Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC9S08DV128MLL

Part No.:
MC9S08DV128MLL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixMC9S08DV128MLL.pdf
Description:
IC MCU 8BIT 128KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,233

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC9S08DV128MLL from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 128 KB on-chip FLASH, 6 KB RAM, and integrated MSCAN, dual SCI, dual SPI, dual IIC, three TPM modules, 12-bit ADC, and real-time counter. It operates at up to 40 MHz CPU / 20 MHz bus frequency and supports multiple low-power stop/wait modes. It is used in automotive body control modules requiring CAN communication, sensor interfacing, and deterministic real-time response.

For engineers reviewing the MC9S08DV128MLL datasheet, MC9S08DV128MLL pinout, MC9S08DV128MLL application, or MC9S08DV128MLL equivalent, key selection criteria include its 100-pin LQFP package, 5 V tolerant I/O, internal bandgap reference (1.18–1.21 V), PLL/FLL clock generation with external crystal support up to 16 MHz, and single-wire background debug interface.

Technical Context

The MC9S08DV128MLL implements the HCS08 CPU core with HC08 instruction set extension, supporting up to 32 interrupt/reset sources and BGND instruction for debugging. Its Multi-Purpose Clock Generator (MCG) provides FEI, FEE, FBE, PEE, and BLPE modes with nonvolatile trim (0.2% resolution, ±1.5% tolerance over temperature) and DIV32/DRS/DMX32 configuration for precise frequency synthesis.

Peripherals include a 24-channel 12-bit ADC with 2.5 µs conversion time and internal temperature sensor, two analog comparators with bandgap reference option, and MSCAN compliant with ISO 11898-1 (CAN 2.0A/B). The device lacks on-chip EEPROM - unlike the DZ-series variants - and uses FLASH-based data storage with sector erase capability.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core, 40 MHz max CPU frequency, 20 MHz bus clock - enables deterministic real-time control in resource-constrained automotive ECUs.
Memory 128 KB FLASH (read/program/erase over full voltage/temp), 6 KB RAM - sufficient for AUTOSAR-compliant bootloaders and application code with data logging buffers.
Clock System MCG with FLL and PLL; supports 31.25 kHz–16 MHz crystal/resonator; DIV32 enables 31.25–39.0625 kHz reference division for stable FLL lock in high-range modes.
Analog Peripherals 24-channel 12-bit ADC (2.5 µs conversion), internal bandgap reference (1.18–1.21 V @ VDD=5.0 V), two ACMPs - enables direct battery voltage monitoring and sensor signal conditioning without external references.
Communication MSCAN (CAN 2.0A/B), two SCIs (LIN 2.0/J2602 compatible), two SPIs, two IICs - supports multi-bus vehicle networking with protocol stack offload capability.
Power Management Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, 1 kHz RTC oscillator - allows sub-10 µA sleep current for always-on wake-up functions in door modules or lighting controllers.
I/O & Packaging 87 general-purpose I/O pins + 1 input-only pin; 100-pin LQFP (14×14 mm); 5 V tolerant inputs - simplifies interface with legacy automotive sensors and actuators without level-shifting.

Pinout & Package

MC9S08DV128MLL is housed in a 100-pin low-profile quad flat-pack (LQFP) package, 14 mm × 14 mm, with 0.5 mm pitch and exposed thermal pad. Pin assignments follow Freescale's standardized HCS08 pinout layout, with dedicated VDD/VSS pairs distributed across corners and edges for noise reduction and power integrity.

Pin/Terminal Circuit Role Design Meaning
VDD (Pins 1, 14, 27, 40, 53, 66, 79, 92) Core & I/O Power Supply Eight dedicated 5 V supply pins reduce IR drop and improve noise immunity; must be decoupled individually near each pin with 100 nF ceramic capacitors.
VSS (Pins 2, 15, 28, 41, 54, 67, 80, 93) Digital Ground Reference Eight ground return paths minimize ground bounce and ensure stable ADC reference and CAN common-mode operation.
EXTAL / XTAL (Pins 11 / 12) Crystal Oscillator Input/Output Connects to 31.25 kHz–16 MHz crystal; XTAL drives crystal; EXTAL receives feedback - requires load capacitors (12–22 pF) per crystal manufacturer spec.
RESET (Pin 13) Active-Low Reset Input Asynchronous reset with internal pull-up; accepts 5 V logic; triggers full system initialization including FLASH controller, clock generator, and peripheral registers.
BKGD/MS (Pin 99) Single-Wire Background Debug Shared pin for debug communication and mode select; requires open-drain driver and 10 kΩ pull-up to VDD for reliable BDM session entry.
PTJ2 / TPM3CH2 (Pin 86) Timer PWM Output Configurable as edge-aligned PWM channel 2 of TPM3 - supports motor gate drive or LED dimming with programmable duty cycle and period via TPM3MOD/TPM3C2V registers.

