on all pins; used for GPIO, SCI TX/RX, SPI signals, or TPM channels depending on multiplexing configuration.
PTB0–PTB7Port B I/O8-bit port supporting ADC channel inputs (AD0–AD7), I²C SCL/SDA, and TPM1/TPM2 functions - enables compact analog + communication integration.
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset supervisor or microcontroller-initiated reset via COP watchdog timeout.
BKGD/MSBackground debug / mode selectSingle-wire debug interface pin; also selects active background mode during reset - eliminates need for JTAG header in production PCB layout.

Key Features

FeatureDesign Value
Integrated LIN 2.0 SCIEnables direct connection to automotive LIN networks without external transceiver for slave-node applications like mirror controls or seat position sensors.
In-circuit programmable EEPROM2 KB EEPROM with 4-byte dual-page erase allows fine-grained nonvolatile storage of calibration data, fault logs, or user settings without flash wear leveling overhead.
Real-time interrupt in Stop mode1-kHz internal oscillator drives RTC wake-up events during Stop2/Stop3, enabling periodic sensor polling or CAN/LIN message scheduling without external timing components.
Factory-trimmed internal reference clockMCG's internal reference clock trimmed at factory and stored in flash; achieves ±1.5% FLL accuracy across temperature - reduces BOM cost vs. external crystal in non-RTC applications.
ADC with temperature sensorOn-die temperature sensor channel (AD15) provides system thermal monitoring with ±3°C accuracy - supports thermal derating in motor drivers or power supplies.

Applications

Automotive Door ModuleIndustrial Motor Controller

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU managing LIN slave communication, ADC-based switch debouncing, PWM-driven mirror actuators, and real-time lock timing sequences.

Use Value: Integrated LIN SCI eliminates external transceiver; 32 KB flash accommodates OEM-specific diagnostics and calibration tables; Stop-mode RTC enables timed window auto-reverse logic.

Use Scenario: Closed-loop speed/torque control of BLDC or stepper motors in HVAC blowers, pumps, and conveyors.

IC Role / Device Role / Timing Role: Real-time motor commutation controller using TPM-generated PWM, ADC feedback from current shunt and thermistor, and SCI for host command interface.

Use Value: 12-bit ADC with 2.5 μs conversion ensures fast current loop sampling; dual ACMPs enable overcurrent shutdown with <1 μs response; EEPROM stores motor profile parameters across power cycles.

Smart Lighting NodeEnergy Meter Sensor Interface

Use Scenario: DALI or 0–10 V dimmable LED driver with ambient light sensing and thermal foldback.

IC Role / Device Role / Timing Role: Peripheral manager interfacing photodiode ADC, thermal sensor, PWM dimming outputs, and I²C to master controller.

Use Value: 16-channel ADC supports multiple light/temperature zones; I²C slave mode enables centralized configuration; low-power Stop modes extend battery life in wireless nodes.

Use Scenario: Front-end acquisition for residential/utility energy meters measuring voltage, current, and neutral leakage.

IC Role / Device Role / Timing Role: Signal conditioner and isolation interface between metrology ADC (e.g., CS5463) and host MCU, handling calibration offset storage and tamper detection.

Use Value: Factory-trimmed internal clock ensures accurate time-stamping of meter events; EEPROM retains calibration coefficients after power loss; ACMPs detect zero-crossing for phase alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DN32F1MLFSame die, but with Flash security enabled by default and different mask set revision; identical pinout, memory map, and peripheral set.No functional difference in LIN, ADC, or timer usage; differs only in flash security boot behavior and factory programming defaults.Select S9S08DN32F1MLF when flash security enforcement is required at power-on; otherwise MC9S08DN32AMLF offers standard unsecured boot for development and field updates.
MC9S08DZ32CLC44-pin LQFP package; same 32 KB flash, 2 KB RAM/EEPROM, and HCS08 core, but lacks RTC and has only one TPM (6-channel) instead of two.Not suitable for RTC-dependent applications (e.g., scheduled wake-up); fewer I/O and no second TPM limits multi-motor or dual PWM channel use.Choose MC9S08DZ32CLC only for space-constrained designs where RTC and dual TPM are unnecessary and 44-pin footprint is preferred.

