NXP Semiconductors MC9S08DN60ACLH
- Part No.:
- MC9S08DN60ACLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DN60ACLH.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:270
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Product details
Overview
MC9S08DN60ACLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM. It features a 40-MHz CPU core (20-MHz bus), 12-bit ADC with temperature sensor, dual analog comparators, SCI supporting LIN 2.0/J2602, SPI, I²C, two TPM modules (6+2 channels), RTC, and 53 GPIO pins in a 64-pin LQFP package - used in automotive body control modules and industrial sensor nodes.
For engineers reviewing the MC9S08DN60ACLH datasheet, MC9S08DN60ACLH pinout, MC9S08DN60ACLH application, or MC9S08DN60ACLH equivalent, key selection criteria include Flash size, integrated LIN-compliant SCI, real-time interrupt capability in stop modes, and factory-trimmed internal reference clock for stable timing without external crystal.
Technical Context
The MC9S08DN60ACLH implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL (±1.5% deviation with internal temp compensation) and PLL modes, plus factory-trimmed internal reference clock stored in Flash.
Peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and automatic compare, two analog comparators with bandgap reference option, and SCI1 with master/slave extended break generation/detection - all designed for deterministic real-time operation in automotive and industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3 running at 40 MHz (20 MHz bus); executes HC08 ISA with BGND instruction for debug entry. |
| Flash Memory | 60 KB on-chip Flash with read/program/erase over full voltage/temperature range; supports program/erase while executing. |
| RAM / EEPROM | 2 KB SRAM; 2 KB in-circuit programmable EEPROM with 4- or 8-byte erase sectors and erase abort capability. |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time; includes internal temperature sensor and bandgap reference channel. |
| SCI Interface | One LIN 2.0 and SAE J2602–compliant serial interface with master extended break generation and slave wake-up detection. |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt active in run/wait/stop. |
| Package | 64-pin LQFP (10 × 10 mm), lead-free, RoHS-compliant; pin-compatible with MC9S08DN60 series variants in same package option. |
Pinout & Package
MC9S08DN60ACLH is housed in a 64-pin low-profile quad flat-pack (LQFP), 10 mm × 10 mm body, 0.5 mm pitch, exposed pad (EPAD) thermal pad, RoHS-compliant. Pinout validated per Freescale MC9S08DN60 Rev 3 datasheet Section 2.1 (Device Pin Assignment).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDAD | Supply voltage inputs | Digital (VDD), analog (VDDA), and ADC-specific (VDDAD) power rails; require separate decoupling for noise isolation. |
| VSS, VSSA, VSSAD | Ground returns | Digital (VSS), analog (VSSA), and ADC-specific (VSSAD) grounds; must be connected to common ground plane with low-impedance paths. |
| XTAL, EXTAL | Crystal oscillator terminals | Support 1–16 MHz crystals or ceramic resonators; enable precise clock source for RTC and communication timing. |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers and initiates boot sequence; internal pull-up enabled by default. |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; also selects boot mode (internal flash vs. ROM) during reset assertion. |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 configurable GPIO pins with hysteresis, programmable pull devices, slew rate, and drive strength; 24 support edge-selectable interrupts. |
Key Features
| Feature | Design Value |
|---|---|
| Factory-trimmed internal reference clock | Internal 31.25 kHz–16 MHz reference trimmed at factory and stored in Flash - eliminates need for external crystal in cost-sensitive applications. |
| LIN 2.0–compliant SCI | SCI1 supports full LIN 2.0 and SAE J2602 protocols including master break generation and slave wake-up detection - enables direct integration into automotive body networks. |
| Real-time interrupt in Stop modes | RTC-based wake-up interrupt remains active in Stop2/Stop3 - allows sub-μA sleep current with deterministic wake-up timing for battery-powered sensors. |
| On-chip EEPROM with sector erase abort | 2 KB EEPROM supports 4- or 8-byte erase sectors and real-time erase abort - preserves data integrity during unexpected power loss in logging applications. |
| Single-wire background debug | Integrated BDM interface uses BKGD/MS pin only - reduces debug footprint and enables in-system programming without dedicated JTAG header. |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing LIN-slave firmware, managing GPIO-driven actuators, sampling analog sensors (e.g., ambient light, temperature), and coordinating with gateway via LIN. Use Value: Integrated LIN-compliant SCI eliminates external transceiver; factory-trimmed clock ensures timing compliance across temperature; 60 KB Flash accommodates diagnostics and calibration tables. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and vibration in remote factory equipment. IC Role / Device Role / Timing Role: Low-power system controller acquiring sensor data via ADC/comparators, performing local threshold logic, and transmitting alerts over UART or SPI to host MCU. Use Value: Very low-power stop modes with RTC wake-up extend battery life to >5 years; on-chip EEPROM stores calibration offsets and event logs without external memory. |
| Home Appliance Motor Controller | Medical Diagnostic Handheld |
