NXP Semiconductors MC9S08DV60MLC

Overview

MC9S08DV60MLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip flash, 3 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control systems requiring robust communication and low-power operation.

For engineers reviewing the MC9S08DV60MLC datasheet, MC9S08DV60MLC pinout, MC9S08DV60MLC application, or MC9S08DV60MLC equivalent, key selection criteria include its 64-pin LQFP package, 20 MHz bus speed, MSCAN peripheral, 12-bit ADC with temperature sensor, and dual stop-mode power management.

Technical Context

The MC9S08DV60MLC implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and operating at 40 MHz CPU / 20 MHz bus frequency. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal support from 1–16 MHz.

System-level protection includes COP watchdog with 1 kHz backup clock, low-voltage detect with configurable trip points, illegal opcode/address detection, and flash block protection. Peripheral integration centers on MSCAN for automotive networking, two SCIs supporting LIN 2.0/SAE J2602, and a 6-channel + 2-channel TPM for PWM and capture timing.

Key Specifications

Pinout & Package

MC9S08DV60MLC is housed in a 64-pin low-profile quad flat-pack (LQFP), 10 mm × 10 mm, 0.5 mm pitch, RoHS-compliant package with exposed thermal pad (per Freescale MC9S08DV60 Series Mechanical Drawings, Rev 3, Appendix C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Compared with MC9S08DV60MLC, S9S08DZ60F1MLC offers improved CAN timing stability and wider operating temperature, while MC9S08DZ60CLC trades package size and sensor integration for compactness - both require PCB layout changes due to different pin counts and thermal sensor absence.

Availability

MC9S08DV60MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, telematics gateways, and smart building HVAC systems requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08DV60MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MC9S08DV60MLC belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, low-power automotive body electronics and industrial control applications requiring integrated CAN, ADC, and robust system-level protection.

FAQ

What is the maximum bus frequency supported by the MC9S08DV60MLC?

The MC9S08DV60MLC supports a maximum bus frequency of 20 MHz, derived from its 40 MHz CPU clock via a configurable divider. This bus speed ensures deterministic timing for peripherals including MSCAN, ADC, and TPM modules while maintaining compatibility with legacy 8-bit system designs. The MC9S08DV60MLC achieves this using the Multi-Purpose Clock Generator (MCG) in FLL or PLL mode with internal or external reference sources.

Does the MC9S08DV60MLC include an integrated temperature sensor?

Yes, the MC9S08DV60MLC includes an on-chip temperature sensor accessible as a dedicated channel within its 16-channel, 12-bit ADC subsystem. This sensor is factory-calibrated and referenced to the internal bandgap voltage, enabling accurate ambient temperature measurement without external components. The MC9S08DV60MLC uses this capability for thermal monitoring in automotive modules and industrial controllers where self-diagnostics or thermal compensation are required.

What package type and pin count does the MC9S08DV60MLC use?

The MC9S08DV60MLC is supplied in a 64-pin low-profile quad flat-pack (LQFP) package measuring 10 mm × 10 mm with 0.5 mm pitch. This package provides 53 general-purpose I/O pins and one input-only pin, supporting full peripheral access including MSCAN, dual SCI, SPI, I²C, and six TPM channels. The MC9S08DV60MLC's pinout is documented in Chapter 2 of its official datasheet (Rev 3, June 2008).

Can the MC9S08DV60MLC operate in low-power modes while maintaining CAN functionality?

No - the MSCAN module is disabled in Stop2 and Stop3 modes per the MC9S08DV60MLC datasheet. However, it remains active in Wait mode and Run mode, and supports wake-up via CAN bus activity (e.g., dominant bit detection) when exiting Stop modes. The MC9S08DV60MLC uses its real-time counter with 1 kHz internal oscillator to schedule periodic wake-ups for CAN status polling, balancing power savings with network responsiveness.

What debug interface does the MC9S08DV60MLC support?

The MC9S08DV60MLC supports a single-wire background debug mode (BDM) interface via the BKGD/MS pin, enabling non-intrusive in-circuit debugging, flash programming, and real-time bus capture without requiring dedicated debug headers or JTAG pins. This interface is fully compatible with Freescale/NXP BDM tools and third-party debug probes. The MC9S08DV60MLC's BDM implementation allows full register visibility, breakpoint setting, and memory inspection during development and field diagnostics.