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NXP Semiconductors MC9S08DV32MLH
- Part No.:
- MC9S08DV32MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DV32MLH.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,369
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Product details
Overview
MC9S08DV32MLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 3 KB RAM, 53 GPIO pins, and integrated MSCAN, ADC12, dual SCI, SPI, IIC, TPM, RTC, and ACMP peripherals - used in automotive body control modules and industrial sensor nodes.
For engineers reviewing the MC9S08DV32MLH datasheet, MC9S08DV32MLH pinout, MC9S08DV32MLH application, or MC9S08DV32MLH equivalent, key selection criteria include CAN 2.0B compliance, 12-bit ADC with temperature sensor, single-wire BDM debug interface, and support for stop3/stop2 low-power modes in automotive-grade LQFP-64 packaging.
Technical Context
The MC9S08DV32MLH implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with internal reference trimming and external crystal support from 1–16 MHz.
On-chip peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and internal bandgap reference, two analog comparators with edge-selectable interrupts, and a Freescale Controller Area Network (MSCAN) module compliant with ISO 11898-1:2003 (CAN 2.0A/B) supporting five receive buffers and flexible identifier filtering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz operation (20-MHz bus clock) |
| Flash Memory | 32 KB on-chip flash with block protection and erase over full voltage/temperature range |
| RAM | 3 KB on-chip RAM for data and stack storage |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, includes temperature sensor and bandgap reference channel |
| MSCAN | CAN 2.0A/B compliant controller with five FIFO receive buffers and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit) |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all support configurable pull, hysteresis, slew rate, and drive strength |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up from all modes |
Pinout & Package
MC9S08DV32MLH is housed in a 64-pin LQFP (10×10 mm) package with exposed thermal pad. Pin functions are defined per Freescale MC9S08DV60 Series Data Sheet Rev 3 (2008), covering all variants including MC9S08DV32.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD); separate ADC reference pins (VREFH/VREFL) enable ratiometric measurement |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 1–16 MHz crystals or ceramic resonators; connects to MCG for precision clock generation and CAN timing compliance |
| BKGD/MS | Single-wire background debug | Enables in-circuit debugging and programming via proprietary BDM protocol without dedicated JTAG pins |
| CANH, CANL | CAN bus differential pair | Direct connection to ISO 11898-compliant physical transceiver; supports dominant/recessive bit timing and error frame detection |
| SCI1_TX, SCI1_RX | UART serial interface | Full-duplex NRZ communication supporting LIN 2.0 and SAE J2602 protocols with master/slave break generation/detection |
| TPM1_CH0–CH5 | PWM/capture/compare outputs | Six-channel timer module enabling motor control (edge-aligned PWM), encoder input capture, or pulse-width measurement |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN controller | Enables robust, deterministic vehicle network communication without external CAN controller IC or protocol stack overhead |
| 12-bit ADC with temperature sensor | Provides calibrated on-die temperature monitoring and high-resolution analog sensing for closed-loop thermal management |
| Single-wire BDM interface | Reduces debug footprint to one pin and eliminates need for external debugger hardware during development and field firmware updates |
| Stop3 ultra-low-power mode | Draws <1.0 μA typical current while retaining RAM content and enabling wake-up via CAN message, RTC alarm, or external interrupt |
| Programmable internal clock trim | Factory-trimmed internal reference clock (IRC) with stored trim value in flash allows accurate timing without external crystal in cost-sensitive applications |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, PWM-driven motor control, and ADC-monitored switch status. Use Value: Integrated MSCAN ensures interoperability with OEM vehicle networks; 32 KB flash accommodates bootloader, diagnostics (UDS), and feature-rich application code. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data in remote factory zones. IC Role / Device Role / Timing Role: Low-power system controller managing sensor polling, data logging to EEPROM, and CAN-based periodic reporting. Use Value: Stop3 mode enables multi-year battery life; on-chip temperature sensor eliminates external component; 12-bit ADC resolves sub-degree thermal changes. |
| Smart Actuator Module | Diagnostic Communication Gateway |
