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NXP Semiconductors MC9S08DV32AMLC

Part No.:
MC9S08DV32AMLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08DV32AMLC.pdf
Description:
IC MCU 8BIT 32KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,924

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Product details

Overview

MC9S08DV32AMLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 3 KB RAM, 53 GPIO pins, and integrated MSCAN, ADC12, TPM, SCI, SPI, IIC, RTC, and ACMP peripherals - used in automotive body control modules requiring CAN communication and real-time sensor processing.

For engineers reviewing the MC9S08DV32AMLC datasheet, MC9S08DV32AMLC pinout, MC9S08DV32AMLC application, or MC9S08DV32AMLC equivalent, key selection criteria include CAN 2.0A/B compliance, 12-bit ADC with temperature sensor, single-wire BDM debug interface, and support for Stop2/Stop3 low-power modes in automotive environments.

Technical Context

The MC9S08DV32AMLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal support from 31.25 kHz to 16 MHz.

On-chip system protection includes COP watchdog with dual-clock source (1 kHz internal or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, flash block protection, and loss-of-lock monitoring - all designed for functional safety in automotive ECUs.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40-MHz operation (20-MHz bus frequency)
Flash Memory32 KB on-chip flash with read/program/erase over full voltage/temperature range
RAMUp to 3 KB SRAM for data and stack storage
ADC16-channel, 12-bit resolution, 2.5 μs conversion time, internal bandgap reference and temperature sensor channel
CAN InterfaceMSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), five receive buffers with FIFO, programmable acceptance filters
Power ModesTwo very low-power stop modes (Stop2, Stop3), reduced-power wait mode, and real-time interrupt wake-up capability
I/O Pins53 general-purpose I/O pins + 1 input-only pin; configurable slew rate, drive strength, hysteresis, and pull devices

Pinout & Package

MC9S08DV32AMLC is packaged in a 64-pin LQFP (10 × 10 mm) with exposed thermal pad. Pin assignments are defined per Chapter 2 of the MC9S08DV60 Series Data Sheet Rev 3 (covers MC9S08DV32).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation in mixed-signal operation
XTAL, EXTALCrystal/resonator connectionSupports Pierce oscillator for 31.25 kHz–16 MHz crystals; enables precise timing for CAN bit sampling and RTC
BKGD/MSBackground debug / mode selectSingle-wire BDM interface for programming and real-time debugging without halting CPU execution
VREFH, VREFLADC reference inputsExternal or internal reference selection; allows ratiometric measurements and high-accuracy sensor interfacing
PTA0–PTA7, PTB0–PTB7, etc.Port A–G I/O pins53 GPIO with interrupt-on-change capability, individually configurable pull, slew, and drive strength for robust automotive signal routing
CANH, CANLCAN transceiver interfaceDifferential bus lines directly connected to external CAN PHY; supports 1 Mbps nominal bit rate per ISO 11898-2

Key Features

FeatureDesign Value
MSCAN ModuleHardware-accelerated CAN 2.0A/B controller with five RX buffers and flexible identifier filtering - reduces CPU load and ensures deterministic message handling in vehicle networks
Real-Time Counter (RTC)8-bit modulus counter with binary/decimal prescaler and free-running 1 kHz on-chip oscillator - enables cyclic wake-up from Stop modes without external components
ADC12 with Temp Sensor12-bit, 16-channel converter including dedicated internal temperature sensor and bandgap reference - supports closed-loop thermal management and calibration in ECUs
Multi-Purpose Clock Generator (MCG)FLL+PLL architecture with factory-trimmed internal reference and temperature compensation - delivers ±1.5% frequency accuracy across voltage/temperature without external crystal
Single-Wire BDMBackground debug interface using BKGD/MS pin only - enables in-system programming and real-time trace without dedicated JTAG pins or debug headers

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized control of lighting, windows, locks, and mirrors in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN message routing, PWM dimming control, and fault diagnostics.

Use Value: Integrated MSCAN and 53 GPIO enable direct connection to door switches, LIN slaves, and LED drivers - eliminating external logic and reducing BOM count.

Use Scenario: Local control unit inside vehicle door managing window lift, mirror adjustment, and anti-pinch sensing.

IC Role / Device Role / Timing Role: Real-time sensor acquisition node with CAN reporting and local actuator control.

Use Value: On-chip 12-bit ADC with temperature sensor and internal bandgap reference supports accurate motor current monitoring and thermal derating without external ICs.

Roof Module ControllerSeat Control Unit

Use Scenario: Sunroof, panoramic roof, and interior lighting control with rain/light sensors.

