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NXP Semiconductors MC9S08DN32AMLH
- Part No.:
- MC9S08DN32AMLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DN32AMLH.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,846
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Product details
Overview
MC9S08DN32AMLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM. It features a 40-MHz CPU core (20-MHz bus), 12-bit ADC with temperature sensor, dual analog comparators, LIN-capable SCI, SPI, I²C, two TPM modules (6+2 channels), RTC, and real-time interrupt capability. It targets automotive body electronics and industrial control nodes requiring robust low-power operation.
For engineers reviewing the MC9S08DN32AMLH datasheet, MC9S08DN32AMLH pinout, MC9S08DN32AMLH application, or MC9S08DN32AMLH equivalent, key selection criteria include Flash size (32 KB), 53 GPIO + 1 input-only pin, LQFP-48 package, LIN 2.0/SAE J2602 support, and dual low-power stop modes with RTC wake-up.
Technical Context
The MC9S08DN32AMLH implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.
Peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and automatic compare, two analog comparators with bandgap reference option, and a real-time counter (RTC) with 1 kHz internal oscillator for cyclic wake-up without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3, 40-MHz max core frequency (20-MHz bus) |
| Flash Memory | 32 KB on-chip Flash with program/erase over full voltage/temperature range |
| RAM / EEPROM | 2 KB RAM; 2 KB in-circuit programmable EEPROM with 4–8 byte erase sectors |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, integrated temperature sensor and bandgap reference |
| Timers | TPM1 (6-channel) and TPM2 (2-channel); each supports input capture, output compare, or PWM |
| Communication | SCI1 (LIN 2.0 & SAE J2602 compliant), SPI, I²C (100 kbps), single-wire background debug |
| Power Modes | Run, Wait, Stop2, Stop3; RTC wake-up available in all modes including Stop3 |
Pinout & Package
MC9S08DN32AMLH is housed in a 48-pin LQFP (7×7 mm, 0.5 mm pitch) package with 53 general-purpose I/O pins and 1 dedicated input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal/resonator interface | Supports 31.25 kHz–16 MHz crystals or ceramic resonators for precise clock source |
| BKGD/MS | Background debug and mode select | Single-wire debug interface; also selects active background mode during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset assertion and brown-out detection |
| VREFH/VREFL | Analog reference inputs | External or internal (bandgap) reference selection for ADC and ACMP modules |
| AD0–AD15 | Analog input channels | 16 of 53 GPIO pins multiplexed as ADC inputs; includes dedicated temperature sensor channel |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt with 1 kHz internal oscillator | Enables ultra-low-power periodic wake-up without external crystal or timing components |
| Flash block protection and security | Prevents unauthorized read/write access to Flash memory; supports secure boot and firmware IP protection |
| Program/erase while executing Flash | Allows firmware updates and data logging without halting application code execution |
| Two analog comparators with edge-selectable interrupts | Supports zero-crossing detection, threshold monitoring, and wake-on-event functionality |
| SCI with LIN 2.0 and SAE J2602 compliance | Enables direct integration into automotive body networks without external protocol translation |
Applications
| Automotive Door Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller managing motor drivers, switches, LIN communication to body control module, and local diagnostics. Use Value: Integrated LIN SCI, 32 KB Flash for feature-rich firmware, and RTC wake-up enable deterministic response to driver commands with minimal power draw in standby. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in remote industrial facilities. IC Role / Device Role / Timing Role: Data acquisition and edge-processing node performing ADC sampling, comparator-based event triggering, and scheduled wireless transmission. Use Value: 12-bit ADC with temperature sensor, dual low-power stop modes, and 1 kHz RTC allow sub-μA sleep current and precise wake intervals-extending battery life beyond 5 years. |
| Smart HVAC Actuator | Medical Diagnostic Handset |
Use Scenario: Position-controlled damper or valve actuator in commercial HVAC systems with feedback and fault reporting. IC Role / Device Role / Timing Role: Closed-loop motor controller interfacing with potentiometer feedback, driving H-bridge, and communicating via I²C to central controller. Use Value: Six-channel TPM supports simultaneous PWM generation and input capture for position sensing; 2 KB EEPROM stores calibration offsets and runtime fault logs non-volatilely. | Use Scenario: Portable diagnostic tool measuring skin temperature, pulse oximetry signals, and button-activated test sequences. IC Role / Device Role / Timing Role: Signal conditioning and timing coordinator-synchronizing ADC sampling, comparator thresholds, and display refresh via RTC-triggered interrupts. Use Value: Integrated bandgap reference and temperature sensor ensure clinical-grade measurement stability across operating temperature; 53 GPIO support multi-sensor routing and LED/button interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DN48AMLH | 48 KB Flash, same peripheral set and pinout; identical LQFP-48 package | Supports larger firmware images and more complex state machines without hardware change | Select when future firmware expansion or additional diagnostic/logging features are anticipated |
| S9S08DN32F1MLH | NXP rebranded version with identical silicon; same Flash/RAM/EEPROM, peripherals, and electrical specs | No functional or layout impact; reflects post-Freescale product line consolidation | Preferred for new designs due to active lifecycle status and updated documentation support |
Compared with MC9S08DN32AMLH, MC9S08DN48AMLH offers 16 KB more Flash for enhanced feature sets, while S9S08DN32F1MLH provides identical functionality with ongoing NXP manufacturing and long-term availability assurance-making it the recommended drop-in replacement for continuity planning.
