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NXP Semiconductors MC9S08DN60ACLC

Part No.:
MC9S08DN60ACLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08DN60ACLC.pdf
Description:
IC MCU 8BIT 60KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,741

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Product details

Overview

MC9S08DN60ACLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB flash, 2 KB RAM, and 2 KB EEPROM, featuring a 40-MHz CPU core (20-MHz bus), 12-bit ADC with temperature sensor, dual analog comparators, LIN-capable SCI, SPI, I²C, two TPM modules (6+2 channels), RTC, and real-time interrupt capability. It targets automotive body electronics and industrial control systems requiring robust on-chip peripherals and low-power operation.

For engineers reviewing the MC9S08DN60ACLC datasheet, MC9S08DN60ACLC pinout, MC9S08DN60ACLC application, or MC9S08DN60ACLC equivalent, key selection considerations include its 64-pin LQFP package, 53 GPIOs with configurable slew rate and pull devices, integrated MCG clock generator with FLL/PLL modes, and support for Stop2/Stop3 low-power modes with RTC wake-up.

Technical Context

The MC9S08DN60ACLC implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL (±1.5% accuracy with internal temp-compensated reference) and PLL modes, factory-trimmed internal reference, and external crystal/resonator support (31.25 kHz–16 MHz).

Peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and automatic compare, two analog comparators with bandgap reference option, SCI1 compliant with LIN 2.0 and SAE J2602, and dual TPM modules supporting input capture, output compare, and edge-aligned PWM - all operable in Wait and Stop modes with RTC-driven wake-up.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 (S08CPUV3), 40-MHz max core frequency, 20-MHz bus speed - enables deterministic real-time execution at high throughput.
Flash Memory60 KB on-chip flash with read/program/erase over full voltage/temperature range - supports field firmware updates and secure code storage.
RAM / EEPROM2 KB SRAM for runtime variables; 2 KB EEPROM with 4-/8-byte erase sectors - retains critical calibration or configuration data across power cycles.
ADC16-channel, 12-bit resolution, 2.5 μs conversion time, internal bandgap and temperature sensor - enables precise analog monitoring without external components.
Low-Power ModesStop2 and Stop3 modes with RTC wake-up from 1-kHz internal oscillator - achieves sub-μA current draw while maintaining timekeeping and scheduled wake events.
CommunicationSCI1 (LIN 2.0/J2602), SPI (master/slave, double-buffered), I²C (100 kbps, multi-master) - supports mixed-protocol vehicle networks and sensor interfacing.
TimersTPM1 (6-channel) and TPM2 (2-channel) with input capture, output compare, PWM - provides flexible timing, motor control, and signal generation in compact footprint.

Pinout & Package

MC9S08DN60ACLC is housed in a 64-pin LQFP (10×10 mm) package with 53 general-purpose I/O pins and one dedicated input-only pin. All I/Os support configurable pull devices, hysteresis, slew rate, and drive strength; 24 pins support edge-selectable interrupts.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD (core/analog I/O), VSS (digital/analog ground) - require separate decoupling for noise-sensitive ADC and digital logic.
XTAL, EXTALCrystal oscillator inputsSupports 31.25 kHz–16 MHz crystals/resonators for precision clock source - used by MCG for FLL/PLL reference or RTC timing.
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset signals or power-on reset assertion - ensures reliable initialization under brownout or startup conditions.
BKGD/MSBackground debug / mode selectSingle-wire debug interface pin - enables in-circuit programming and real-time emulation without dedicated JTAG pins.
VREFH, VREFLADC reference voltage terminalsDefine 0 V to VREFH range for 12-bit conversions - allow ratiometric or absolute measurement depending on external reference connection.
AD0–AD15Analog input channels16 multiplexed ADC inputs shared with GPIO - enable simultaneous sensor monitoring (e.g., temperature, voltage, current) with minimal external circuitry.