IC Role / Device Role / Timing Role: Mixed-signal processor handling analog sensor inputs, PWM outputs, and CAN status reporting.

Use Value: Dual power domains (VDDAD/VSSAD) and hysteresis on all inputs ensure reliable operation in electrically noisy roof harness environments.

Use Scenario: Motorized seat position memory, heating, and lumbar support with occupant detection.

IC Role / Device Role / Timing Role: Safety-critical actuator controller with watchdog supervision and low-voltage detection.

Use Value: COP watchdog with backup 1-kHz internal clock and configurable LVD trip points meet ASIL-B readiness requirements for seat ECU functional safety.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DV32F1MLCSame core, package, and peripheral set; differs in flash endurance (100k vs. 10k erase cycles) and qualification grade (automotive AEC-Q100 Grade 2 vs. Grade 3)Targeted for higher-reliability automotive applications requiring extended temperature range (−40°C to 105°C) and longer flash lifeSelect S9S08DV32F1MLC when operating above 85°C ambient or requiring >50k flash program/erase cycles over product lifetime
MC9S08DZ32CLCSame 32 KB flash and HCS08 core but uses different peripheral mix: adds EEPROM (2 KB), removes MSCAN, adds USB interface and enhanced ADC featuresSuitable for non-CAN applications needing data logging (EEPROM) or host connectivity (USB), not drop-in replacement for CAN-based designsChoose MC9S08DZ32CLC only if CAN is not required and USB device or non-volatile parameter storage is critical

Compared with S9S08DV32F1MLC and MC9S08DZ32CLC, the MC9S08DV32AMLC offers optimal balance of CAN capability, flash endurance, and cost for mainstream automotive body electronics - with no compromise on BDM debug, RTC, or analog integration needed in BCM and door modules.

Availability

MC9S08DV32AMLC is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof systems, and seat control units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for MC9S08DV32AMLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08DV32AMLC belongs to the HCS08 DV-series microcontrollers, designed specifically for cost-sensitive, CAN-enabled automotive body electronics where reliability, low-power operation, and integrated analog peripherals are essential.

FAQ

What is the maximum bus frequency supported by the MC9S08DV32AMLC?

The MC9S08DV32AMLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a 2:1 divider. This bus speed enables deterministic timing for CAN bit sampling, ADC conversions, and peripheral register access while maintaining compatibility with legacy 20-MHz automotive timing budgets.

Does the MC9S08DV32AMLC include an integrated CAN controller?

Yes, the MC9S08DV32AMLC integrates the MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supporting standard and extended frames, remote frame handling, five receive buffers with FIFO, and programmable identifier filters - enabling direct connection to external CAN transceivers without additional protocol logic.

What type of debug interface does the MC9S08DV32AMLC support?

The MC9S08DV32AMLC supports a single-wire background debug (BDM) interface via the BKGD/MS pin. This allows full in-circuit emulation, real-time bus capture, flash programming, and breakpoint debugging without halting CPU execution or requiring multi-pin debug connectors.

How much flash memory and RAM does the MC9S08DV32AMLC provide?

The MC9S08DV32AMLC provides 32 KB of on-chip flash memory for program storage and up to 3 KB of RAM for data and stack operations. Flash supports read/program/erase across full operating voltage and temperature ranges, with block protection and security features enabled via dedicated registers.

Is the MC9S08DV32AMLC qualified for automotive applications?

Yes, the MC9S08DV32AMLC is AEC-Q100 qualified (Grade 3: −40°C to 85°C ambient), featuring system-level protections including COP watchdog with dual-clock source, low-voltage detect with interrupt/reset, illegal opcode/address detection, and flash block protection - meeting baseline functional safety requirements for automotive body electronics.

MC9S08DV32AMLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DV32AMLC FAQ

1.How can I place an order for MC9S08DV32AMLC through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DV32AMLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DV32AMLC reliable?

The price and inventory of MC9S08DV32AMLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV32AMLC is usually 5 days.

3.What payment methods are accepted for MC9S08DV32AMLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV32AMLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DV32AMLC?

MC9S08DV32AMLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DV32AMLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DV32AMLC?

For technical support, including MC9S08DV32AMLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV32AMLC requirements.

6.How does Aetrix verify that MC9S08DV32AMLC is sourced from the original manufacturer or authorized distributors?

All MC9S08DV32AMLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV32AMLC meets industry standards.

7.What is the process for return or replacement of MC9S08DV32AMLC?

All MC9S08DV32AMLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV32AMLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DV32AMLC part is unused and in its original packaging.

Return procedure for MC9S08DV32AMLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08DV32AMLC Tags

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