NXP Semiconductors MC9S08DV16MLC
- Part No.:
- MC9S08DV16MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DV16MLC.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,434
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08DV16MLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip flash, 3 KB RAM, and integrated MSCAN, ADC, SPI, I²C, SCI, TPM, RTC, and analog comparators - designed for automotive body electronics and industrial control nodes requiring CAN connectivity and low-power operation.
For engineers reviewing the MC9S08DV16MLC datasheet, MC9S08DV16MLC pinout, MC9S08DV16MLC application, or MC9S08DV16MLC equivalent, key selection criteria include its 16 KB flash capacity, 53 GPIO + 1 input-only pin, dual SCI supporting LIN 2.0/SAE J2602, and MSCAN v2.0 A/B compliance in a 48-pin LQFP package.
Technical Context
The MC9S08DV16MLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with HC08 instruction set extension including BGND for background debug. It supports up to 32 interrupt/reset sources and features a Multi-Purpose Clock Generator (MCG) with FLL (±1.5% accuracy using internal temperature compensation) and PLL modes.
Its system protection includes COP watchdog with dual clock source options (1 kHz internal or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, and flash block protection - all critical for automotive-grade reliability in harsh environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core / 20-MHz bus frequency |
| Flash Memory | 16 KB on-chip flash with read/program/erase over full voltage/temperature range |
| RAM | Up to 3 KB on-chip RAM for data storage and stack operations |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), with five receive buffers and programmable acceptance filters |
| ADC | 12-bit, 16-channel SAR ADC with 2.5 µs conversion time, internal temperature sensor, and bandgap reference channel |
| Package | 48-pin LQFP (7×7 mm), RoHS-compliant, lead-free |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up capability |
Pinout & Package
MC9S08DV16MLC is housed in a 48-pin low-profile quad flat-pack (LQFP) measuring 7×7 mm with exposed thermal pad. Pin functions are defined per the MC9S08DV60 Series Data Sheet Rev 3 (2008), covering all DV-series variants including MC9S08DV16.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation in mixed-signal operation |
| XTAL, EXTAL | Crystal/resonator interface | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals for precise clock sourcing and MCG reference |
| BKGD/MS | Background debug and mode select | Single-wire debug interface pin; also selects active background mode during reset |
| VREFH, VREFL | ADC reference inputs | External or internal (bandgap) reference selection enables flexible analog measurement ranges |
| PTA0–PTA7, PTB0–PTB7, PTC0–PTC7, PTD0–PTD7, PTE0–PTE7, PTF0–PTF7, PTG0–PTG7 | GPIO and peripheral multiplexing | 53 general-purpose I/O pins with configurable pull, slew rate, drive strength, and interrupt polarity |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN v2.0 A/B | Enables robust automotive network communication without external CAN transceiver logic |
| Real-time counter (RTC) | 8-bit modulus counter with external clock input or internal 1-kHz oscillator for time-of-day/calendar functions without external components |
| Single-wire background debug | Reduces debug footprint and PCB routing complexity versus traditional JTAG interfaces |
| On-chip ICE with bus capture | Allows real-time trace of instruction execution and peripheral register changes during development |
| Flash block protection | Prevents accidental overwrite of bootloader or safety-critical firmware sections during field updates |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lifts, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN message handling, PWM motor control, and analog sensor acquisition (e.g., door position, ambient light). Use Value: 16 KB flash accommodates layered AUTOSAR-like software stacks; MSCAN ensures deterministic communication with gateway ECUs. | Use Scenario: Localized control of power windows, central locking, and mirror adjustment in vehicle door assemblies. IC Role / Device Role / Timing Role: Dedicated node managing local actuator drivers and switch inputs via GPIO and TPM PWM outputs. Use Value: 53 GPIO support multi-function pin sharing; low-power stop modes extend battery life during vehicle sleep states. |
| Industrial CAN Node | Smart Sensor Hub |
