NXP Semiconductors MC9S08DV16ACLC
- Part No.:
- MC9S08DV16ACLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DV16ACLC.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,690
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08DV16ACLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 3 KB RAM, 40-MHz CPU (20-MHz bus), integrated MSCAN v2.0A/B controller, and 12-bit ADC with temperature sensor - used in automotive body control modules requiring CAN communication and real-time I/O management.
For engineers reviewing the MC9S08DV16ACLC datasheet, MC9S08DV16ACLC pinout, MC9S08DV16ACLC application, or MC9S08DV16ACLC equivalent, key selection criteria include flash size, CAN protocol compliance, stop-mode power consumption, ADC resolution and conversion time, and background debug interface support.
Technical Context
The MC9S08DV16ACLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.
On-chip peripherals include a 16-channel 12-bit ADC (2.5 μs conversion), two analog comparators with bandgap reference option, dual SCI supporting LIN 2.0/SAE J2602, SPI, I²C, two TPM modules (6+2 channels), RTC with 1-kHz low-power oscillator, and full-featured MSCAN module with five receive buffers and programmable identifier filters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz operation (20-MHz bus speed) |
| Flash Memory | 16 KB on-chip flash with block protection, read/program/erase over full voltage/temperature range |
| RAM | Up to 3 KB on-chip RAM for data and stack storage |
| CAN Interface | MSCAN v2.0A/B compliant: supports standard/extended frames, remote frames, FIFO-based 5-buffer receive |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up capability |
| Debug Interface | Single-wire background debug (BDM) interface with on-chip ICE and real-time bus capture |
Pinout & Package
MC9S08DV16ACLC is packaged in a 48-pin LQFP (7×7 mm) with 53 general-purpose I/O pins and 1 input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength; 24 pins support edge-selectable interrupts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| VREFH / VREFL | ADC reference inputs | Enable external precision reference or internal bandgap use for consistent 12-bit ADC scaling |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects active background mode during reset |
| RESET | Active-low reset input | Hardware reset with optional low-voltage detect (LVD) reset or interrupt generation |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt capability on all pins; supports alternate functions including SCI0, SPI, TPM |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port with interrupt capability; includes MSCAN TX/RX, RTC, ADC channel inputs |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port with interrupt capability; supports SCI1, I²C, TPM, ACMP, and ADC inputs |
| PTD0–PTD7 | Port D general-purpose I/O | 8-bit port with interrupt capability; includes ADC inputs, TPM, and GPIO |
| PTE0–PTE7 | Port E general-purpose I/O | 8-bit port with interrupt capability; supports ADC, TPM, and GPIO |
| XTAL / EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators for XOSC oscillator circuit |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN v2.0A/B | Enables robust automotive network integration without external CAN controller; supports both standard and extended identifiers |
| Factory-trimmed internal reference clock | Reduces BOM cost and board space by eliminating external crystal for basic timing; trim value stored in flash |
| Real-time interrupt in Stop modes | Allows ultra-low-power sleep while maintaining precise wake-up timing via on-chip 1-kHz oscillator - no external RTC required |
| 12-bit ADC with temperature sensor | Provides direct thermal monitoring for system health checks and thermal compensation without external sensors |
| Single-wire background debug | Minimizes debug footprint to one pin; enables full in-circuit emulation and real-time bus trace during development |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized control of lighting, window lifts, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN message routing, PWM-driven motor control, and ADC-based switch sensing. Use Value: Integrated MSCAN and 12-bit ADC reduce component count; 16 KB flash accommodates firmware for multi-function logic and diagnostics. | Use Scenario: Localized control of power windows, door locks, and mirror adjustment in vehicle door assemblies. IC Role / Device Role / Timing Role: Real-time peripheral controller with CAN interface for command reception and local actuator timing. Use Value: Very low-power stop modes extend battery life during vehicle sleep; single-wire debug simplifies production programming. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Management of sunroof, panoramic roof, and interior lighting with position feedback and safety interlocks. IC Role / Device Role / Timing Role: Safety-critical motion controller using ADC for potentiometer feedback and TPM for precise motor timing. Use Value: On-chip watchdog (COP) with backup 1-kHz clock ensures fail-safe shutdown; flash block protect prevents unauthorized firmware modification. | Use Scenario: Adjustment of seat position, lumbar support, and heating elements via user inputs and CAN commands. IC Role / Device Role / Timing Role: Mixed-signal controller handling analog heater current sensing, PWM motor drives, and LIN/SCI communication. Use Value: Dual SCI with LIN 2.0 support enables interoperability with seat switch panels; 3 KB RAM supports real-time PID control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DV16F1CLK | Same core, package, and peripheral set; differs in flash endurance (100k vs. 10k erase cycles) and qualification grade (AEC-Q100 Grade 2 vs. Grade 3) | Targeted at higher-reliability automotive applications requiring extended lifetime and wider temperature range (−40°C to 125°C) | Select S9S08DV16F1CLK when operating beyond 105°C ambient or requiring >50k flash cycles over product lifetime |
| MC9S08DZ128CLC | Higher flash (128 KB), added EEPROM (2 KB), enhanced CAN filtering, and additional I/O (up to 60 pins); same HCS08 core and MCG architecture | Used in more complex body domain controllers where firmware scalability and nonvolatile parameter storage are critical | Choose MC9S08DZ128CLC when future firmware expansion, calibration data retention, or additional CAN message filtering is required |
Compared with MC9S08DV16ACLC, S9S08DV16F1CLK offers extended reliability for under-hood environments, while MC9S08DZ128CLC provides scalable memory and EEPROM for evolving feature sets - neither is pin-compatible, but both share identical peripheral register mapping and toolchain compatibility.
