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NXP Semiconductors MC9S08DN60AMLH

Part No.:
MC9S08DN60AMLH
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixMC9S08DN60AMLH.pdf
Description:
IC MCU 8BIT 60KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,260

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Product details

Overview

MC9S08DN60AMLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC (12-bit, 16-channel), dual analog comparators, SCI with LIN 2.0 support, SPI, I²C, two TPM modules (6+2 channels), RTC, and real-time interrupt capability - deployed in automotive body control modules and industrial sensor nodes.

For engineers reviewing the MC9S08DN60AMLH datasheet, MC9S08DN60AMLH pinout, MC9S08DN60AMLH application, or MC9S08DN60AMLH equivalent, key selection criteria include Flash size (60 KB), 64-pin LQFP package, 53 GPIO + 1 input-only pin, integrated LIN-capable SCI, and dual low-power stop modes with RTC wake-up.

Technical Context

The MC9S08DN60AMLH implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and a dedicated single-wire background debug interface. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal support (1–16 MHz).

Peripherals are tightly coupled to the bus architecture: ADC conversion time is fixed at 2.5 µs; TPM channels support input capture, output compare, and edge-aligned PWM; RTC operates from a free-running 1 kHz on-chip oscillator or external 32.768 kHz crystal for calendar/time-of-day functions.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 S08CPUV3 - 40-MHz max CPU clock, 20-MHz bus clock, HC08 ISA + BGND instruction
Memory60 KB Flash (program/erase over full VDD/temp), 2 KB RAM, 2 KB EEPROM with 4-/8-byte erase sectors
ADC12-bit resolution, 16-channel input, 2.5 µs conversion time, internal bandgap reference & temperature sensor
TimersTPM1 (6-channel), TPM2 (2-channel); each supports input capture, output compare, PWM, and selectable prescaling
CommunicationSCI1 (LIN 2.0/J2602 compliant), SPI (full-duplex/dual-buffered), I²C (100 kbps, multi-master)
Power ModesRun, Wait, Stop2, Stop3 - includes very low power RTC wake-up and real-time interrupt in all modes
I/O53 general-purpose I/O pins + 1 input-only pin; configurable pull, slew rate, drive strength, and interrupt polarity per pin

Pinout & Package

MC9S08DN60AMLH is housed in a 64-pin LQFP (10 × 10 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments follow standard HCS08 DN-series layout, including dedicated VDD/VSS pairs per port group, separate analog power (VDDAD/VSSAD), ADC reference inputs (VREFH/VREFL), and BKGD/MS for debug interface.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSS (x8)Power supply and groundDedicated pairs per port group reduce noise coupling; VDDAD/VSSAD isolated for ADC precision
BKGD/MSBackground debug / mode selectSingle-wire debug interface; asserts during reset to enter active background mode
VREFH / VREFLADC reference voltage terminalsAccept external reference or connect to internal bandgap; define full-scale ADC range
XTAL / EXTALCrystal oscillator inputsSupport 31.25 kHz–16 MHz crystals/resonators; feed MCG for precise system clock generation
PTA0–PTA7, PTB0–PTB7, etc.General-purpose I/O ports53 GPIO + 1 input-only (PTG7); each pin supports interrupt, pull, slew, and drive configuration

Key Features

FeatureDesign Value
LIN 2.0–compliant SCIEnables direct integration into automotive body networks without external protocol translators
In-circuit EEPROM with sector erase abortAllows safe field updates of calibration data or configuration without risking full memory corruption
Real-time interrupt in all power modesPermits deterministic wake-up from Stop3 using internal 1 kHz oscillator - no external components required
Factory-trimmed internal reference clockReduces BOM count by enabling accurate clocking without external crystal in cost-sensitive applications
Flash block protection & securityPrevents unauthorized read-out or reprogramming - critical for firmware IP protection in OEM deployments

Applications

Automotive Door ModuleIndustrial Temperature Controller

Use Scenario: Central MCU in vehicle door control unit managing window lift, mirror adjustment, lock actuation, and interior lighting.

IC Role / Device Role / Timing Role: Main controller executing LIN slave protocol via SCI1, reading potentiometer and switch inputs, driving relays and motor drivers via GPIO/PWM.

Use Value: Integrated LIN interface, 53 GPIO, and dual TPM modules eliminate external protocol ICs and discrete timing logic - reducing board area and system cost.

Use Scenario: Standalone DIN-rail mounted temperature regulator using thermistor inputs and SSR outputs in HVAC systems.

IC Role / Device Role / Timing Role: System-on-chip controller performing 12-bit ADC sampling, PID computation, RTC-based scheduling, and zero-cross SSR triggering via TPM PWM.

Use Value: On-chip 2 KB EEPROM stores calibration coefficients and user settings across power cycles; RTC enables time-stamped logging without backup battery.

Smart Lighting NodeMedical Sensor Interface

Use Scenario: DALI-compatible LED driver node with ambient light sensing, dimming control, and fault reporting over RS-485.

IC Role / Device Role / Timing Role: Peripheral manager interfacing photodiode ADC channel, generating PWM dimming signals, and translating DALI commands via SCI UART.