Key Features

Feature Design Value
Single-wire background debug (BDM) Enables in-circuit programming and real-time trace without JTAG header footprint - reduces PCB area and test cost in space-constrained modules.
MSCAN module (ISO 11898-1) Hardware-accelerated CAN 2.0A/B with five receive buffers and flexible ID filtering (2×32-bit, 4×16-bit, or 8×8-bit) - eliminates software polling overhead and ensures deterministic message latency.
Multi-purpose Clock Generator (MCG) Supports seamless transitions between FEI→FEE→PBE→PEE modes; internal trim accuracy (±1.5% over temp) removes need for external calibration in production.
12-bit ADC with temperature sensor 24-channel input multiplexer, 2.5 µs conversion, automatic compare, and internal bandgap reference - enables closed-loop thermal management without external components.
Low-power stop modes (Stop2/Stop3) Sub-10 µA typical current draw with RTC running from 1 kHz internal oscillator - supports battery-powered wake-on-event functionality in gateway or junction box applications.

Applications

Automotive Body Control Module Industrial CAN Gateway

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing application logic, managing LIN slave devices via SCI, and communicating with powertrain via MSCAN.

Use Value: Integrated CAN and dual SCI eliminate external transceivers for basic networking; 128 KB FLASH accommodates firmware updates and diagnostic routines.

Use Scenario: Protocol translation between Modbus RTU (RS-485) and CANopen networks in factory automation systems.

IC Role / Device Role / Timing Role: Bridge controller performing message mapping, timing synchronization, and error recovery between heterogeneous fieldbuses.

Use Value: Dual SCI + MSCAN + 6 KB RAM enable concurrent serial/CAN buffering; real-time counter supports timestamping of cross-bus events.

Smart Lighting Controller Motorized HVAC Actuator

Use Scenario: Adaptive headlamp leveling and dynamic LED matrix control in commercial vehicles.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating gyro/accelerometer data and driving PWM outputs to stepper motors and LED drivers.

Use Value: Three TPM modules provide six independent PWM channels with synchronized phase alignment - critical for flicker-free LED dimming and smooth motor positioning.

Use Scenario: Position-controlled air flap actuation in automotive HVAC systems using potentiometer feedback and DC motor drive.

IC Role / Device Role / Timing Role: Closed-loop position controller reading analog potentiometer via ADC and generating bidirectional H-bridge signals via GPIO/TPM outputs.

Use Value: 24-channel ADC supports simultaneous sampling of multiple sensors; internal bandgap reference ensures consistent measurement accuracy across temperature.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08DZ128MLL Includes 2 KB EEPROM, same 128 KB FLASH/6 KB RAM, identical pinout and peripheral set except EEPROM presence. Preferred where nonvolatile parameter storage (e.g., calibration data, odometer) is required without external EEPROM. Select MC9S08DZ128MLL if EEPROM persistence is mandatory; otherwise MC9S08DV128MLL reduces BOM cost and simplifies FLASH wear-leveling design.
S9S08DZ128F2MLL Pin-compatible successor with enhanced ESD rating (±8 kV HBM), updated qualification per AEC-Q100 Rev G, and extended temperature range (−40°C to 125°C). Required for new designs targeting automotive under-hood environments or higher reliability tiers. Choose S9S08DZ128F2MLL for new automotive programs needing AEC-Q100 Grade 1 compliance; MC9S08DV128MLL remains valid for cabin-grade applications.

Compared with MC9S08DZ128MLL, the MC9S08DV128MLL omits on-chip EEPROM but retains identical FLASH size, clock architecture, and CAN/ADC performance - making it optimal for cost-sensitive body electronics where parameters are stored in FLASH. Versus S9S08DZ128F2MLL, it lacks AEC-Q100 Rev G qualification and extended temperature support, limiting use to ambient-rated modules.

Availability

MC9S08DV128MLL is available at Aetrix Electronics and suitable for automotive body control, industrial CAN gateways, smart lighting systems, and motorized HVAC actuators requiring stable component supply across long production lifecycles.

