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NXP Semiconductors MC9S08DV32AMLH

Part No.:
MC9S08DV32AMLH
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixMC9S08DV32AMLH.pdf
Description:
IC MCU 8BIT 32KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:646

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Product details

Overview

MC9S08DV32AMLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 3 KB RAM, 53 GPIO pins, and integrated CAN 2.0A/B controller, ADC, SPI, I²C, SCI, TPM, and RTC - designed for automotive body electronics and industrial control systems requiring robust real-time communication and low-power operation.

For engineers reviewing the MC9S08DV32AMLH datasheet, MC9S08DV32AMLH pinout, MC9S08DV32AMLH application, or MC9S08DV32AMLH equivalent, key selection criteria include flash size, CAN protocol support, 12-bit ADC resolution, stop-mode power consumption, and LQFP-48 package compatibility with automotive-grade temperature range (−40°C to +105°C).

Technical Context

The MC9S08DV32AMLH implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND debug instruction. Its Multi-Purpose Clock Generator (MCG) provides FLL/PLL modes with internal reference trimming and external crystal support from 1 MHz to 16 MHz.

On-chip peripherals include a 16-channel 12-bit ADC with 2.5 µs conversion time and temperature sensor, two analog comparators, MSCAN module with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), and dual SCI interfaces compliant with LIN 2.0 and SAE J2602 protocols.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40-MHz max core clock (20-MHz bus)
Flash Memory32 KB on-chip flash with block protection and in-system programming
RAM3 KB SRAM for data and stack storage
CAN InterfaceMSCAN module supporting CAN 2.0A/B, standard/extended frames, remote frames, and FIFO-based reception
ADC16-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference and temperature sensor channel
Package48-pin LQFP (7×7 mm), RoHS-compliant, rated for −40°C to +105°C
Power ModesTwo very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up capability

Pinout & Package

MC9S08DV32AMLH is housed in a 48-pin low-profile quad flat-pack (LQFP) package measuring 7×7 mm with 0.5 mm pitch. Pin functions are defined per the official MC9S08DV60 Series Data Sheet Rev 3 (June 2008), covering all variants including MC9S08DV32.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation
XTAL, EXTALCrystal oscillator inputsSupports 1–16 MHz crystals/resonators; enables precise clock source for CAN timing and RTC
BKGD/MSSingle-wire background debugEnables in-circuit debugging and flash programming without dedicated JTAG pins
RESETActive-low reset inputAsynchronous reset with internal pull-up; supports external reset supervisor integration
AD0–AD15Analog input channels16 of 53 GPIO pins configurable as ADC inputs; includes dedicated temperature sensor channel
CANL, CANHCAN bus differential pairDirect connection to ISO 11898-compliant transceiver; supports bit rates up to 1 Mbps
SCI1_TX, SCI1_RXSerial communication interfaceFull-duplex NRZ UART supporting LIN 2.0 master/slave and SAE J2602 wakeup framing
TPM1_CH0–CH5Timer/PWM outputs6-channel TPM1 supports input capture, output compare, and edge-aligned PWM for motor control or LED dimming

Key Features

FeatureDesign Value
Integrated MSCAN ControllerEnables deterministic, fault-tolerant vehicle network communication without external CAN controller IC
12-bit ADC with Temp SensorProvides calibrated on-die temperature measurement and high-resolution analog sensing for closed-loop control
Multi-Purpose Clock Generator (MCG)Eliminates need for multiple external clocks by supporting FLL, PLL, internal trimmed IRC, and crystal sources
Two Very Low-Power Stop ModesReduces current draw to sub-µA levels while retaining RAM content and enabling wake-up via CAN, RTC, or GPIO
Single-Wire Background DebugAllows full debug visibility and flash reprogramming using only one dedicated pin (BKGD/MS)

Applications

Automotive Body Control ModuleIndustrial Motor Drive Interface

Use Scenario: Centralized control of door locks, window lifts, mirrors, and lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN message routing, PWM-driven actuator control, and LIN slave communication with sensors.

Use Value: Integrated MSCAN and dual SCI reduce BOM count; 32 KB flash accommodates AUTOSAR-compliant firmware with diagnostics and calibration tables.

Use Scenario: Local intelligence for BLDC motor drivers in HVAC blowers or conveyor systems.

IC Role / Device Role / Timing Role: Real-time PWM generation (TPM), current sensing (ADC), and fault reporting over CAN bus.

Use Value: 6-channel TPM1 enables three-phase commutation; 12-bit ADC resolves current feedback with <1% error across temperature.

Smart Power Distribution UnitCommercial Lighting Controller

Use Scenario: Fuseless load switching and energy monitoring in 12 V/24 V vehicle electrical centers.

IC Role / Device Role / Timing Role: System manager coordinating load enable/disable, voltage/current monitoring, and CAN-based fault logging.

