NXP Semiconductors MC9S08DV60MLH
- Part No.:
- MC9S08DV60MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DV60MLH.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,128
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08DV60MLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip flash, 3 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control systems requiring robust communication and low-power operation.
For engineers reviewing the MC9S08DV60MLH datasheet, MC9S08DV60MLH pinout, MC9S08DV60MLH application, or MC9S08DV60MLH equivalent, key selection criteria include CAN protocol compliance, 12-bit ADC performance, stop-mode power consumption, and background debug interface support.
Technical Context
The MC9S08DV60MLH implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and featuring a Multi-Purpose Clock Generator (MCG) with FLL/PLL modes and factory-trimmed internal reference. Its MSCAN module supports standard/extended frames, five receive buffers, and programmable identifier filters.
Peripherals include two SCIs (LIN 2.0/J2602 compliant), SPI, I²C, dual analog comparators, six-channel TPM1 and two-channel TPM2 timers, and an 8-bit RTC with 1 kHz low-power oscillator - all operating across run, wait, and two very low-power stop modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core clock (20-MHz bus) |
| Flash Memory | 60 KB program flash with block protection and in-system programming |
| RAM | 3 KB on-chip SRAM for data and stack operations |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), five RX buffers, FIFO storage |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor & bandgap reference |
| Power Modes | Two very low-power stop modes, reduced-power wait mode, real-time interrupt in all modes |
| Debug Interface | Single-wire background debug (BDM) with on-chip ICE and real-time bus capture |
Pinout & Package
MC9S08DV60MLH is housed in a 64-pin LQFP package (10 × 10 mm, 0.5 mm pitch), with 53 general-purpose I/O pins and one dedicated input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| VREFH / VREFL | Analog reference inputs | Enable precise 12-bit ADC conversions using external or internal reference voltage |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface for programming and real-time debugging without halting execution |
| RESET | Active-low reset input | Hardware reset initiation; supports low-voltage detect reset and COP watchdog timeout |
| XTAL / EXTAL | Crystal/resonator connections | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals for precision clock source |
| CANRX / CANTX | CAN transceiver interface | Dedicated differential signal pair for ISO 11898-2 physical layer connection |
| AD0–AD15 | Analog input channels | 16 multiplexed ADC inputs including internal temperature sensor and bandgap reference channel |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN Controller | Enables deterministic, fault-tolerant vehicle network communication without external CAN controller or transceiver logic |
| Factory-Trimmed Internal Reference | Reduces system BOM by eliminating external crystal for clock generation in cost-sensitive applications |
| Real-Time Counter (RTC) | Provides calendar/time-of-day functionality using on-chip 1 kHz oscillator - no external timing components required |
| Low-Voltage Detection (LVD) | Configurable trip points trigger reset or interrupt to prevent erratic operation during brown-out conditions |
| Flash Block Protection | Prevents unauthorized read/write access to critical firmware sections, supporting secure bootloader implementation |
Applications
| Automotive Body Control Module | Industrial Motor Drive Interface |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, ADC-based sensor monitoring, and PWM-driven actuator control. Use Value: Integrated MSCAN and 12-bit ADC eliminate need for discrete CAN controller and external sensor signal conditioning circuitry. | Use Scenario: Closed-loop speed and position control of BLDC motors in factory automation equipment. IC Role / Device Role / Timing Role: Real-time pulse-width modulation generator with encoder feedback capture via TPM input capture channels. Use Value: Six-channel TPM1 supports simultaneous three-phase PWM generation and quadrature decoding without external timing ICs. |
| Smart Energy Metering Node | Medical Diagnostic Sensor Hub |
Use Scenario: Sub-metering node collecting current/voltage samples and communicating via CAN bus to central gateway. IC Role / Device Role / Timing Role: Data acquisition MCU with 12-bit ADC, temperature compensation, and cyclic wake-up via RTC. Use Value: Very low-power stop modes and 1 kHz RTC enable battery-backed operation with multi-year standby life. | Use Scenario: Portable device aggregating analog signals from ECG, SpO₂, and temperature sensors for wireless transmission. IC Role / Device Role / Timing Role: Signal-conditioning and preprocessing MCU with internal bandgap reference and comparator-based event detection. Use Value: Dual analog comparators with edge-triggered interrupts reduce host MCU polling overhead and extend battery runtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ60F1MLH | Successor part with enhanced ESD rating (±8 kV HBM), updated MCG trim algorithm, and extended temperature range (−40°C to 125°C) | Preferred for new automotive designs requiring AEC-Q100 Grade 2 qualification and higher reliability margins | Select S9S08DZ60F1MLH when upgrading legacy MC9S08DV60MLH designs for production longevity and automotive qualification |
| MC9S08AC60CFUE | Same HCS08 core but with 48-pin QFN package, no CAN module, added LIN PHY, and reduced flash (60 KB shared with EEPROM emulation) | Suitable for space-constrained LIN-only nodes where CAN is not required and PCB area is premium | Choose MC9S08AC60CFUE only if CAN capability is unnecessary and footprint reduction outweighs loss of CAN and RTC features |
Compared with MC9S08DV60MLH, S9S08DZ60F1MLH offers improved automotive robustness and lifecycle support, while MC9S08AC60CFUE trades CAN and RTC for smaller size and LIN integration - neither is pin-compatible, requiring layout revision.
