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NXP Semiconductors MC9S08DN60AMLF
- Part No.:
- MC9S08DN60AMLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S08DN60AMLF.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,367
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Product details
Overview
MC9S08DN60AMLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC, SPI, I²C, two SCI interfaces (one LIN 2.0–compliant), RTC, dual TPM modules, and analog comparators for embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the MC9S08DN60AMLF datasheet, MC9S08DN60AMLF pinout, MC9S08DN60AMLF application, or MC9S08DN60AMLF equivalent, key selection criteria include Flash size (60 KB), 53 GPIO with configurable slew rate and pull devices, 12-bit 16-channel ADC with temperature sensor, real-time counter with 1 kHz low-power oscillator, and single-wire background debug interface.
Technical Context
The MC9S08DN60AMLF implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and vector redirection. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with internal reference clock trim adjustment stored in Flash, enabling stable 20 MHz bus operation across voltage and temperature.
Peripherals include a 12-bit ADC with 2.5 μs conversion time and automatic compare, two analog comparators with bandgap reference option, one LIN-capable SCI (SAE J2602 compliant), and dual Timer Pulse-Width Modulators (TPM1: 6-channel, TPM2: 2-channel) supporting input capture, output compare, and edge-aligned PWM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3 with BGND instruction; executes HC08 ISA at up to 40 MHz core / 20 MHz bus frequency |
| Flash Memory | 60 KB program Flash with block protection, erase abort, and program/erase while executing |
| RAM & EEPROM | 2 KB SRAM; 2 KB EEPROM with 4-byte dual-page or 8-byte single-page erase sectors |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal bandgap reference, and integrated temperature sensor |
| Timers | TPM1 (6-channel) and TPM2 (2-channel); each supports input capture, output compare, and buffered PWM |
| Communication | SCI1 (LIN 2.0 + SAE J2602), SPI (full-duplex/dual-mode), I²C (100 kbps, multi-master) |
| Real-Time Counter | 8-bit modulus counter with binary/decimal prescaler; runs from external crystal or internal 1 kHz oscillator for wake-up without external components |
Pinout & Package
MC9S08DN60AMLF is housed in a 64-pin LQFP (10 × 10 mm, 0.5 mm pitch) package with 53 general-purpose I/O pins and 1 dedicated input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength; 24 pins support edge-selectable interrupts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD/VSS for digital core; separate VDDAD/VSSAD for analog subsystem |
| XTAL, EXTAL | Clock input/output | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator for XOSC; feeds MCG module |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset assertion and brownout recovery |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects active background mode during reset |
| VREFH, VREFL | ADC reference inputs | Define 0 V to VREFH range for 12-bit conversions; support internal bandgap or external reference |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 GPIO pins mapped across Ports A–G; individually configurable as digital input/output or peripheral function |
Key Features
| Feature | Design Value |
|---|---|
| Low-power stop modes | Two very low-power stop modes (Stop2, Stop3) with RTC wake-up from 1 kHz internal oscillator - enables battery-powered operation without external timing components |
| In-circuit programmable EEPROM | 2 KB EEPROM with 4-byte dual-page erase allows fine-grained nonvolatile data storage and field firmware parameter updates without Flash wear |
| LIN 2.0–compliant SCI | SCI1 supports master extended break generation and slave extended break detection per LIN 2.0 and SAE J2602 - simplifies integration into automotive body networks |
| On-chip debug interface | Single-wire background debug (BDM) enables full-speed debugging, flash programming, and real-time bus capture without dedicated debug pins |
| System protection | Watchdog (COP) with backup 1 kHz clock, low-voltage detect with interrupt/reset, illegal opcode/address detection, and Flash block protect - ensures robust operation in harsh environments |
Applications
| Automotive Body Control | Industrial Sensor Node |
|---|---|
Use Scenario: Central body controller managing door locks, window lifts, lighting, and mirror controls in 12 V vehicle systems. IC Role / Device Role / Timing Role: Main MCU executing real-time control logic, LIN communication with slave nodes, and ADC-based sensor monitoring (e.g., ambient light, temperature). Use Value: 60 KB Flash accommodates complex state machines and LIN protocol stack; RTC enables timed wake-up for periodic diagnostics without external RTC IC. | Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and voltage in factory automation. IC Role / Device Role / Timing Role: System-on-chip controller handling sensor acquisition via 12-bit ADC, local decision-making, and SPI/I²C peripheral interfacing. Use Value: 2 KB EEPROM stores calibration coefficients and event logs; Stop3 mode with 1 kHz RTC wake-up extends battery life beyond 5 years. |
| Smart Actuator Module | Home Appliance Control |
Use Scenario: Motorized HVAC damper actuator requiring precise position feedback and closed-loop PWM control. IC Role / Device Role / Timing Role: Real-time motion controller using TPM PWM outputs, quadrature encoder input capture, and analog comparator for end-stop detection. Use Value: Dual TPM modules provide independent 6-channel and 2-channel timer resources - eliminates need for external timers or FPGA glue logic. | Use Scenario: Washing machine main control board managing motor drive, water level sensing, and user interface. IC Role / Device Role / Timing Role: Primary MCU coordinating serial communication (SCI to display), ADC-based pressure/temperature sensing, and relay/LED driver outputs. Use Value: 53 GPIO with configurable drive strength directly interface diverse loads (relays, LEDs, optocouplers); hysteresis prevents noise-induced glitches on input lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DN60F1MLF | Same die, newer mask revision (F1 vs A); identical Flash/RAM/peripherals; updated electrical specs per Rev 3 DS | No functional difference; qualified for same automotive temp grade (−40°C to 105°C) | Select S9S08DN60F1MLF for new designs requiring latest production mask and documented jitter spec improvements |
| MC9S08DZ60CLH | 64-pin LQFP variant with CAN 2.0B controller instead of second SCI; same 60 KB Flash, 2 KB RAM, and ADC | Requires CAN physical layer (transceiver) but removes need for external CAN controller; not LIN-optimized | Choose MC9S08DZ60CLH when CAN bus integration is mandatory and LIN is unnecessary |
Compared with MC9S08DN60AMLF, S9S08DN60F1MLF offers identical functionality with enhanced PLL jitter performance, while MC9S08DZ60CLH trades LIN capability for integrated CAN - making it suitable for distributed control networks where CAN dominates over LIN.