Key Features

FeatureDesign Value
On-chip MCG with FLL + PLLFactory-trimmed internal reference (±1.5% FLL accuracy), external crystal support, and dynamic mode switching - eliminates need for external clock IC while enabling flexible clock tree design.
Real-time interrupt with RTCFree-running 1-kHz internal oscillator powers RTC in Stop2/Stop3 modes - allows periodic wake-up for polling or scheduling without external components or power drain.
Flash security and block protectionProgrammable flash block lock and illegal opcode/address detection - prevents unauthorized code access or execution, meeting basic automotive security requirements.
Single-wire BDM interfaceBackground debug via BKGD/MS pin only - reduces PCB routing complexity and debug connector footprint versus multi-pin JTAG solutions.
Configurable I/O electrical characteristicsPer-pin slew rate, drive strength, and pull-up/pull-down control - optimizes EMI, signal integrity, and power consumption across diverse peripheral interfaces.

Applications

Automotive Body Control Module (BCM)Industrial Motor Drive Interface

Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in 12 V vehicle platforms.

IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol over SCI1, managing PWM-driven motor drivers via TPM outputs, and monitoring switch inputs and sensor feedback via ADC and ACMP.

Use Value: Integrated LIN transceiver support, 53 GPIOs for discrete I/O expansion, and Stop-mode RTC wake-up reduce BOM count and enable ultra-low-power sleep states between user interactions.

Use Scenario: Closed-loop speed/torque control of BLDC or stepper motors in HVAC actuators and valve positioners.

IC Role / Device Role / Timing Role: Real-time PWM generation (TPM1/TPM2), current/voltage sensing (12-bit ADC with 2.5 μs conversion), and fault detection (analog comparators with bandgap reference).

Use Value: Sub-microsecond ADC timing and hardware-triggered conversions synchronize sampling with PWM edges, improving current loop stability without CPU overhead.

Smart Sensor Node with Local Decision LogicEnergy-Efficient Industrial Timer/Sequencer

Use Scenario: Self-contained environmental monitor (temperature, humidity, voltage) with local alarm triggering and data logging to EEPROM.

IC Role / Device Role / Timing Role: Sensor aggregator using ADC and ACMP inputs, local decision engine running on HCS08 core, non-volatile storage manager for calibration and event logs.

Use Value: On-chip 2 KB EEPROM retains sensor offsets and thresholds across power loss; internal temperature sensor eliminates external thermal IC for basic compensation.

Use Scenario: Programmable delay timer, cyclic machine sequencer, or maintenance scheduler in factory equipment with battery backup.

IC Role / Device Role / Timing Role: Precision timebase provider using RTC with external 32.768 kHz crystal, executing timed I/O actions via TPM outputs and waking from Stop3 mode on schedule.

Use Value: RTC operates independently in Stop3 mode with <1 μA current draw - extends battery life for years in maintenance-free deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DN60F1MLCSame core, pin-compatible 64-pin LQFP; updated mask set (post-Rev 3), enhanced ESD rating (±8 kV HBM), and extended temperature range (−40°C to 105°C vs. −40°C to 85°C).Preferred for new designs targeting extended ambient temperatures or higher ESD immunity in automotive cabin modules.Select S9S08DN60F1MLC when operating above 85°C or requiring improved robustness in noisy environments; software compatible but verify flash security register behavior per Rev 4 errata.
MC9S08DZ60CLCSame 60 KB flash, 2 KB RAM, and peripheral set; differs in oscillator range (supports 32 kHz–20 MHz), adds CAN 2.0B module, and uses 64-pin QFP (not LQFP) with different thermal pad layout.Required where CAN bus integration is mandatory (e.g., gateway nodes), but introduces PCB redesign due to package and pinout differences.Choose MC9S08DZ60CLC only if CAN communication is essential; not drop-in replaceable due to CAN pins replacing GPIOs and altered thermal pad geometry.

Compared with MC9S08DN60ACLC, S9S08DN60F1MLC offers extended temperature and ESD specs with identical software and pinout, while MC9S08DZ60CLC adds CAN at the cost of package incompatibility and GPIO reduction - making the former a direct upgrade and the latter a functionally expanded but hardware-incompatible alternative.