Use Value: 2.5 µs ADC conversion enables fast ambient light response; dual analog comparators monitor overvoltage/overcurrent conditions in real time.

Use Scenario: Portable patient monitor front-end acquiring ECG, skin temperature, and SpO₂ signals for Bluetooth transmission.

IC Role / Device Role / Timing Role: Analog signal conditioner and digital aggregator - digitizing biopotentials via 12-bit ADC, applying digital filtering, and timestamping samples using RTC.

Use Value: Internal bandgap reference and temperature sensor enable self-calibration; low-power Stop2 mode extends battery life between sensor reads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DN60F1MLHSame die, newer mask revision (F1 vs A); identical Flash/RAM/peripherals; updated electrical specs per Rev 4 datasheetNo functional change; qualified for extended temperature range (−40°C to 105°C) vs −40°C to 85°CSelect when extended temp operation or latest production mask is required
MC9S08DZ60CLHSame 60 KB Flash, but adds CAN 2.0B controller and enhanced ADC trigger flexibility; different pinout (64-pin LQFP, non-pin-compatible)Required where CAN bus integration is needed (e.g., chassis networks); not suitable for drop-in replacementChoose only if CAN communication is mandatory and PCB redesign is acceptable

Compared with MC9S08DN60AMLH, S9S08DN60F1MLH offers identical functionality with extended temperature qualification, while MC9S08DZ60CLH trades LIN capability for CAN - making it unsuitable as a direct substitute but viable for CAN-centric designs requiring similar memory and I/O scale.

Availability

MC9S08DN60AMLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart lighting controls, and portable medical devices requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08DN60AMLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08DN60AMLH belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control in automotive body electronics and industrial automation where LIN protocol support and robust peripheral integration are essential.

FAQ

What is the maximum operating frequency of the MC9S08DN60AMLH CPU and bus?

The MC9S08DN60AMLH features an HCS08 CPU capable of running at up to 40 MHz, with a corresponding maximum bus clock frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, supporting both internal trimmed reference and external crystal inputs. The MC9S08DN60AMLH maintains full functionality across its specified voltage and temperature range at these speeds.

Does the MC9S08DN60AMLH support LIN 2.0 communication natively?

Yes, the MC9S08DN60AMLH includes SCI1 hardware that is fully compliant with LIN 2.0 and SAE J2602 protocols. It supports master extended break generation, slave extended break detection, and wakeup on active edge - enabling direct implementation of LIN slave nodes without external protocol translation. This capability is confirmed in the official MC9S08DN60 Series Data Sheet Rev 3, Section 13.

How much Flash, RAM, and EEPROM does the MC9S08DN60AMLH integrate?

The MC9S08DN60AMLH integrates 60 KB of on-chip Flash memory, 2 KB of RAM, and 2 KB of in-circuit programmable EEPROM. Flash supports read/program/erase across full operating voltage and temperature ranges; EEPROM allows 4-byte dual-page or 8-byte single-page erase with abort capability. These values are explicitly stated in the "On-Chip Memory" section of the MC9S08DN60AMLH datasheet.

What power-saving modes are available on the MC9S08DN60AMLH?

The MC9S08DN60AMLH supports three primary low-power modes: Wait mode (reduced power), Stop2 (very low power), and Stop3 (ultra-low power). All modes retain RTC functionality and support real-time interrupt wake-up using either the internal 1 kHz oscillator or external 32.768 kHz crystal. Stop3 mode draws minimal current while preserving RAM and register contents - ideal for battery-powered applications requiring periodic wake-up.

Is the MC9S08DN60AMLH pin-compatible with other members of the DN-series like MC9S08DN48?

No, the MC9S08DN60AMLH is not pin-compatible with lower-density variants such as MC9S08DN48 or MC9S08DN32 when packaged in the same 64-pin LQFP. While all DN-series parts share the same pinout *within the same package option*, MC9S08DN48 and MC9S08DN32 are typically offered in smaller packages (e.g., 48-pin or 32-pin LQFP). The MC9S08DN60AMLH's 64-pin LQFP footprint is unique to the 60 KB variant in this family.

MC9S08DN60AMLH Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
S08
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DN60AMLH FAQ

1.How can I place an order for MC9S08DN60AMLH through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DN60AMLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DN60AMLH reliable?

The price and inventory of MC9S08DN60AMLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN60AMLH is usually 5 days.

3.What payment methods are accepted for MC9S08DN60AMLH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN60AMLH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DN60AMLH?

MC9S08DN60AMLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DN60AMLH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DN60AMLH?

For technical support, including MC9S08DN60AMLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN60AMLH requirements.

6.How does Aetrix verify that MC9S08DN60AMLH is sourced from the original manufacturer or authorized distributors?

All MC9S08DN60AMLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN60AMLH meets industry standards.

7.What is the process for return or replacement of MC9S08DN60AMLH?

All MC9S08DN60AMLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN60AMLH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DN60AMLH part is unused and in its original packaging.

Return procedure for MC9S08DN60AMLH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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