Availability
MC9S08DN32AMLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, HVAC actuators, and portable medical devices requiring stable component supply, long-lifecycle support, and qualified automotive-grade sourcing.
Supply support for MC9S08DN32AMLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DN series was designed by Freescale (now NXP) for cost-sensitive, low-power automotive body electronics and industrial control applications requiring high peripheral integration and robust qualification.
FAQ
What is the maximum operating frequency of the MC9S08DN32AMLH CPU core?
The MC9S08DN32AMLH CPU core operates at up to 40 MHz, with a corresponding 20-MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is fully supported across the device's specified voltage (2.7–5.5 V) and temperature (−40°C to +105°C) ranges per the official datasheet.
Does the MC9S08DN32AMLH support LIN communication natively?
Yes, the MC9S08DN32AMLH includes SCI1 with hardware-level support for LIN 2.0 and SAE J2602 protocols-including master extended break generation and slave extended break detection. This eliminates the need for external LIN transceivers to implement basic LIN node functionality, though a physical-layer transceiver remains required for bus connection.
What package type and pin count does the MC9S08DN32AMLH use?
The MC9S08DN32AMLH uses a 48-pin low-profile quad flat-pack (LQFP) package measuring 7×7 mm with 0.5 mm pitch. This matches the pinout of the MC9S08DN48AMLH and MC9S08DN16AMLH variants, enabling footprint reuse across the DN-series family for scalable design.
Can the MC9S08DN32AMLH perform ADC conversions while in low-power stop mode?
No-ADC conversions are disabled in Stop2 and Stop3 modes. However, the MC9S08DN32AMLH supports ADC operation in Run and Wait modes, and its real-time counter (RTC) with 1 kHz internal oscillator can wake the device from Stop3 to initiate conversions in Run mode, enabling ultra-low average power in duty-cycled sensing applications.
Is there on-chip EEPROM in the MC9S08DN32AMLH, and what are its key characteristics?
Yes, the MC9S08DN32AMLH integrates 2 KB of in-circuit programmable EEPROM. It supports 4-byte dual-page or 8-byte single-page erase sectors, allows program and erase operations while executing Flash code, and includes erase abort capability-enabling reliable data logging and field-updatable calibration storage without application interruption.
MC9S08DN32AMLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 1.5K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DN32AMLH FAQ
1.How can I place an order for MC9S08DN32AMLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DN32AMLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DN32AMLH reliable?
The price and inventory of MC9S08DN32AMLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN32AMLH is usually 5 days.
3.What payment methods are accepted for MC9S08DN32AMLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN32AMLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DN32AMLH?
MC9S08DN32AMLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DN32AMLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DN32AMLH?
For technical support, including MC9S08DN32AMLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN32AMLH requirements.
6.How does Aetrix verify that MC9S08DN32AMLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DN32AMLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN32AMLH meets industry standards.
7.What is the process for return or replacement of MC9S08DN32AMLH?
All MC9S08DN32AMLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN32AMLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DN32AMLH part is unused and in its original packaging.
Return procedure for MC9S08DN32AMLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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