NXP Semiconductors MC9S08DV16CLC
- Part No.:
- MC9S08DV16CLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DV16CLC.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,816
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Product details
Overview
MC9S08DV16CLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip flash, 2 KB RAM, 48 MHz CPU core (20 MHz bus), and integrated MSCAN, dual SCI, SPI, I²C, 12-bit ADC, two analog comparators, RTC, and six-channel TPM. It targets automotive body electronics and industrial control where CAN connectivity, low-power operation, and robust system protection are required.
For engineers reviewing the MC9S08DV16CLC datasheet, MC9S08DV16CLC pinout, MC9S08DV16CLC application, or MC9S08DV16CLC equivalent, key selection criteria include its 16 KB flash size, CAN 2.0A/B compliance, 53 GPIO with configurable slew rate and pull devices, real-time counter with 1 kHz internal oscillator, and single-wire background debug interface.
Technical Context
The MC9S08DV16CLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides PLL and FLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.
System-level protection includes COP watchdog with dual-clock source (1 kHz internal or bus clock), low-voltage detect with reset/interrupt, illegal opcode/address detection, flash block protection, and loss-of-lock monitoring - all designed for automotive-grade reliability in harsh environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU, 40 MHz max core / 20 MHz bus frequency |
| Flash Memory | 16 KB on-chip flash with read/program/erase over full voltage/temperature range |
| RAM | 2 KB on-chip RAM (not 3K - per device-specific memory map) |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), five receive buffers with FIFO and programmable acceptance filters |
| ADC | 16-channel, 12-bit SAR ADC with 2.5 µs conversion time, internal bandgap reference, and temperature sensor channel |
| Debug Interface | Single-wire background debug (BDM) with on-chip ICE and real-time bus capture |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up capability |
Pinout & Package
MC9S08DV16CLC is packaged in a 48-pin LQFP (7×7 mm, 0.5 mm pitch), pin-compatible with other MC9S08DVx family members in same package variant. Pin functions align with MC9S08DV60/DV48/DV32 series documentation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation in mixed-signal operation |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; enables precise timing for CAN bit rate and RTC |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and boot-mode configuration during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervisor integration |
| AD0–AD15 | Analog input channels | 16 of 53 GPIO pins configurable as ADC inputs; includes dedicated temperature sensor channel |
| CANL, CANH | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; requires external termination and common-mode choke |
| SCI1_TX, SCI1_RX | UART serial interface | Full-duplex NRZ communication supporting LIN 2.0 and SAE J2602 protocols |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN controller | Enables deterministic, fault-tolerant vehicle network communication without external CAN controller or protocol stack overhead |
| Factory-trimmed internal reference clock | Eliminates need for external crystal in cost-sensitive applications while maintaining ±1.5% FLL accuracy across temperature |
| Real-time counter with 1 kHz internal oscillator | Provides autonomous wake-up from Stop modes without external components - critical for battery-powered nodes |
| Flash block protection and security | Prevents unauthorized read-out or reprogramming of firmware; supports secure bootloader implementation |
| Configurable GPIO drive strength and slew rate | Reduces EMI and allows optimization for different load conditions (e.g., long traces vs. capacitive sensors) |
Applications
| Automotive Body Control Module | Industrial CAN Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN message handling, sensor polling, actuator driving, and diagnostics via UDS over CAN. Use Value: Integrated MSCAN and 16 KB flash support full OBD-II diagnostic stack and OEM-specific feature sets within tight BOM constraints. | Use Scenario: Distributed I/O node in factory automation systems communicating over CANopen or DeviceNet. IC Role / Device Role / Timing Role: Edge controller managing local analog/digital I/O, performing closed-loop control, and relaying status via CAN bus. Use Value: 12-bit ADC with temperature sensor and automatic compare function enables local threshold-based decision making without host intervention. |
| Smart HVAC Actuator | Low-Power Telematics Gateway |
Use Scenario: Motor-driven damper or valve positioning in commercial HVAC systems with remote monitoring. IC Role / Device Role / Timing Role: Real-time position feedback processor with CAN interface and on-board diagnostics. Use Value: RTC with 1 kHz internal oscillator enables scheduled self-test and energy-efficient sleep/wake cycles between HVAC command updates. | Use Scenario: Secondary gateway aggregating data from multiple sensors before forwarding via cellular or Wi-Fi to cloud platform. IC Role / Device Role / Timing Role: Low-power bridge MCU handling CAN-to-serial translation and buffer management. Use Value: Two SCI interfaces allow simultaneous CAN and UART communication; very low-power stop modes extend battery life in backup power scenarios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ128F2MLC | 128 KB flash, 8 KB RAM, enhanced CAN FD support, higher temperature grade (−40°C to 125°C) | Targeted at next-gen automotive modules requiring larger firmware footprint and extended environmental tolerance | Select when future-proofing for CAN FD or needing >16 KB flash for OTA update partitions |
| MC9S08DZ60CLC | 60 KB flash, same 48-pin LQFP package, identical peripheral set except no RTC module | Suitable for CAN-centric applications where real-time scheduling is handled externally or not required | Choose for drop-in replacement where RTC is unused and additional flash headroom is needed |
Compared with MC9S08DZ60CLC, MC9S08DV16CLC offers integrated RTC and lower flash density - ideal for cost-constrained CAN nodes needing autonomous wake-up. Versus S9S08DZ128F2MLC, it trades flash capacity and CAN FD for lower unit cost and proven qualification in legacy automotive platforms.
Availability
MC9S08DV16CLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN networks, smart HVAC actuators, and low-power telematics gateways requiring stable component supply across multi-year production cycles.
Supply support for MC9S08DV16CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DV16CLC belongs to the legacy HCS08 microcontroller product line, designed specifically for cost-sensitive, CAN-enabled automotive body electronics and industrial control applications requiring high reliability and long-term supply stability.
FAQ
What is the maximum operating frequency of the MC9S08DV16CLC CPU core?
The MC9S08DV16CLC features an HCS08 CPU core with a maximum core frequency of 40 MHz and a maximum bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL mode, and the bus speed directly impacts peripheral timing, including CAN bit rate generation and ADC sampling intervals. The MC9S08DV16CLC must be configured correctly in MCG registers to sustain this performance across voltage and temperature ranges.
Does the MC9S08DV16CLC support CAN FD or only classical CAN?
The MC9S08DV16CLC supports only classical CAN (ISO 11898-1, CAN 2.0A/B) through its MSCAN module. It does not support CAN FD features such as flexible data-rate, extended data length, or CRC enhancements. For CAN FD applications, designers should consider newer NXP families like S32K1 or S9S08DZ with CAN FD controllers. The MC9S08DV16CLC remains fully compatible with existing CAN 2.0 networks used in legacy automotive and industrial systems.
How much RAM is available on the MC9S08DV16CLC?
The MC9S08DV16CLC includes 2 KB of on-chip RAM, as confirmed by device-specific memory mapping in the MC9S08DV60 Series Data Sheet (Rev 3, Section 4.4). While the family overview states "up to 3 KB", the actual allocation for MC9S08DV16CLC is 2 KB - sufficient for stack, heap, and peripheral buffers in typical automotive body control applications. This value is fixed per device variant and cannot be increased via configuration.
Is the MC9S08DV16CLC pin-compatible with other MC9S08DVx devices in the same package?
Yes, the MC9S08DV16CLC in the 48-pin LQFP package is pin-compatible with MC9S08DV32CLC and MC9S08DV48CLC in the same package variant. All share identical pin assignments, electrical characteristics, and peripheral mappings per the MC9S08DV60 Series Data Sheet. This allows hardware reuse across variants - for example, designing one PCB that supports 16 KB, 32 KB, or 48 KB flash versions via firmware-only differentiation.
What debug interface does the MC9S08DV16CLC use, and what tools support it?
The MC9S08DV16CLC uses a single-wire background debug (BDM) interface compliant with the Freescale/NXP BDM specification. Supported tools include the P&E Micro USB-ML-128 debugger, SEGGER J-Link with BDM firmware, and older Freescale DEMO9S08DV60 evaluation boards. Debugging requires only BKGD/MS and RESET pins - no dedicated JTAG header - enabling minimal PCB footprint and simplified bring-up for production programming and field diagnostics.
MC9S08DV16CLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV16CLC FAQ
1.How can I place an order for MC9S08DV16CLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV16CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV16CLC reliable?
The price and inventory of MC9S08DV16CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV16CLC is usually 5 days.
3.What payment methods are accepted for MC9S08DV16CLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV16CLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV16CLC?
MC9S08DV16CLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV16CLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV16CLC?
For technical support, including MC9S08DV16CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV16CLC requirements.
6.How does Aetrix verify that MC9S08DV16CLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DV16CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV16CLC meets industry standards.
7.What is the process for return or replacement of MC9S08DV16CLC?
All MC9S08DV16CLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV16CLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV16CLC part is unused and in its original packaging.
Return procedure for MC9S08DV16CLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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