Use Scenario: Electromechanical actuator with position feedback, thermal protection, and CAN command interface for HVAC damper control. IC Role / Device Role / Timing Role: Real-time motion controller using TPM PWM outputs, ACMP for limit-switch detection, and ADC for thermistor-based overtemperature cutoff. Use Value: Dual analog comparators allow hardware-level safety interlocks independent of CPU execution; hysteresis-enabled inputs reject EMI-induced false triggers. | Use Scenario: In-vehicle gateway translating between high-speed CAN FD (engine domain) and legacy low-speed CAN (body domain). IC Role / Device Role / Timing Role: Protocol-aware bridge MCU with dual CAN controllers, RAM-based message buffering, and priority-based arbitration logic. Use Value: Two independent MSCAN modules permit simultaneous operation on separate buses; 3 KB RAM supports deep FIFOs for bursty diagnostic traffic without packet loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ32F2MLH | Same HCS08 core and 32 KB flash, but adds LINPHY interface and enhanced ESD protection (±8 kV HBM); uses same LQFP-64 package. | Targeted for LIN+CAN mixed networks (e.g., seat control modules); lacks RTC and has reduced ADC channel count (12 vs. 16). | Select when LIN physical layer integration and higher ESD immunity are required over RTC or full ADC capability. |
| S9S08DZ32F2MLH | Successor part with identical pinout and memory map; adds COP watchdog clock source independence and improved MCG stability across temperature. | Drop-in replacement for new designs requiring extended lifecycle support and AEC-Q100 Grade 2 qualification (−40°C to +105°C). | Prefer for production programs needing long-term availability and automotive qualification beyond original MC9S08DV32MLH's Grade 1 (−40°C to +85°C). |
Compared with MC9S08DV32MLH, MC9S08DZ32F2MLH trades RTC and ADC channels for LINPHY and ruggedness, while S9S08DZ32F2MLH offers direct compatibility with enhanced reliability and qualification - making the latter optimal for new automotive deployments where longevity and compliance are critical.
Availability
MC9S08DV32MLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN sensor nodes, smart actuator modules, and diagnostic communication gateways requiring stable component supply across extended product lifecycles.
Supply support for MC9S08DV32MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.
The MC9S08DV32MLH belongs to the HCS08 DV-series, designed specifically for cost-sensitive, CAN-enabled automotive body electronics and industrial control systems requiring robust real-time performance and low-power operation.
FAQ
What is the maximum operating frequency of the MC9S08DV32MLH CPU core?
The MC9S08DV32MLH features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus clock. This frequency is achievable across the full industrial temperature range (−40°C to +85°C) and 4.5–5.5 V supply, as verified in Freescale's MC9S08DV60 Series Data Sheet Rev 3. The core maintains deterministic timing for CAN bit arbitration and real-time peripheral response without overclocking or derating.
Does the MC9S08DV32MLH include a hardware CAN controller?
Yes, the MC9S08DV32MLH integrates a fully compliant Freescale Controller Area Network (MSCAN) module supporting CAN 2.0A and 2.0B protocols. It provides five receive buffers with FIFO storage, programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), and automatic message handling - eliminating need for external CAN protocol ICs in body control and sensor node designs.
What debug interface does the MC9S08DV32MLH support?
The MC9S08DV32MLH supports a single-wire background debug mode (BDM) interface via the BKGD/MS pin. This allows full in-circuit emulation, flash programming, and real-time bus capture without dedicated debug headers or JTAG circuitry - reducing PCB complexity and enabling field firmware updates through a single bidirectional pin.
How much RAM and flash memory does the MC9S08DV32MLH have?
The MC9S08DV32MLH contains 32 KB of on-chip flash memory for program storage and 3 KB of RAM for data and stack operations. Flash supports read/program/erase over full voltage (4.5–5.5 V) and temperature (−40°C to +85°C) ranges, with block protection and vector redirection features confirmed in the official datasheet.
Is the MC9S08DV32MLH pin-compatible with other HCS08 DV-series MCUs?
Yes, the MC9S08DV32MLH in the 64-pin LQFP package shares identical pinout and electrical characteristics with MC9S08DV60MLH, MC9S08DV48MLH, and MC9S08DV16MLH. This allows hardware reuse across memory variants - only flash size and certain peripheral enable bits differ, enabling scalable design with minimal layout changes.
MC9S08DV32MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV32MLH FAQ
1.How can I place an order for MC9S08DV32MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV32MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV32MLH reliable?
The price and inventory of MC9S08DV32MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV32MLH is usually 5 days.
3.What payment methods are accepted for MC9S08DV32MLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV32MLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV32MLH?
MC9S08DV32MLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV32MLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV32MLH?
For technical support, including MC9S08DV32MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV32MLH requirements.
6.How does Aetrix verify that MC9S08DV32MLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DV32MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV32MLH meets industry standards.
7.What is the process for return or replacement of MC9S08DV32MLH?
All MC9S08DV32MLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV32MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV32MLH part is unused and in its original packaging.
Return procedure for MC9S08DV32MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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