Use Scenario: Brushless DC motor commutation and fault monitoring in washing machine drum drives. IC Role / Device Role / Timing Role: Real-time PWM generator (TPM modules), ADC-based current sensing, and overtemperature protection using internal bandgap and temperature sensor. Use Value: 6-channel TPM supports 3-phase BLDC control with dead-time insertion; 12-bit ADC with 2.5 μs conversion enables fast current-loop sampling at 10 kHz. | Use Scenario: Portable blood glucose meter requiring precise analog front-end, button interface, and LCD driver support. IC Role / Device Role / Timing Role: Signal acquisition MCU interfacing electrochemical sensor, managing user input, driving segment LCD, and storing test history. Use Value: Internal bandgap reference and temperature sensor enable auto-compensation of sensor drift; 53 GPIO support multiplexed LCD segments and tactile buttons without external logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DN60F1CLK | Same core, Flash, RAM, and peripherals; differs in temperature grade (–40°C to +105°C vs. –40°C to +85°C) and packaging (64-pin QFP vs. LQFP). | Qualified for under-hood automotive use; requires validation for extended temperature cycling. | Select when operating beyond 85°C ambient or requiring AEC-Q100 qualification. |
| MC9S08DZ60CLH | Same 60 KB Flash and 64-pin LQFP, but adds CAN 2.0B controller and enhanced ADC trigger flexibility; no LIN SCI. | Targeted at CAN-based chassis networks rather than LIN body networks; lacks LIN protocol hardware acceleration. | Select when CAN bus integration is required and LIN functionality is unnecessary. |
Compared with MC9S08DN60ACLH, S9S08DN60F1CLK offers extended temperature operation at identical peripheral set, while MC9S08DZ60CLH trades LIN support for CAN - making the former ideal for harsh-environment LIN nodes and the latter for CAN-based distributed control where protocol compatibility is critical.
Availability
MC9S08DN60ACLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, home appliance motor controllers, and portable medical diagnostics requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08DN60ACLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08DN60ACLH belongs to the HCS08 family - designed specifically for cost-sensitive, low-power automotive body electronics and industrial control applications requiring LIN compliance, robust analog integration, and extended temperature reliability.
FAQ
What is the maximum operating frequency of the MC9S08DN60ACLH CPU core?
The MC9S08DN60ACLH CPU core operates at up to 40 MHz, with a corresponding 20 MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is fully supported across the device's rated voltage and temperature range per Freescale MC9S08DN60 Rev 3 datasheet Section 8.4.1. The MC9S08DN60ACLH maintains deterministic instruction execution at this speed with zero wait states for Flash access.
Does the MC9S08DN60ACLH support LIN 2.0 communication natively?
Yes, the MC9S08DN60ACLH includes a dedicated SCI module (SCI1) with hardware-level support for LIN 2.0 and SAE J2602 protocols. It provides master extended break generation, slave extended break detection, and wakeup-on-active-edge functionality - all confirmed in the MC9S08DN60 Rev 3 datasheet Section 13. The MC9S08DN60ACLH requires no external LIN transceiver for basic node operation, reducing BOM cost and board space.
What are the power-saving capabilities of the MC9S08DN60ACLH in stop mode?
The MC9S08DN60ACLH supports two very low-power stop modes (Stop2 and Stop3), with typical current consumption below 1 µA in Stop3 when RTC and selected wakeup sources remain active. Real-time interrupt capability persists in both stop modes, enabling deterministic wake-up intervals without external components. These modes are documented in Section 3.6 of the MC9S08DN60 Rev 3 datasheet and validated across the full operating temperature range.
How much Flash and EEPROM memory does the MC9S08DN60ACLH include?
The MC9S08DN60ACLH integrates 60 KB of on-chip Flash memory and 2 KB of in-circuit programmable EEPROM. Flash supports read/program/erase over full voltage and temperature ranges, including program/erase while executing. EEPROM features 4- or 8-byte erase sectors and erase abort capability - all specified in Section 4.5 of the MC9S08DN60 Rev 3 datasheet. The MC9S08DN60ACLH uses SuperFlash® technology licensed from SST.
Is the internal reference clock of the MC9S08DN60ACLH factory-trimmed?
Yes, the MC9S08DN60ACLH includes a factory-trimmed internal reference clock with trim value stored in Flash memory. This enables ±1.5% frequency accuracy over temperature using internal temperature compensation, eliminating the need for an external crystal in many applications. The trimming process and usage are detailed in Section 8.1.1 and Section 8.5.3 of the MC9S08DN60 Rev 3 datasheet. The MC9S08DN60ACLH leverages this feature for reliable clocking in cost-constrained designs.
MC9S08DN60ACLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DN60ACLH FAQ
1.How can I place an order for MC9S08DN60ACLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DN60ACLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DN60ACLH reliable?
The price and inventory of MC9S08DN60ACLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN60ACLH is usually 5 days.
3.What payment methods are accepted for MC9S08DN60ACLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN60ACLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DN60ACLH?
MC9S08DN60ACLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DN60ACLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DN60ACLH?
For technical support, including MC9S08DN60ACLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN60ACLH requirements.
6.How does Aetrix verify that MC9S08DN60ACLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DN60ACLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN60ACLH meets industry standards.
7.What is the process for return or replacement of MC9S08DN60ACLH?
All MC9S08DN60ACLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN60ACLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DN60ACLH part is unused and in its original packaging.
Return procedure for MC9S08DN60ACLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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