Availability
MC9S08DV60MLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart metering, and medical sensor hub applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MC9S08DV60MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation through its acquisition of Freescale.
The MC9S08DV60MLH belongs to the HCS08 family - engineered for cost-sensitive, real-time embedded control in harsh environments where CAN communication, low-power operation, and peripheral integration are essential.
FAQ
What is the maximum bus frequency supported by the MC9S08DV60MLH?
The MC9S08DV60MLH supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a 2:1 divider. This bus speed enables deterministic timing for peripherals including MSCAN, ADC, and TPM modules while maintaining compatibility with legacy 8-bit system designs and external memory interfaces.
Does the MC9S08DV60MLH include a hardware CAN controller?
Yes, the MC9S08DV60MLH integrates a fully compliant Freescale Controller Area Network (MSCAN) module supporting CAN 2.0A/B protocols, standard and extended data frames, remote frames, five receive buffers with FIFO, and flexible identifier filtering - eliminating the need for external CAN protocol controllers in automotive and industrial networks.
What package type is used for the MC9S08DV60MLH?
The MC9S08DV60MLH uses a 64-pin low-profile quad flat-pack (LQFP) package measuring 10 × 10 mm with 0.5 mm pitch. This package provides 53 general-purpose I/O pins and one input-only pin, supporting high peripheral density while enabling manual soldering and automated assembly in industrial and automotive PCBs.
Can the MC9S08DV60MLH operate in low-power modes with CAN active?
No - the MSCAN module is disabled in Stop2 and Stop3 modes per the MC9S08DV60 datasheet Rev 3. However, the MC9S08DV60MLH supports wake-up from Wait mode via CAN message reception, and real-time interrupt (RTI) can trigger wake-up from Stop modes to poll CAN status before full resume, enabling ultra-low-power listening states.
Is there an internal temperature sensor in the MC9S08DV60MLH?
Yes, the MC9S08DV60MLH includes an on-die temperature sensor accessible as a dedicated channel within its 16-channel, 12-bit ADC subsystem. Calibration data is not factory-trimmed into flash, so system-level calibration is required for ±2°C accuracy across the −40°C to 105°C operating range.
MC9S08DV60MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DV60MLH FAQ
1.How can I place an order for MC9S08DV60MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DV60MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DV60MLH reliable?
The price and inventory of MC9S08DV60MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DV60MLH is usually 5 days.
3.What payment methods are accepted for MC9S08DV60MLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DV60MLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DV60MLH?
MC9S08DV60MLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DV60MLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DV60MLH?
For technical support, including MC9S08DV60MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DV60MLH requirements.
6.How does Aetrix verify that MC9S08DV60MLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DV60MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DV60MLH meets industry standards.
7.What is the process for return or replacement of MC9S08DV60MLH?
All MC9S08DV60MLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DV60MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DV60MLH part is unused and in its original packaging.
Return procedure for MC9S08DV60MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08DV60MLH Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

