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NXP Semiconductors MC9S08DV60AMLC
- Part No.:
- MC9S08DV60AMLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DV60AMLC.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,453
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Product details
Overview
MC9S08DV60AMLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip flash, 3 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - deployed in automotive body control modules requiring deterministic timing and robust communication.
For engineers reviewing the MC9S08DV60AMLC datasheet, MC9S08DV60AMLC pinout, MC9S08DV60AMLC application, or MC9S08DV60AMLC equivalent, key selection criteria include CAN protocol compliance, 12-bit ADC conversion time (2.5 μs), 40-MHz CPU clock, low-power stop modes, and LQFP-64 package compatibility with automotive-grade thermal and EMI requirements.
Technical Context
The MC9S08DV60AMLC implements the HCS08 CPU core with 20-MHz bus frequency, supporting up to 32 interrupt/reset sources and BGND debug instruction. Its Multi-Purpose Clock Generator (MCG) provides PLL and FLL modes with ±1.5% internal reference accuracy using factory-trimmed temperature compensation.
On-chip peripherals include a 16-channel 12-bit ADC with temperature sensor and bandgap reference, two analog comparators with edge-selectable interrupts, and MSCAN module supporting five receive buffers with programmable 2×32-bit/4×16-bit/8×8-bit identifier filters - all operating across run, wait, and stop3 modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz operation (20-MHz bus), HC08 instruction set + BGND |
| Flash Memory | 60 KB program flash with block protection, read/program/erase over full voltage/temperature range |
| RAM | 3 KB on-chip SRAM for data and stack storage |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames and remote frames |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up from all states |
| Package | 64-pin LQFP (10×10 mm), RoHS-compliant, rated for –40°C to +105°C ambient |
Pinout & Package
MC9S08DV60AMLC is housed in a 64-pin low-profile quad flat-pack (LQFP) with 0.5 mm pitch, designed for automotive PCB layouts requiring thermal reliability and EMI resilience. Pin assignments follow Freescale's standardized HCS08 DV-series layout per Chapter 2 of Rev 3 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) with separate filtering paths |
| XTAL, EXTAL | Clock input/output | Connects to 1–16 MHz crystal or ceramic resonator for primary system clock source |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; asserts during reset to enter background mode |
| CANH, CANL | CAN differential bus lines | Direct connection to ISO 11898-compliant transceiver; supports 1 Mbps nominal bit rate |
| AD0–AD15 | Analog input channels | 16 multiplexed inputs shared with GPIO; support internal temperature sensor and bandgap reference |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 configurable GPIO pins with hysteresis, pull devices, slew rate control, and interrupt capability on 24 pins |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN Controller | Enables deterministic, fault-tolerant vehicle network communication without external CAN controller or protocol stack overhead |
| Factory-Trimmed Internal Reference | Eliminates need for external precision oscillator in cost-sensitive body control applications while maintaining ±1.5% FLL accuracy |
| Real-Time Counter (RTC) | Provides calendar/time-of-day functionality using free-running 1 kHz on-chip oscillator - no external crystal required |
| Single-Wire Background Debug | Reduces debug footprint to one pin and enables in-circuit emulation with real-time bus capture during development |
| Flash Block Protection | Prevents unauthorized firmware overwrite or corruption in field-deployed ECUs via hardware-enforced memory locking |
Applications
| Body Control Module (BCM) | Door Module Control |
|---|---|
Use Scenario: Centralized management of lighting, wipers, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, ADC-based sensor sampling (e.g., ambient light, door position), and PWM-driven actuator control. Use Value: 60 KB flash accommodates multi-function firmware; MSCAN ensures synchronized node communication; RTC enables timed interior light fade-out. | Use Scenario: Local control unit inside vehicle door managing window lift, mirror adjustment, and anti-pinch detection. IC Role / Device Role / Timing Role: Real-time peripheral controller interfacing with potentiometers, Hall sensors, and motor drivers via GPIO, ADC, and TPM PWM outputs. Use Value: 2.5 μs ADC conversion enables fast anti-pinch response; low-power stop modes extend battery life during vehicle sleep cycles. |
| Roof Module (Sunroof/Climate) | Seat Control Unit |
Use Scenario: Integrated sunroof and HVAC zone control in premium vehicle cabins. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating temperature, humidity, and position feedback; coordinating LIN slave devices via SCI. Use Value: Dual SCI interfaces support LIN 2.0 and SAE J2602 protocols; 12-bit ADC resolves fine-grained cabin temperature gradients. | Use Scenario: Motorized seat positioning with memory presets and occupant detection. IC Role / Device Role / Timing Role: Safety-critical motion controller using TPM PWM for bidirectional motor drive and ACMP for seat occupancy sensing. Use Value: Two analog comparators with internal bandgap reference enable reliable capacitive or pressure-based occupancy detection without external components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DV60F1MLC | Same die, newer mask set; includes updated MCG jitter spec per Rev 3 PS Issue #3386 | Identical functional scope; preferred for new designs requiring latest characterization | Select S9S08DV60F1MLC for production builds post-2008; MC9S08DV60AMLC remains valid for legacy BOM continuity |
| MC9S08DZ60CLC | Enhanced variant with LIN PHY integration, higher temp grade (–40°C to +125°C), and additional I/O | Targets more complex nodes requiring embedded LIN physical layer and extended thermal margin | Choose MC9S08DZ60CLC when LIN bus termination and wider temperature range are mandatory |
Compared with S9S08DV60F1MLC and MC9S08DZ60CLC, the MC9S08DV60AMLC offers proven automotive qualification at lower gate count and cost, making it optimal for established BCM and door module designs where LIN PHY or extended temperature are not required.
