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NXP Semiconductors MC9S08DN60MLH
- Part No.:
- MC9S08DN60MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DN60MLH.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,300
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Product details
Overview
MC9S08DN60MLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 2 KB RAM, and 2 KB in-circuit programmable EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC, dual analog comparators, SCI (LIN/J2602), SPI, I²C, two TPM modules (6+2 channels), RTC, and real-time interrupt capability - deployed in automotive body control modules and industrial sensor nodes requiring deterministic timing and low-power operation.
For engineers reviewing the MC9S08DN60MLH datasheet, MC9S08DN60MLH pinout, MC9S08DN60MLH application, or MC9S08DN60MLH equivalent, key selection criteria include Flash size (60 KB), 64-pin LQFP package, 12-bit 16-channel ADC with temperature sensor, LIN-compliant SCI, and dual-stop mode power management for battery-powered systems.
Technical Context
The MC9S08DN60MLH implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with ±1.5% internal reference accuracy and factory-trimmed IRC.
Peripherals include a 12-bit ADC with 2.5 μs conversion time and internal bandgap reference, two ACMPs with edge-selectable interrupts, and TPM modules supporting input capture, output compare, and edge-aligned PWM - all functional in Wait and Stop3 modes with RTC wake-up from 1 kHz internal oscillator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3, 40-MHz max CPU clock (20-MHz bus) |
| Flash Memory | 60 KB program/erase over full voltage/temperature range; supports erase abort and program-while-execute |
| RAM | 2 KB on-chip SRAM for data and stack operations |
| EEPROM | 2 KB in-circuit programmable; 4-byte dual-page or 8-byte single-page erase sectors |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time; includes temperature sensor and internal bandgap reference channel |
| Package | 64-pin LQFP (10 × 10 mm), lead-free, RoHS-compliant |
| Power Modes | Run, Wait, Stop2, Stop3; real-time interrupt available in all modes using 1-kHz internal oscillator |
Pinout & Package
MC9S08DN60MLH is housed in a 64-pin low-profile quad flat-pack (LQFP) measuring 10 × 10 mm with exposed thermal pad (EP). Pin functions are defined per Chapter 2 of the Rev 3 datasheet, including dedicated VDD/VSS pairs, crystal inputs (EXTAL/XTAL), reset (RESET), background debug (BKGD/MS), ADC reference (VREFH/VREFL), and 53 GPIO + 1 input-only pin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–2, 63–64 | VDD, VSS (Power) | Dedicated supply and ground pins for core logic; decoupling required per datasheet layout guidelines |
| 3–4 | EXTAL, XTAL | Crystal/resonator inputs for XOSC; supports 1–16 MHz crystals or 31.25–38.4 kHz low-frequency resonators |
| 5 | RESET | Active-low asynchronous reset input; internal pull-up enabled by default |
| 6 | BKGD/MS | Single-wire background debug interface and mode select; requires external pull-up for normal operation |
| 7–8 | VREFH, VREFL | Analog reference voltage high/low inputs for ADC; support external or internal bandgap reference selection |
| 9–16, 18–25, 27–34, 36–43, 45–52, 54–61 | GPIO (Port A–G) | 53 general-purpose I/O pins with configurable pull, slew rate, drive strength, and interrupt polarity |
Key Features
| Feature | Design Value |
|---|---|
| LIN 2.0 & SAE J2602-compliant SCI | Enables direct integration into automotive body networks without external protocol translators |
| Real-time interrupt with 1-kHz internal oscillator | Allows cyclic wake-up from Stop3 mode without external crystal or timing components |
| Flash block protection and security features | Prevents unauthorized read/write access to firmware and configuration memory |
| On-chip ICE with real-time bus capture | Supports non-intrusive debugging and trace analysis during live system operation |
| Temperature sensor integrated in ADC | Provides calibrated die-temperature measurement without external components |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, interior lighting, and mirror adjustment in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, managing GPIO-driven actuators, and monitoring analog sensor inputs (e.g., ambient light, temperature). Use Value: 60 KB Flash accommodates LIN stack + application logic; dual-stop modes extend battery life during vehicle sleep states. | Use Scenario: Wireless-capable environmental monitor collecting temperature, humidity, and vibration data in factory settings. IC Role / Device Role / Timing Role: Sensor interface MCU acquiring analog signals via 12-bit ADC, conditioning data, and triggering SPI-based radio transmission. Use Value: Integrated temperature sensor and bandgap reference eliminate calibration components; RTC enables precise timestamping without external timekeeping IC. |
| Smart HVAC Actuator | Medical Diagnostic Handheld |
