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NXP Semiconductors MC9S08DV32MLC
- Part No.:
- MC9S08DV32MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DV32MLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,582
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Product details
Overview
MC9S08DV32MLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 3 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control systems requiring robust communication and low-power operation.
For engineers reviewing the MC9S08DV32MLC datasheet, MC9S08DV32MLC pinout, MC9S08DV32MLC application, or MC9S08DV32MLC equivalent, key selection criteria include its 40-MHz CPU (20-MHz bus), dual SCI with LIN 2.0 support, MSCAN module with five receive buffers and programmable identifier filters, and two very low-power stop modes with RTC wake-up capability.
Technical Context
The MC9S08DV32MLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with internal reference trimming and external crystal support from 31.25 kHz to 16 MHz.
On-chip peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and temperature sensor, two analog comparators with bandgap reference option, and a Real-Time Counter (RTC) with free-running 1-kHz oscillator for cyclic wake-up without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz operation (20-MHz bus clock) |
| Flash Memory | 32 KB on-chip flash with block protection and in-application programming |
| RAM | 3 KB SRAM for data and stack storage |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), five receive buffers with FIFO and flexible identifier filtering |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and RTC wake-up from all modes |
| Debug Interface | Single-wire background debug (BDM) with on-chip ICE and real-time bus capture |
Pinout & Package
MC9S08DV32MLC is housed in a 48-pin LQFP (7×7 mm) package with 53 general-purpose I/O pins and one input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals for precise clock source |
| BKGD/MS | Background debug and mode select | Single-wire BDM interface; also selects active background mode during reset |
| VREFH, VREFL | ADC reference inputs | External or internal (bandgap) reference selection for 12-bit ADC accuracy |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 GPIO pins with interrupt capability, edge-selectable polarity, and peripheral multiplexing |
| CANRX, CANTX | CAN transceiver interface | Dedicated differential signal pair for ISO 11898-compliant CAN bus communication |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN module | Enables reliable automotive network communication with five receive buffers and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit) |
| Real-time counter (RTC) | Provides calendar/time-of-day functionality and cyclic wake-up using internal 1-kHz oscillator - no external crystal required |
| 12-bit ADC with temp sensor | Delivers high-resolution analog sensing across 16 channels, including factory-calibrated on-die temperature measurement |
| Multi-Purpose Clock Generator (MCG) | Supports multiple clock sources (FLL, PLL, internal/external reference) with automatic trim adjustment stored in flash |
| Low-voltage detection (LVD) | Configurable reset or interrupt on undervoltage conditions, with selectable trip points for system-level power monitoring |
Applications
| Automotive Body Control Module | Industrial Motor Controller |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, analog sensor acquisition, and PWM-driven actuator control. Use Value: Integrated MSCAN and 12-bit ADC eliminate need for external transceivers and signal conditioners, reducing BOM count and PCB area. | Use Scenario: Closed-loop speed and position control of BLDC motors in factory automation equipment. IC Role / Device Role / Timing Role: Real-time execution of commutation logic, current sensing via ADC, and fault monitoring using LVD and COP watchdog. Use Value: Two TPM modules (6+2 channels) provide independent PWM outputs for three-phase gate drivers, while RTC enables scheduled maintenance logging. |
| Smart Power Distribution Unit | Commercial HVAC Controller |
Use Scenario: Intelligent circuit breaker panel with load monitoring, overcurrent protection, and remote diagnostics via CAN bus. IC Role / Device Role / Timing Role: System supervisor managing relay switching, current/voltage sampling, thermal shutdown, and CAN event reporting. Use Value: Dual SCI interfaces support simultaneous LIN-based local sensor networks and CAN-based central gateway communication. | Use Scenario: Zone-level climate management unit coordinating fan speed, damper position, and refrigerant valve timing. IC Role / Device Role / Timing Role: Peripheral-rich controller interfacing with thermistors, pressure sensors, and stepper motor drivers via GPIO, SPI, and I²C. Use Value: On-chip 3 KB RAM accommodates multi-zone PID control algorithms and data buffering for wireless telemetry upload intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ32F2MLC | Successor device in S08DZ family; same 32 KB flash but adds EEPROM, enhanced CAN timing, and improved ESD immunity | Preferred for new designs requiring nonvolatile parameter storage and higher EMC robustness in harsh environments | Select S9S08DZ32F2MLC when long-term data retention and extended temperature qualification (−40°C to 125°C) are required |
| MC9S08AC32CFGE | Same HCS08 core and memory size but lacks MSCAN; includes additional SPI and I²C peripherals | Suitable for non-CAN applications such as appliance control or sensor hubs where LIN or UART dominates | Choose MC9S08AC32CFGE if CAN is unnecessary and higher serial peripheral density is prioritized over automotive network compliance |
Compared with MC9S08DV32MLC, S9S08DZ32F2MLC offers backward-compatible software and enhanced reliability features for next-generation automotive platforms, while MC9S08AC32CFGE trades CAN for expanded serial connectivity - making it viable only where network protocol requirements differ fundamentally.