Availability
MC9S08DV16ACLC is available at Aetrix Electronics and suitable for automotive body electronics, door module control, and roof module applications requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for MC9S08DV16ACLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08DV16ACLC belongs to the HCS08 DV-series microcontrollers, designed specifically for cost-sensitive, low-power automotive body electronics requiring CAN communication, mixed-signal integration, and robust debug capabilities.
FAQ
What is the maximum bus frequency supported by the MC9S08DV16ACLC?
The MC9S08DV16ACLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a configurable divider. This bus speed is maintained across all operating modes including Run, Wait, and Stop - enabling deterministic timing for CAN, ADC, and timer peripherals without clock gating penalties. The MC9S08DV16ACLC achieves this using its Multi-Purpose Clock Generator (MCG) in FLL or PLL mode with internal or external reference sources.
Does the MC9S08DV16ACLC include a hardware watchdog timer?
Yes, the MC9S08DV16ACLC includes a Computer Operating Properly (COP) watchdog timer with configurable timeout and dual clock source options: it can run from either the main bus clock or a dedicated 1-kHz internal low-power oscillator. This ensures reliable system recovery even during low-power stop modes. The COP module is enabled via software configuration in the SOPT1 register and supports reset or interrupt generation upon timeout - a critical feature for automotive safety compliance in the MC9S08DV16ACLC.
What type of CAN protocol does the MC9S08DV16ACLC support?
The MC9S08DV16ACLC supports Controller Area Network (CAN) protocol version 2.0A and 2.0B, including both standard (11-bit) and extended (29-bit) identifier formats, remote transmission requests, and flexible acceptance filtering (2×32-bit, 4×16-bit, or 8×8-bit). Its MSCAN module features five receive buffers with FIFO behavior and automatic message handling - making the MC9S08DV16ACLC suitable for automotive body networks where deterministic latency and message prioritization are essential.
Can the MC9S08DV16ACLC operate without an external crystal?
Yes, the MC9S08DV16ACLC can operate without an external crystal by using its internal reference clock (IRC) with factory-trimmed frequency accuracy (±1.5% with temperature compensation). The Multi-Purpose Clock Generator (MCG) supports FLL mode locked to the IRC, enabling full functionality including CAN, ADC, and timers. While external crystals (1–16 MHz or 31–38 kHz) improve timing precision, the MC9S08DV16ACLC's internal clock eliminates BOM cost and layout complexity for less timing-critical applications.
How many ADC channels and what resolution does the MC9S08DV16ACLC provide?
The MC9S08DV16ACLC integrates a 12-bit successive-approximation ADC with 16 input channels, including dedicated connections for an on-die temperature sensor and internal bandgap reference. Conversion time is fixed at 2.5 μs per sample, supporting up to 400 kSPS aggregate throughput. The ADCSC1 and ADCSC2 registers allow hardware-triggered conversions and automatic compare functions - making the MC9S08DV16ACLC well-suited for real-time sensor monitoring in automotive control units.
MC9S08DV16ACLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV16ACLC FAQ
1.How can I place an order for MC9S08DV16ACLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV16ACLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV16ACLC reliable?
The price and inventory of MC9S08DV16ACLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV16ACLC is usually 5 days.
3.What payment methods are accepted for MC9S08DV16ACLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV16ACLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV16ACLC?
MC9S08DV16ACLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV16ACLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV16ACLC?
For technical support, including MC9S08DV16ACLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV16ACLC requirements.
6.How does Aetrix verify that MC9S08DV16ACLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DV16ACLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV16ACLC meets industry standards.
7.What is the process for return or replacement of MC9S08DV16ACLC?
All MC9S08DV16ACLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV16ACLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV16ACLC part is unused and in its original packaging.
Return procedure for MC9S08DV16ACLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08DV16ACLC Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