Use Scenario: Motorized damper control in commercial HVAC systems with local feedback and CAN/LIN gateway capability. IC Role / Device Role / Timing Role: Real-time actuator controller running closed-loop PWM (via TPM) while communicating status over LIN. Use Value: 6-channel TPM supports simultaneous motor control and fan speed regulation; low-voltage detection ensures safe shutdown during brownout. | Use Scenario: Portable blood glucose or ECG device requiring low-power operation, analog signal acquisition, and user interface responsiveness. IC Role / Device Role / Timing Role: Primary controller handling button inputs, LCD updates, ADC sampling, and USB/UART communication. Use Value: 2 KB EEPROM stores calibration coefficients and usage logs; single-wire debug simplifies production programming and field firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DN60F1MLH | Same core, Flash, RAM, and peripherals; differs only in mask set revision and minor electrical spec refinements (e.g., updated PLL jitter spec per Rev 3 DS) | Identical use cases; qualified for same automotive temperature grade (–40°C to 105°C) | Select S9S08DN60F1MLH for new designs requiring latest mask set and documented PS issue resolutions. |
| MC9S08DZ60CLH | 60 KB Flash, but adds MSCAN module and enhanced I/O drive strength; lacks RTC and uses different MCG implementation | Better suited for CAN-based automotive sub-systems; not drop-in for RTC-dependent scheduling or LIN-only networks | Choose MC9S08DZ60CLH only when CAN physical layer integration is required and RTC functionality is unnecessary. |
Compared with MC9S08DN60MLH, S9S08DN60F1MLH offers identical functionality with updated silicon errata fixes, while MC9S08DZ60CLH trades RTC and LIN-optimized SCI for CAN support - making it unsuitable as a direct replacement unless CAN is mandatory and RTC can be omitted.
Availability
MC9S08DN60MLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart HVAC actuators, and portable medical diagnostics requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MC9S08DN60MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.
The MC9S08DN60MLH belongs to the legacy HCS08 family designed for cost-sensitive, low-power embedded control in automotive and industrial environments where deterministic real-time response and robust peripheral integration are critical.
FAQ
What is the maximum operating frequency of the MC9S08DN60MLH CPU and bus?
The MC9S08DN60MLH features an HCS08 CPU capable of running at up to 40 MHz, with a corresponding maximum bus frequency of 20 MHz. This timing is achieved using the Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and the specification is guaranteed across the full industrial temperature range (–40°C to 105°C) and supply voltage (2.7–5.5 V).
Does the MC9S08DN60MLH support LIN communication natively?
Yes, the MC9S08DN60MLH includes an SCI module (SCI1) explicitly designed to support LIN 2.0 and SAE J2602 protocols. It provides master extended break generation, slave extended break detection, and wakeup on active edge - enabling direct integration into LIN networks without external protocol translation hardware.
What are the power-saving capabilities of the MC9S08DN60MLH?
The MC9S08DN60MLH supports two very low-power stop modes (Stop2 and Stop3), a reduced-power wait mode, and a real-time interrupt that operates from a dedicated 1-kHz internal oscillator. These features allow the device to maintain timekeeping and wake on event while consuming microamp-level current - essential for battery-backed automotive and portable applications.
How much EEPROM and RAM does the MC9S08DN60MLH include?
The MC9S08DN60MLH integrates 2 KB of in-circuit programmable EEPROM organized in 4-byte dual-page or 8-byte single-page erase sectors, and 2 KB of on-chip SRAM. Both memories operate across the full voltage and temperature range, with EEPROM supporting program-and-erase-while-executing Flash functionality.
Is the MC9S08DN60MLH pin-compatible with other devices in the DN-series?
No - the MC9S08DN60MLH is offered exclusively in a 64-pin LQFP package, whereas MC9S08DN48/DN32/DN16 variants are available in 48-pin and 32-pin LQFP packages. Pin count, I/O mapping, and peripheral register layouts differ across package options; migration requires PCB redesign and firmware adaptation.
MC9S08DN60MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DN60MLH FAQ
1.How can I place an order for MC9S08DN60MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DN60MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DN60MLH reliable?
The price and inventory of MC9S08DN60MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DN60MLH is usually 5 days.
3.What payment methods are accepted for MC9S08DN60MLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DN60MLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DN60MLH?
MC9S08DN60MLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DN60MLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DN60MLH?
For technical support, including MC9S08DN60MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DN60MLH requirements.
6.How does Aetrix verify that MC9S08DN60MLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DN60MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DN60MLH meets industry standards.
7.What is the process for return or replacement of MC9S08DN60MLH?
All MC9S08DN60MLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DN60MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DN60MLH part is unused and in its original packaging.
Return procedure for MC9S08DN60MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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