Compared with S9S08DN32F1MLF and MC9S08DZ32CLC, the MC9S08DN32AMLF provides full RTC functionality, dual TPM modules, and standard flash security configuration - making it optimal for automotive body control modules requiring time-triggered operations and independent PWM outputs.

Availability

MC9S08DN32AMLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart lighting nodes, and energy meter sensor interfaces requiring stable component supply, long-term lifecycle support, and automotive-grade qualification.

Supply support for MC9S08DN32AMLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08DN32AMLF belongs to the HCS08 DN-series microcontrollers, designed specifically for cost-sensitive automotive body electronics and industrial control applications requiring integrated LIN, robust EEPROM, and low-power operation.

FAQ

What is the maximum operating frequency of the MC9S08DN32AMLF CPU core?

The MC9S08DN32AMLF features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20-MHz bus clock speed. This frequency is achievable across the full industrial temperature range (–40°C to +105°C) when supplied with 2.7–5.5 V and using appropriate clock source configuration (e.g., MCG in PLL or FLL mode). The MC9S08DN32AMLF datasheet specifies timing parameters consistent with this performance under validated conditions.

Does the MC9S08DN32AMLF support LIN 2.0 protocol natively?

Yes, the MC9S08DN32AMLF includes a dedicated Serial Communications Interface (SCI1) that fully supports LIN 2.0 and SAE J2602 protocols. It provides hardware features including master extended break generation, slave extended break detection, wakeup on active edge, and automatic checksum calculation - enabling compliant LIN slave node implementation without external protocol assist hardware.

How much EEPROM does the MC9S08DN32AMLF have, and what are its erase characteristics?

The MC9S08DN32AMLF integrates 2 KB of on-chip EEPROM with 4-byte dual-page or 8-byte single-page erase sectors. It supports program and erase while executing flash code, and includes erase abort functionality. These characteristics allow reliable storage of calibration data, fault logs, or user preferences with minimal impact on real-time application execution.

What package type and pin count does the MC9S08DN32AMLF use?

The MC9S08DN32AMLF is supplied in a 48-pin low-profile quad flat-pack (LQFP) package measuring 7×7 mm with 0.5 mm lead pitch. This package provides 53 general-purpose I/O pins and 1 input-only pin, with 24 pins supporting configurable edge-selectable interrupts - matching mechanical and thermal requirements for automotive PCB layouts.

Can the MC9S08DN32AMLF operate in low-power modes with RTC functionality active?

Yes, the MC9S08DN32AMLF supports real-time interrupt generation during Stop2 and Stop3 modes using its on-chip 1-kHz low-power oscillator. This allows the RTC to maintain timekeeping and trigger wake-up events without external crystals or power supply changes - essential for battery-powered automotive modules requiring periodic sensor reads or scheduled communications.

MC9S08DN32AMLF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1.5K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DN32AMLF FAQ

1.How can I place an order for MC9S08DN32AMLF through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DN32AMLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DN32AMLF reliable?

The price and inventory of MC9S08DN32AMLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN32AMLF is usually 5 days.

3.What payment methods are accepted for MC9S08DN32AMLF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN32AMLF transactions.

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4.How is shipping managed for MC9S08DN32AMLF?

MC9S08DN32AMLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DN32AMLF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DN32AMLF?

For technical support, including MC9S08DN32AMLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN32AMLF requirements.

6.How does Aetrix verify that MC9S08DN32AMLF is sourced from the original manufacturer or authorized distributors?

All MC9S08DN32AMLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN32AMLF meets industry standards.

7.What is the process for return or replacement of MC9S08DN32AMLF?

All MC9S08DN32AMLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN32AMLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DN32AMLF part is unused and in its original packaging.

Return procedure for MC9S08DN32AMLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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