Availability
MC9S08DV32MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, smart power distribution units, and commercial HVAC systems requiring stable component supply and long-lifecycle support.
Supply support for MC9S08DV32MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DV32MLC belongs to the HCS08 DV-series microcontrollers, engineered specifically for cost-sensitive, safety-critical automotive body electronics and industrial control systems demanding CAN integration and low-power operation.
FAQ
What is the maximum operating frequency of the MC9S08DV32MLC CPU?
The MC9S08DV32MLC features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus clock. This frequency is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode with appropriate external or internal reference sources. The MC9S08DV32MLC maintains full functionality across its specified voltage and temperature range at this speed.
Does the MC9S08DV32MLC support CAN FD or only classical CAN?
The MC9S08DV32MLC supports only Classical CAN per ISO 11898-1 (CAN 2.0A/B), not CAN FD. Its MSCAN module implements standard and extended data frames, remote frame handling, and five receive buffers with programmable identifier filters - but lacks the bit-rate switching and extended data length capabilities defined in CAN FD. For CAN FD applications, newer NXP S32K or SPC5 families should be considered instead of the MC9S08DV32MLC.
How much RAM does the MC9S08DV32MLC have, and is it battery-backed?
The MC9S08DV32MLC includes 3 KB of on-chip SRAM, which is not battery-backed. It retains data only while powered and within valid operating voltage and temperature ranges. The device does not integrate a dedicated backup RAM section or VBAT domain; however, its RTC module operates independently using a 1-kHz internal oscillator and can generate wake-up interrupts in all low-power modes - though RAM contents are lost upon exit from Stop modes unless explicitly preserved by firmware before entry.
What debug interface does the MC9S08DV32MLC use, and is JTAG supported?
The MC9S08DV32MLC uses a single-wire Background Debug Mode (BDM) interface for programming and real-time debugging. It does not support JTAG. The BDM interface enables in-circuit emulation (ICE), flash programming, and breakpoint-based debugging through the BKGD/MS pin. This interface is fully supported by NXP's CodeWarrior Development Studio and compatible third-party tools like PEmicro Cyclone programmers - all targeting the MC9S08DV32MLC specifically.
Is the MC9S08DV32MLC qualified for automotive applications, and what temperature grade is it rated for?
Yes, the MC9S08DV32MLC is AEC-Q100 qualified for automotive applications and rated for operation from −40°C to 105°C. Its design includes system-level protections such as COP watchdog with dual-clock source, low-voltage detection with interrupt/reset, illegal opcode/address detection, and flash block protection - all aligned with automotive functional safety expectations. The 'MLC' suffix denotes the 48-pin LQFP package and extended temperature grade, confirming suitability for under-hood and body-control module deployments.
MC9S08DV32MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV32MLC FAQ
1.How can I place an order for MC9S08DV32MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV32MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV32MLC reliable?
The price and inventory of MC9S08DV32MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV32MLC is usually 5 days.
3.What payment methods are accepted for MC9S08DV32MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV32MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV32MLC?
MC9S08DV32MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV32MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV32MLC?
For technical support, including MC9S08DV32MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV32MLC requirements.
6.How does Aetrix verify that MC9S08DV32MLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DV32MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV32MLC meets industry standards.
7.What is the process for return or replacement of MC9S08DV32MLC?
All MC9S08DV32MLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV32MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV32MLC part is unused and in its original packaging.
Return procedure for MC9S08DV32MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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