Availability
MC9S08DN60AMLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart actuator modules, and home appliance control systems requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08DN60AMLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08DN60AMLF belongs to the HCS08 8-bit MCU family designed for cost-sensitive, low-power embedded control applications demanding high integration, robust system protection, and automotive-grade reliability.
FAQ
What is the maximum operating frequency of the MC9S08DN60AMLF CPU and bus?
The MC9S08DN60AMLF features an HCS08 CPU core rated for up to 40 MHz operation, with a maximum bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full industrial temperature range (−40°C to 105°C) and supply voltage (2.7–5.5 V). The MC9S08DN60AMLF datasheet specifies these values in Section 8.1.1 and Appendix A.
Does the MC9S08DN60AMLF support LIN 2.0 communication natively?
Yes, the MC9S08DN60AMLF includes SCI1 hardware that fully supports LIN 2.0 Protocol and SAE J2602 compliance, including master extended break generation and slave extended break detection. This capability is implemented in silicon and requires no external transceiver for basic LIN physical layer signaling - though a LIN transceiver is needed for bus-level compliance. The MC9S08DN60AMLF reference manual details register-level configuration in Chapter 13.
How much EEPROM memory does the MC9S08DN60AMLF have, and what are its erase characteristics?
The MC9S08DN60AMLF contains 2 KB of in-circuit programmable EEPROM with dual-page (4-byte) or single-page (8-byte) erase sectors. Erase operations can be aborted, and both program and erase functions operate while Flash code execution continues. These features enable reliable field updates of calibration data or configuration parameters without halting application code. The MC9S08DN60AMLF datasheet documents EEPROM timing and control in Section 4.5.2–4.5.5.
What debug interface does the MC9S08DN60AMLF provide, and how many pins does it require?
The MC9S08DN60AMLF uses a single-wire background debug (BDM) interface accessible via the BKGD/MS pin, requiring only one dedicated signal plus ground. This interface supports full-speed debugging, flash programming, and real-time bus capture without halting the CPU. No additional debug pins or external debug adapter are required - the MC9S08DN60AMLF integrates all necessary debug logic on-die per Chapter 16 of its datasheet.
Is the MC9S08DN60AMLF qualified for automotive temperature ranges?
Yes, the MC9S08DN60AMLF is specified for operation from −40°C to +105°C and is qualified to AEC-Q100 Grade 2 standards for automotive applications. Its design includes low-voltage detection with selectable trip points, COP watchdog with backup clock, and Flash block protection - all critical for under-hood and body-control use cases. The MC9S08DN60AMLF ordering information in Appendix C confirms this qualification.
MC9S08DN60AMLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DN60AMLF FAQ
1.How can I place an order for MC9S08DN60AMLF through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DN60AMLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DN60AMLF reliable?
The price and inventory of MC9S08DN60AMLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN60AMLF is usually 5 days.
3.What payment methods are accepted for MC9S08DN60AMLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN60AMLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DN60AMLF?
MC9S08DN60AMLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DN60AMLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DN60AMLF?
For technical support, including MC9S08DN60AMLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN60AMLF requirements.
6.How does Aetrix verify that MC9S08DN60AMLF is sourced from the original manufacturer or authorized distributors?
All MC9S08DN60AMLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN60AMLF meets industry standards.
7.What is the process for return or replacement of MC9S08DN60AMLF?
All MC9S08DN60AMLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN60AMLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DN60AMLF part is unused and in its original packaging.
Return procedure for MC9S08DN60AMLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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