NXP Semiconductors MC9S08DV32AVLC
- Part No.:
- MC9S08DV32AVLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DV32AVLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,043
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08DV32AVLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 2 KB RAM, 53 GPIO pins, and integrated CAN 2.0A/B controller, ADC, SPI, I²C, SCI, TPM, and RTC - designed for automotive body electronics and industrial control nodes requiring robust communication and low-power operation.
For engineers reviewing the MC9S08DV32AVLC datasheet, MC9S08DV32AVLC pinout, MC9S08DV32AVLC application, or MC9S08DV32AVLC equivalent, key selection criteria include its 32 KB flash size, CAN protocol support, 12-bit ADC with temperature sensor, dual SCI with LIN 2.0 compliance, and LQFP-48 package compatibility with board-level thermal and EMI constraints in automotive-grade environments.
Technical Context
The MC9S08DV32AVLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND debug instruction. Its Multi-Purpose Clock Generator (MCG) provides FLL/PLL modes with ±1.5% accuracy using internal temperature-compensated reference and factory-trimmed IRC.
On-chip peripherals include a 16-channel 12-bit ADC (2.5 µs conversion), two analog comparators with bandgap reference option, MSCAN module with five receive buffers and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit), and two SCIs supporting LIN 2.0 and SAE J2602 protocols with master/slave break generation/detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core clock (20-MHz bus) |
| Flash Memory | 32 KB on-chip flash with block protection, read/program/erase over full voltage/temperature range |
| RAM | 2 KB on-chip RAM (not 3K - confirmed per DV32-specific memory map in Rev 3 datasheet) |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames and remote frames |
| ADC | 16-channel, 12-bit resolution, 2.5 µs conversion time, includes internal temperature sensor and bandgap reference channel |
| Package | 48-pin LQFP (7×7 mm), lead-free, RoHS-compliant, rated for –40°C to +105°C ambient |
| Debug Interface | Single-wire background debug (BDM) with real-time bus capture via on-chip ICE |
Pinout & Package
MC9S08DV32AVLC is housed in a 48-pin low-profile quad flat-pack (LQFP) measuring 7×7 mm with 0.5 mm pitch. The package supports reflow soldering and meets automotive AEC-Q100 stress test requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (core/I/O), VSS (digital ground); separate VDDAD/VSSAD for analog subsystem |
| XTAL, EXTAL | Crystal/resonator interface | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; connects to MCG oscillator circuit for precision clock source |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface; also selects boot mode during reset; requires weak pull-up for normal operation |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signals or COP/LVD-generated resets |
| VREFH, VREFL | Analog reference inputs | Define ADC conversion range; support external reference or internal bandgap (1.25 V typical) |
| PTA0–PTA7, PTB0–PTB7, PTC0–PTC7, PTD0–PTD7, PTE0–PTE7, PTF0–PTF7, PTG0–PTG5 | General-purpose I/O ports | 53 total GPIO pins with configurable slew rate, drive strength, hysteresis, and pull devices; 24 support pin-interrupt with edge/level sensitivity |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B controller | Enables deterministic, fault-tolerant communication in automotive networks without external transceiver logic |
| 12-bit ADC with temperature sensor | Provides direct thermal monitoring and analog signal acquisition with <2.5 µs conversion latency for closed-loop control |
| Dual LIN-compliant SCI modules | Supports SAE J2602 and LIN 2.0 protocols including master break generation and slave wake-up detection |
| Multi-Purpose Clock Generator (MCG) | Delivers stable system clocks across run/wait/stop modes using FLL with ±1.5% accuracy and factory-trimmed internal reference |
| Two ultra-low-power stop modes | Reduces current consumption to <1 µA while retaining RAM content and enabling RTC wakeup via external or internal 1-kHz source |
Applications
| Automotive Door Module | Industrial Motor Control Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU managing CAN message routing, analog sensor reading (position, temperature), PWM motor drive timing, and LIN-based sub-node communication. Use Value: Integrated MSCAN and dual SCI eliminate external protocol translators; 32 KB flash accommodates firmware updates and diagnostic stacks per OEM requirements. | Use Scenario: Local intelligence for brushless DC motor drives in HVAC systems or conveyor controllers with position feedback and thermal protection. IC Role / Device Role / Timing Role: Real-time execution of commutation logic, ADC-based current sensing, and TPM-driven PWM generation with precise dead-time insertion. Use Value: On-chip 12-bit ADC with temperature sensor enables embedded thermal derating; RTC supports scheduled maintenance alerts without host intervention. |
| Commercial Vehicle Body Controller | Off-Highway Equipment Monitor |
Use Scenario: Consolidated control of lighting, wipers, horn, and battery management in trucks and buses operating under wide temperature and EMI conditions. IC Role / Device Role / Timing Role: System coordinator interfacing with CAN backbone, executing watchdog-monitored safety logic, and managing power sequencing via GPIO-controlled load switches. Use Value: AEC-Q100 qualified LQFP-48 package ensures mechanical reliability; COP watchdog with 1-kHz backup clock maintains fail-safe behavior during voltage sags. | Use Scenario: Sensor fusion hub in agricultural or construction machinery collecting engine RPM, hydraulic pressure, coolant temp, and operator inputs. IC Role / Device Role / Timing Role: Data aggregator with CAN message filtering, analog signal conditioning, and buffered SPI communication to display or telematics module. Use Value: Five MSCAN receive buffers with FIFO prevent message loss during burst traffic; 53 GPIO enable direct connection to diverse sensors and switches without glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DV48AVLC | 48 KB flash, same peripheral set and pinout; identical LQFP-48 package and electrical specs | Supports larger firmware images (e.g., multi-language UI, extended diagnostics) without layout change | Select when future firmware growth or ASAM-compliant calibration data storage is required |
| S9S08DZ32F2MLC | NXP S08DZ family successor; enhanced ESD immunity (±8 kV HBM), updated CAN FD readiness registers, same 32 KB flash and LQFP-48 | Designed for next-gen platforms requiring longer product lifecycle and higher EMC robustness | Choose for new designs targeting >15-year availability or ISO 11452-4 compliance |
Compared with MC9S08DV48AVLC and S9S08DZ32F2MLC, the MC9S08DV32AVLC offers optimal cost/performance balance for mature automotive body control applications where 32 KB flash suffices and legacy toolchain compatibility is critical.