Availability

MC9S08DN60ACLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor interface modules, smart sensor nodes, and energy-efficient industrial timers requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08DN60ACLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's MCU heritage.

The MC9S08DN60ACLC belongs to the HCS08 family - designed for cost-sensitive, low-power embedded control in automotive body electronics and industrial systems where reliability, peripheral integration, and debug simplicity are critical.

FAQ

What is the maximum operating frequency of the MC9S08DN60ACLC CPU core?

The MC9S08DN60ACLC features an HCS08 CPU core with a maximum core frequency of 40 MHz, delivering a 20-MHz bus speed. This performance level supports real-time control tasks in automotive and industrial applications while maintaining low power consumption through intelligent clock gating and multiple low-power modes. The MC9S08DN60ACLC achieves this speed using its integrated Multi-Purpose Clock Generator with FLL or PLL configuration.

Does the MC9S08DN60ACLC support LIN communication natively?

Yes, the MC9S08DN60ACLC includes SCI1 hardware that fully supports LIN 2.0 and SAE J2602 protocols, including master extended break generation and slave extended break detection. This enables direct implementation of LIN slave nodes in automotive body control applications without external transceivers or protocol translation layers. The MC9S08DN60ACLC's SCI module handles framing, checksum, and synchronization in hardware, reducing CPU load during network communication.

How much EEPROM memory does the MC9S08DN60ACLC provide, and what are its key endurance characteristics?

The MC9S08DN60ACLC integrates 2 KB of on-chip EEPROM with 4-byte dual-page or 8-byte single-page erase sectors, supporting program and erase operations while executing Flash code. It guarantees 100,000 erase/write cycles and data retention exceeding 10 years at 85°C. This capability allows the MC9S08DN60ACLC to store calibration data, device configuration, or event logs reliably across power cycles without external non-volatile memory.

What low-power modes are available on the MC9S08DN60ACLC, and which peripherals remain active in Stop mode?

The MC9S08DN60ACLC supports two very low-power Stop modes (Stop2 and Stop3), a reduced-power Wait mode, and a real-time interrupt capable of waking from all three. In Stop2/Stop3, the RTC remains active using its 1-kHz internal oscillator, and selected TPM channels can be configured for wake-up on match. The MC9S08DN60ACLC maintains RAM contents and retains peripheral register settings, enabling fast resumption of operation after wake-up without full reinitialization.

Is the MC9S08DN60ACLC pin-compatible with other members of the DN-series, such as the MC9S08DN48ACLC?

No, the MC9S08DN60ACLC is not pin-compatible with lower-density variants like MC9S08DN48ACLC when packaged in the same 64-pin LQFP form factor - although they share identical pinouts, the MC9S08DN60ACLC requires full validation of flash security register usage and EEPROM sector mapping due to differences in memory partitioning. Always consult the specific device's mechanical drawing and register summary, as MC9S08DN60ACLC mask revisions may introduce subtle I/O behavior changes not present in earlier DN-series silicon.

MC9S08DN60ACLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DN60ACLC FAQ

1.How can I place an order for MC9S08DN60ACLC through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DN60ACLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DN60ACLC reliable?

The price and inventory of MC9S08DN60ACLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN60ACLC is usually 5 days.

3.What payment methods are accepted for MC9S08DN60ACLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN60ACLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DN60ACLC?

MC9S08DN60ACLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DN60ACLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DN60ACLC?

For technical support, including MC9S08DN60ACLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN60ACLC requirements.

6.How does Aetrix verify that MC9S08DN60ACLC is sourced from the original manufacturer or authorized distributors?

All MC9S08DN60ACLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN60ACLC meets industry standards.

7.What is the process for return or replacement of MC9S08DN60ACLC?

All MC9S08DN60ACLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN60ACLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DN60ACLC part is unused and in its original packaging.

Return procedure for MC9S08DN60ACLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08DN60ACLC Tags

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