Use Value: On-chip ADC and comparators replace discrete sensing circuitry; stop-mode operation extends battery life during sleep cycles.

Use Scenario: DALI-2 or 0–10 V dimmable LED driver with local occupancy and ambient light sensing.

IC Role / Device Role / Timing Role: Sensor hub aggregating photodiode and PIR data, generating PWM dimming signals, and communicating via UART or CAN.

Use Value: Internal temperature sensor compensates LED lumen drift; 53 GPIO support multi-zone control without external expanders.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DZ32F1MLHSuccessor part in S08DZ family; same 32 KB flash, but enhanced CAN timing accuracy and improved ESD immunity (±8 kV HBM)Preferred for new designs requiring extended CAN bit timing tolerance and higher EMC robustness in harsh environmentsSelect S9S08DZ32F1MLH when upgrading legacy platforms or targeting ASIL-B functional safety requirements
MC9S08AC32CPUESame HCS08 core and 32 KB flash, but lacks MSCAN; features enhanced ADC with PGA and more SCI modulesBetter suited for sensor fusion or serial gateway applications where CAN is not required but multiple UARTs are criticalChoose MC9S08AC32CPUE if CAN is unnecessary and additional serial interfaces or analog front-end gain control are needed

Compared with MC9S08DV32AMLH, S9S08DZ32F1MLH offers tighter CAN timing compliance and higher ESD rating for next-gen automotive nodes, while MC9S08AC32CPUE trades CAN for expanded serial connectivity and programmable analog gain - making each alternative optimal only under distinct system-level constraints.

Availability

MC9S08DV32AMLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, smart power distribution units, and commercial lighting controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08DV32AMLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.

The MC9S08DV32AMLH belongs to the HCS08 DV-series, engineered specifically for cost-sensitive, real-time automotive body control and industrial automation applications demanding integrated CAN, low-power operation, and high peripheral integration.

FAQ

What is the maximum operating frequency of the MC9S08DV32AMLH CPU core?

The MC9S08DV32AMLH CPU core operates at up to 40 MHz, with a corresponding 20 MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full −40°C to +105°C temperature range specified for the MC9S08DV32AMLH device.

Does the MC9S08DV32AMLH support CAN FD or only classical CAN?

The MC9S08DV32AMLH supports only Classical CAN (ISO 11898-1, CAN 2.0A/B) with standard and extended identifiers, remote frames, and five receive buffers. It does not implement CAN FD features such as flexible data-rate, larger payloads, or CRC enhancements - those capabilities require newer S32K or MPC5xxx families beyond the MC9S08DV32AMLH architecture.

How much SRAM is available on the MC9S08DV32AMLH, and is it retained in low-power modes?

The MC9S08DV32AMLH includes 3 KB of on-chip SRAM. This memory is fully retained in Wait mode and both Stop2 and Stop3 modes, provided VDD remains within specification. Retention is confirmed in the MC9S08DV60 Series Data Sheet Rev 3, Section 3.6.3, which specifies that RAM contents persist during all supported low-power states of the MC9S08DV32AMLH.

What debug interface does the MC9S08DV32AMLH use, and what hardware is required?

The MC9S08DV32AMLH uses a single-wire background debug (BDM) interface via the BKGD/MS pin. No JTAG header is needed; only a compatible BDM pod (e.g., PE Micro Cyclone or Segger J-Link with BDM firmware) and a simple 6-pin ribbon cable are required to perform full flash programming, breakpoint debugging, and real-time register inspection on the MC9S08DV32AMLH.

Is the internal temperature sensor on the MC9S08DV32AMLH factory-calibrated, and how is its value accessed?

Yes, the internal temperature sensor on the MC9S08DV32AMLH is factory-calibrated and accessible as ADC channel ADP16 (or AD16 depending on configuration). Its output is referenced to the internal bandgap voltage, and raw ADC readings must be converted using coefficients stored in flash memory - details are provided in Section 10.1.5 of the MC9S08DV60 Series Data Sheet Rev 3 applicable to the MC9S08DV32AMLH.

MC9S08DV32AMLH Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DV32AMLH FAQ

1.How can I place an order for MC9S08DV32AMLH through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DV32AMLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DV32AMLH reliable?

The price and inventory of MC9S08DV32AMLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV32AMLH is usually 5 days.

3.What payment methods are accepted for MC9S08DV32AMLH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV32AMLH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DV32AMLH?

MC9S08DV32AMLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DV32AMLH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DV32AMLH?

For technical support, including MC9S08DV32AMLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV32AMLH requirements.

6.How does Aetrix verify that MC9S08DV32AMLH is sourced from the original manufacturer or authorized distributors?

All MC9S08DV32AMLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV32AMLH meets industry standards.

7.What is the process for return or replacement of MC9S08DV32AMLH?

All MC9S08DV32AMLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV32AMLH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DV32AMLH part is unused and in its original packaging.

Return procedure for MC9S08DV32AMLH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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