Use Scenario: Field device in factory automation networks requiring CAN-based command/response and diagnostics. IC Role / Device Role / Timing Role: Protocol handler and I/O aggregator interfacing with discrete sensors, relays, and status LEDs. Use Value: Dual SCI ports enable LIN-based local diagnostics while MSCAN handles main network traffic - no second MCU required. | Use Scenario: Multi-sensor data concentrator in HVAC or building automation systems with temperature, humidity, and occupancy sensing. IC Role / Device Role / Timing Role: Signal conditioner and scheduler using internal ADC, ACMP, RTC, and bandgap reference for self-calibration. Use Value: Integrated 12-bit ADC with temperature sensor and bandgap reference eliminates external precision references and reduces BOM count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ128MLH | 128 KB flash, 8 KB RAM, same HCS08 core and peripheral set; adds EEPROM and enhanced CAN filtering | Targeted at higher-complexity gateways or telematics modules requiring larger firmware and nonvolatile parameter storage | Select when >16 KB code space or EEPROM-based calibration data persistence is required |
| S9S08DZ128F2MLH | NXP rebranded successor with identical pinout, memory map, and peripheral registers; qualified for extended temperature range (−40°C to 125°C) | Designed for under-hood automotive applications where ambient temperature exceeds 105°C | Choose for new designs needing extended temp qualification and long-term NXP product continuity |
Compared with MC9S08DV16MLC, MC9S08DZ128MLH offers scalable memory for evolving firmware but increases cost and power; S9S08DZ128F2MLH provides identical functionality with extended temperature rating and updated lifecycle support - making it the preferred drop-in upgrade path for new designs.
Availability
MC9S08DV16MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, and smart sensor hubs requiring stable component supply across extended production lifecycles.
Supply support for MC9S08DV16MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's microcontroller legacy.
The MC9S08DV16MLC belongs to the HCS08 DV-series - engineered specifically for cost-sensitive, CAN-enabled automotive body control and industrial control applications demanding high integration and ASIL-ready functional safety foundations.
FAQ
What is the maximum operating frequency of the MC9S08DV16MLC CPU core?
The MC9S08DV16MLC CPU core operates at up to 40 MHz, with a corresponding 20 MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is fully supported across the rated voltage and temperature range specified in the datasheet.
Does the MC9S08DV16MLC support CAN FD or only classical CAN?
The MC9S08DV16MLC supports only classical CAN (ISO 11898-1, CAN 2.0A/B) via its MSCAN module - not CAN FD. Its MSCAN implementation includes five receive buffers, programmable identifier filters, and full support for standard and extended frames, but lacks the bit-rate switching and payload expansion required for CAN FD.
How much SRAM does the MC9S08DV16MLC provide for runtime data storage?
The MC9S08DV16MLC integrates up to 3 KB of on-chip RAM for stack, heap, and variable storage. This SRAM is accessible at full bus speed and retains data during wait mode, though contents are lost in stop modes unless configured with specific retention settings - which are not supported by this variant.
Is the MC9S08DV16MLC pin-compatible with other members of the DV-series like MC9S08DV32 or MC9S08DV48?
Yes - the MC9S08DV16MLC shares identical pinout, package dimensions, and peripheral register mapping with MC9S08DV32MLC, MC9S08DV48MLC, and MC9S08DV60MLC in the same 48-pin LQFP package. Firmware developed for one can be reused across others with only flash size and RAM allocation adjustments.
What debug interface does the MC9S08DV16MLC use, and what hardware is required?
The MC9S08DV16MLC uses a single-wire background debug (BKGD) interface via the BKGD/MS pin. Debugging requires a compatible BDM pod (e.g., PE Micro Cyclone or NXP DEMO9S08DV16) and no additional pins - eliminating the need for SWD/JTAG headers and simplifying board layout for space-constrained automotive modules.
MC9S08DV16MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV16MLC FAQ
1.How can I place an order for MC9S08DV16MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV16MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV16MLC reliable?
The price and inventory of MC9S08DV16MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV16MLC is usually 5 days.
3.What payment methods are accepted for MC9S08DV16MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV16MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV16MLC?
MC9S08DV16MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV16MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV16MLC?
For technical support, including MC9S08DV16MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV16MLC requirements.
6.How does Aetrix verify that MC9S08DV16MLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DV16MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV16MLC meets industry standards.
7.What is the process for return or replacement of MC9S08DV16MLC?
All MC9S08DV16MLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV16MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV16MLC part is unused and in its original packaging.
Return procedure for MC9S08DV16MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08DV16MLC Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