Supply support for MC9S08DV128MLL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.

The MC9S08DV128MLL belongs to the HCS08 family, designed specifically for cost-optimized, low-power automotive body electronics and industrial control where CAN integration, robustness, and debug accessibility are essential.

FAQ

What is the maximum operating frequency of the MC9S08DV128MLL CPU and bus?

The MC9S08DV128MLL features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding maximum bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PEE mode, where the PLL multiplies a 1–2 MHz reference (derived from an external crystal via RDIV/DIV32) to produce the system clock. The MC9S08DV128MLL datasheet specifies these values under DC characteristics at VDD = 5.0 V and TA = −40°C to 105°C.

Does the MC9S08DV128MLL include on-chip EEPROM memory?

No, the MC9S08DV128MLL does not include on-chip EEPROM. Unlike the MC9S08DZ128MLL variant, which integrates 2 KB of EEPROM, the MC9S08DV128MLL relies solely on its 128 KB FLASH memory for both program code and data storage. Data retention is managed via FLASH sector erase and write cycles, with wear-leveling implemented in firmware. This distinction is explicitly documented in the MC9S08DZ128 Series Data Sheet's memory comparison table.

What communication interfaces are supported by the MC9S08DV128MLL?

The MC9S08DV128MLL supports MSCAN (Controller Area Network, ISO 11898-1 compliant), two Serial Communications Interfaces (SCI) compatible with LIN 2.0 and SAE J2602, two Serial Peripheral Interfaces (SPI), and two Inter-Integrated Circuits (IIC) operating up to 100 kbps. All interfaces are fully integrated with DMA-capable registers and share the same 20 MHz bus clock domain. No external transceivers are required for basic SCI or SPI operation, though CAN physical layer drivers must be added externally.

What is the purpose of the DIV32 bit in the MCGC3 register of the MC9S08DV128MLL?

The DIV32 bit (bit 4) in the MCGC3 register of the MC9S08DV128MLL enables an additional divide-by-32 factor applied to the external reference clock before it enters the FLL when the RANGE bit is set (high-frequency crystal mode). It must be cleared when PLLS = 1 (i.e., PLL selected), as stated in the MC9S08DZ128 Series Data Sheet Addendum Rev. 2. This ensures correct reference frequency division for stable FLL lock or proper PLL input scaling - critical for achieving accurate 16 MHz bus clocks from 8 MHz crystals.

How many I/O pins does the MC9S08DV128MLL provide, and what are their voltage tolerances?

The MC9S08DV128MLL provides up to 87 general-purpose I/O pins and one input-only pin, all configured in its 100-pin LQFP package. All digital I/O pins are 5 V tolerant, meaning they accept input signals up to 5.5 V regardless of VDD level (within specified operating range), simplifying interface with legacy 5 V sensors and actuators. Input hysteresis and configurable pull devices are available on every pin, and output drive strength/slew rate can be adjusted per port to reduce EMI in noisy automotive environments.

MC9S08DV128MLL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
6K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DV128MLL FAQ

1.How can I place an order for MC9S08DV128MLL through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DV128MLL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DV128MLL reliable?

The price and inventory of MC9S08DV128MLL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV128MLL is usually 5 days.

3.What payment methods are accepted for MC9S08DV128MLL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV128MLL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DV128MLL?

MC9S08DV128MLL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DV128MLL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DV128MLL?

For technical support, including MC9S08DV128MLL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV128MLL requirements.

6.How does Aetrix verify that MC9S08DV128MLL is sourced from the original manufacturer or authorized distributors?

All MC9S08DV128MLL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV128MLL meets industry standards.

7.What is the process for return or replacement of MC9S08DV128MLL?

All MC9S08DV128MLL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV128MLL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DV128MLL part is unused and in its original packaging.

Return procedure for MC9S08DV128MLL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08DV128MLL Tags

  • MC9S08DV128MLL
  • MC9S08DV128MLL PDF
  • MC9S08DV128MLL Datasheet
  • MC9S08DV128MLL Specifications
  • MC9S08DV128MLL Images
  • NXP Semiconductors
  • NXP Semiconductors MC9S08DV128MLL
  • Buy MC9S08DV128MLL
  • MC9S08DV128MLL Price
  • MC9S08DV128MLL Distributor
  • MC9S08DV128MLL Supplier
  • MC9S08DV128MLL Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER