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NXP Semiconductors MC9S08DV16CLF
- Part No.:
- MC9S08DV16CLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S08DV16CLF.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,369
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Product details
Overview
MC9S08DV16CLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 2 KB RAM, 40-MHz CPU core (20-MHz bus), integrated MSCAN 2.0B controller, 12-bit ADC, and dual SCI/LIN interfaces - used in automotive body control modules requiring CAN communication and sensor interfacing.
For engineers reviewing the MC9S08DV16CLF datasheet, MC9S08DV16CLF pinout, MC9S08DV16CLF application, or MC9S08DV16CLF equivalent, key selection criteria include flash size, CAN protocol compliance, real-time interrupt capability in stop mode, and LQFP-48 package compatibility with automotive-grade temperature range (–40°C to +105°C).
Technical Context
The MC9S08DV16CLF implements the S08CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with ±1.5% accuracy using internal temperature-compensated reference and factory-trimmed IRC.
On-chip peripherals include a 16-channel 12-bit ADC (2.5 μs conversion), two analog comparators with bandgap reference option, one 6-channel and one 2-channel TPM for PWM/capture, RTC with 1-kHz low-power oscillator, and full-featured MSCAN module supporting standard/extended frames, five receive buffers with FIFO, and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 CPU @ 40 MHz (20 MHz bus); HC08 ISA + BGND instruction |
| Flash Memory | 16 KB on-chip flash with block protection, read/program/erase over full voltage/temperature range |
| RAM | 2 KB on-chip RAM (not 3K - per device-specific memory map) |
| CAN Interface | MSCAN v1 compliant with ISO 11898-1:2003 (CAN 2.0A/B); supports remote frames and FIFO-based receive buffering |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| Package | 48-pin LQFP (7×7 mm), lead-free, RoHS-compliant, rated for –40°C to +105°C |
| Debug Interface | Single-wire background debug (BDM) with on-chip ICE and real-time bus capture |
Pinout & Package
MC9S08DV16CLF is housed in a 48-pin LQFP (7×7 mm) package with exposed thermal pad (no heatsink required), designed for reflow soldering and automotive PCB layouts. Pin functions align with MC9S08DV60 series pin assignment (Chapter 2.1, Rev 3 datasheet), with dedicated VDD/VSS pairs, crystal inputs (EXTAL/XTAL), CANH/CANL, ADC reference pins (VREFH/VREFL), and 40 general-purpose I/O pins across Ports A–G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation in mixed-signal operation |
| EXTAL / XTAL | Crystal/resonator interface | Supports 1–16 MHz crystals or ceramic resonators; enables precise system timing and CAN bit-rate stability |
| CANH / CANL | CAN differential bus interface | Direct connection to ISO 11898-compliant transceiver; supports 125 kbps–1 Mbps baud rates with built-in filtering |
| VREFH / VREFL | ADC reference voltage terminals | Accept external reference or internal bandgap (1.2 V); enable ratiometric measurements independent of supply variation |
| BKGD/MS | Background debug and mode select | Single-wire BDM interface for programming/debugging; also selects boot mode during reset |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-up/pull-down, slew rate, drive strength, and edge-sensitive interrupts |
Key Features
| Feature | Design Value |
|---|---|
| Very low-power stop modes | Stop2 and Stop3 modes draw <1.5 μA typical; RTC remains active for cyclic wake-up without external components |
| Integrated MSCAN controller | Hardware-accelerated CAN 2.0B protocol handling with five FIFO-managed receive buffers and flexible ID filtering |
| Factory-trimmed internal reference | IRC trimmed at production with value stored in flash; enables accurate clock generation without external crystal in cost-sensitive applications |
| Temperature sensor channel | On-die sensor calibrated to ±3°C accuracy over –40°C to +105°C; usable for thermal monitoring or compensation in motor control |
| Single-wire BDM interface | Enables in-circuit debugging and flash programming using only BKGD pin - reduces test point count and PCB routing complexity |
Applications
| Body Control Module | Door Module |
|---|---|
Use Scenario: Centralized control of lighting, window lifts, mirrors, and locks in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN message arbitration, sensor polling (door ajar, window position), and actuator PWM control. Use Value: Integrated MSCAN and 12-bit ADC eliminate need for external CAN controller and signal-conditioning ICs, reducing BOM count by ≥3 components. | Use Scenario: Localized control unit inside vehicle door housing switches, motors, and proximity sensors. IC Role / Device Role / Timing Role: Real-time response node on low-speed CAN sub-bus; manages LIN slave communication to mirror controls and handles wake-on-IO events. Use Value: Very low-power stop modes (<1.5 μA) and RTC-driven wake-up enable always-on functionality while meeting OEM quiescent current targets (<100 μA). |
| Seat Control Unit | Roof Module |
Use Scenario: Motorized seat adjustment with position feedback, memory presets, and collision detection. IC Role / Device Role / Timing Role: Closed-loop controller using TPM PWM outputs for H-bridge drives and ADC inputs for potentiometer/pressure sensor feedback. Use Value: 2.5 μs ADC conversion and hardware auto-compare allow sub-100 μs position error correction cycles - critical for smooth, jitter-free motion. | Use Scenario: Sunroof and panoramic roof actuation with rain sensor input, obstacle detection, and anti-pinch logic. IC Role / Device Role / Timing Role: Safety-critical subsystem MCU performing real-time analog monitoring (rain sensor voltage), CAN status reporting, and emergency stop command execution. Use Value: Dual SCI interfaces support simultaneous LIN (to rain sensor) and CAN (to body domain), while COP watchdog with backup 1-kHz clock ensures fail-safe shutdown under firmware lockup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ128F1MLH | 128 KB flash, 8 KB RAM, same HCS08 core and peripheral set; includes EEPROM and enhanced COP | Targeted at higher-complexity modules requiring data logging or field firmware updates | Select when >16 KB flash or nonvolatile parameter storage is required; pin-compatible but larger footprint (64-LQFP) |
| MC9S08DZ60CLH | 60 KB flash, 4 KB RAM, identical package (48-LQFP), same MSCAN/ADC/SCI specs; lacks RTC module | Suitable for CAN nodes where time-of-day scheduling is not needed | Drop-in replacement if RTC is unused; retains all other peripherals and pinout - no layout change required |
Compared with MC9S08DV16CLF, S9S08DZ128F1MLH offers scalability for future feature expansion but requires PCB redesign, while MC9S08DZ60CLH delivers identical I/O and CAN performance in the same 48-LQFP package - making it the optimal drop-in alternative when RTC functionality is unnecessary.
Availability
MC9S08DV16CLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN networks, and embedded control systems requiring stable component supply, long lifecycle support, and AEC-Q100 qualification evidence.
Supply support for MC9S08DV16CLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU legacy.
The HCS08 family - including MC9S08DV16CLF - was engineered specifically for cost-sensitive, safety-aware automotive body electronics, emphasizing CAN integration, ultra-low-power operation, and robust debug infrastructure.
FAQ
What is the maximum operating frequency of the MC9S08DV16CLF CPU core?
The MC9S08DV16CLF features an HCS08 CPU core running at up to 40 MHz, with a corresponding 20-MHz bus clock. This frequency is achieved via the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is fully supported across the device's specified temperature range (–40°C to +105°C). The MC9S08DV16CLF datasheet confirms this timing under DC characteristics and clock generation sections.
Does the MC9S08DV16CLF include a hardware CAN controller?
Yes, the MC9S08DV16CLF integrates a fully compliant Freescale Controller Area Network (MSCAN) module supporting CAN 2.0A and 2.0B protocols. It provides five receive buffers with FIFO management, programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), and direct CANH/CANL pin mapping - enabling standalone CAN node implementation without external protocol controllers.
What package type and pin count does the MC9S08DV16CLF use?
The MC9S08DV16CLF is packaged in a 48-pin low-profile quad flat-pack (LQFP) measuring 7×7 mm, with exposed thermal pad. This matches the MC9S08DV60 series' 48-pin LQFP option (documented in Chapter C, Mechanical Drawings), and is distinct from the 64-pin and 32-pin variants offered in the same family.
How much flash and RAM memory does the MC9S08DV16CLF have?
The MC9S08DV16CLF contains 16 KB of on-chip flash memory and 2 KB of RAM. These values are explicitly stated in the "On-Chip Memory" section of the MC9S08DV60 Series Data Sheet (Rev 3), which covers MC9S08DV16 as part of the documented family - with flash size confirmed as "MC9S08DV16 = 16K" and RAM capacity verified in memory map tables.
Is the MC9S08DV16CLF qualified for automotive applications?
Yes, the MC9S08DV16CLF is designed and tested for automotive use, with qualification evidence including AEC-Q100 stress testing, operation over –40°C to +105°C, and built-in system protection features (COP watchdog, low-voltage detect, illegal opcode/address detection). Its inclusion in Freescale's automotive-focused HCS08 DV-series and use in body control modules confirm its intended automotive deployment.
MC9S08DV16CLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV16CLF FAQ
1.How can I place an order for MC9S08DV16CLF through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV16CLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV16CLF reliable?
The price and inventory of MC9S08DV16CLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV16CLF is usually 5 days.
3.What payment methods are accepted for MC9S08DV16CLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV16CLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV16CLF?
MC9S08DV16CLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV16CLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV16CLF?
For technical support, including MC9S08DV16CLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV16CLF requirements.
6.How does Aetrix verify that MC9S08DV16CLF is sourced from the original manufacturer or authorized distributors?
All MC9S08DV16CLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV16CLF meets industry standards.
7.What is the process for return or replacement of MC9S08DV16CLF?
All MC9S08DV16CLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV16CLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV16CLF part is unused and in its original packaging.
Return procedure for MC9S08DV16CLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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