Availability
MC9S08DV32AVLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control nodes, commercial vehicle body controllers, and off-highway equipment monitors requiring stable component supply across extended production lifecycles.
Supply support for MC9S08DV32AVLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.
The HCS08 DV-series was engineered specifically for cost-sensitive, high-reliability automotive body electronics and industrial control nodes demanding CAN, LIN, and robust analog integration in compact packages.
FAQ
What is the maximum operating frequency of the MC9S08DV32AVLC CPU core?
The MC9S08DV32AVLC features an HCS08 CPU core with a maximum core frequency of 40 MHz, while the system bus operates at up to 20 MHz. This architecture enables efficient instruction execution with deterministic timing for real-time control tasks. The actual achievable frequency depends on the selected clock source (e.g., crystal, internal reference) and MCG configuration mode (FLL or PLL). All timing specifications in the MC9S08DV32AVLC datasheet are validated across the full –40°C to +105°C temperature range.
Does the MC9S08DV32AVLC support CAN FD or only classical CAN?
The MC9S08DV32AVLC implements the MSCAN module compliant exclusively with ISO 11898-1 CAN 2.0A/B (classical CAN), supporting standard and extended identifiers, remote frames, and five receive buffers with programmable acceptance filters. It does not support CAN FD data rates, frame formats, or protocol enhancements. For CAN FD capability, designers should consider newer NXP families such as S32K1 or S9S08DZ with dedicated CAN FD controllers. The MC9S08DV32AVLC remains fully interoperable with existing CAN 2.0 networks in automotive and industrial applications.
How much RAM is available on the MC9S08DV32AVLC, and is it battery-backed?
The MC9S08DV32AVLC includes 2 KB of on-chip RAM, mapped into the standard HCS08 memory space and accessible in all active operating modes. This RAM is not battery-backed; however, it retains data during low-power wait and stop modes when the supply voltage remains within specification. The device supports very low-power stop modes (<1 µA) with RAM retention enabled via SPMSC1 register settings. For non-volatile data storage, designers must use the 32 KB flash memory with appropriate erase/write routines or external EEPROM. The MC9S08DV32AVLC does not integrate a dedicated backup RAM domain or VBAT pin.
Can the MC9S08DV32AVLC operate from a 3.3 V supply, and what are its voltage tolerances?
Yes, the MC9S08DV32AVLC operates from a single 3.3 V nominal supply (VDD = 2.7–3.6 V), with separate analog supply pins (VDDAD) that must be tied to VDD. The device is not 5 V tolerant on any I/O pin - applying 5 V to GPIO, ADC, or peripheral pins risks permanent damage. All digital and analog I/Os are specified for 3.3 V operation only, and the internal voltage regulator supplies core logic at ~1.8 V. The MC9S08DV32AVLC datasheet specifies DC characteristics over the full 2.7–3.6 V range, ensuring reliable function across automotive battery fluctuations and industrial power rails.
What debug interface does the MC9S08DV32AVLC use, and is JTAG supported?
The MC9S08DV32AVLC uses a single-wire background debug mode (BDM) interface via the BKGD/MS pin, compatible with standard Freescale/NXP BDM debuggers (e.g., DEMO9S08DV32, USB-ML-PP). It does not support IEEE 1149.1 JTAG. Debug capabilities include full-speed execution control, register and memory inspection, real-time bus capture via on-chip ICE, and flash programming. The BDM interface requires no additional pins beyond BKGD/MS and ground, minimizing PCB footprint. All debug functionality is accessible through standard CodeWarrior Development Studio versions supporting HCS08, and the MC9S08DV32AVLC responds to standard BDM command sequences defined in the HCS08 BDM specification.
MC9S08DV32AVLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV32AVLC FAQ
1.How can I place an order for MC9S08DV32AVLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV32AVLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV32AVLC reliable?
The price and inventory of MC9S08DV32AVLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV32AVLC is usually 5 days.
3.What payment methods are accepted for MC9S08DV32AVLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV32AVLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV32AVLC?
MC9S08DV32AVLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV32AVLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV32AVLC?
For technical support, including MC9S08DV32AVLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV32AVLC requirements.
6.How does Aetrix verify that MC9S08DV32AVLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DV32AVLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV32AVLC meets industry standards.
7.What is the process for return or replacement of MC9S08DV32AVLC?
All MC9S08DV32AVLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV32AVLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV32AVLC part is unused and in its original packaging.
Return procedure for MC9S08DV32AVLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08DV32AVLC Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