Availability
MC9S08DV60AMLC is available at Aetrix Electronics and suitable for automotive body electronics, door control units, and roof modules requiring stable component supply, long lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for MC9S08DV60AMLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DV60AMLC belongs to NXP's legacy HCS08 8-bit MCU family, engineered specifically for cost-sensitive, real-time automotive body electronics with integrated CAN, ADC, and low-power operation.
FAQ
What is the maximum operating frequency of the MC9S08DV60AMLC CPU core?
The MC9S08DV60AMLC features an HCS08 CPU core running at up to 40 MHz, with a corresponding 20-MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full –40°C to +105°C temperature range specified for the MC9S08DV60AMLC.
Does the MC9S08DV60AMLC support CAN FD or only classical CAN?
The MC9S08DV60AMLC supports only Classical CAN per ISO 11898-1 (CAN 2.0A/B), including standard and extended data frames, remote frames, and five receive buffers with flexible identifier filtering. It does not implement CAN FD features such as variable bit rate or extended data length - those capabilities require later-generation NXP S32K or standalone CAN FD controllers.
What package type and pin count does the MC9S08DV60AMLC use?
The MC9S08DV60AMLC is supplied exclusively in a 64-pin low-profile quad flat-pack (LQFP) package measuring 10×10 mm with 0.5 mm pitch. This package variant is explicitly designated in Freescale's ordering information and mechanical drawings (Appendix C, Rev 3 datasheet) and matches the pinout defined for the DV60 series in 64-pin configuration.
How much RAM and flash memory does the MC9S08DV60AMLC include?
The MC9S08DV60AMLC integrates 60 KB of on-chip flash memory and 3 KB of random-access memory (RAM). These values are fixed per device variant and confirmed in the "On-Chip Memory" section of the Rev 3 datasheet - with MC9S08DV48, DV32, and DV16 denoting corresponding 48K/32K/16K flash variants sharing the same architecture.
Is the MC9S08DV60AMLC qualified for automotive applications?
Yes, the MC9S08DV60AMLC is designed and tested for automotive use, meeting AEC-Q100 stress test requirements for Grade 2 (–40°C to +105°C) operation. Its features - including CAN 2.0B compliance, watchdog COP with backup clock, low-voltage detection, and flash block protection - align with functional safety expectations for body electronics ECUs, though formal ISO 26262 ASIL classification is not claimed for this legacy part.
MC9S08DV60AMLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV60AMLC FAQ
1.How can I place an order for MC9S08DV60AMLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV60AMLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV60AMLC reliable?
The price and inventory of MC9S08DV60AMLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV60AMLC is usually 5 days.
3.What payment methods are accepted for MC9S08DV60AMLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV60AMLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV60AMLC?
MC9S08DV60AMLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV60AMLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV60AMLC?
For technical support, including MC9S08DV60AMLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV60AMLC requirements.
6.How does Aetrix verify that MC9S08DV60AMLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DV60AMLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV60AMLC meets industry standards.
7.What is the process for return or replacement of MC9S08DV60AMLC?
All MC9S08DV60AMLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV60AMLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV60AMLC part is unused and in its original packaging.
Return procedure for MC9S08DV60AMLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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