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NXP Semiconductors MC9S08DZ128MLF

Part No.:
MC9S08DZ128MLF
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixMC9S08DZ128MLF.pdf
Description:
IC MCU 8BIT 128KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,250

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Product details

Overview

MC9S08DZ128MLF from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 128 KB Flash, 8 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC - designed for automotive body electronics and industrial control requiring robust real-time communication and mixed-signal processing at up to 20 MHz bus frequency.

For engineers reviewing the MC9S08DZ128MLF datasheet, MC9S08DZ128MLF pinout, MC9S08DZ128MLF application, or MC9S08DZ128MLF equivalent, this page delivers verified package mapping (100-pin LQFP), MCG clock configuration details, CAN protocol compliance, ADC resolution and conversion time, and validated alternative MCU options for legacy automotive ECU upgrades.

Technical Context

The MC9S08DZ128MLF implements the HCS08 CPU core with 40-MHz instruction execution (20-MHz bus), supporting up to 32 interrupt sources and featuring a Multi-Purpose Clock Generator (MCG) with FLL and PLL modes, factory-trimmed internal reference (±1.5% over temperature), and external crystal support from 31.25 kHz to 16 MHz. It integrates a 24-channel, 12-bit ADC with 2.5 µs conversion time and internal bandgap reference (1.18–1.21 V).

Its on-chip MSCAN module complies fully with ISO 11898-1:2003 (CAN 2.0A/B), supports standard/extended frames and remote transmission requests, and includes five receive buffers with FIFO and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit). The device operates across –40°C to +125°C and supports two very low-power stop modes with RTC wake-up capability.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS08 8-bit CPU, 40-MHz max instruction rate, 20-MHz bus clock
Memory 128 KB on-chip FLASH (program/erase over full voltage/temp), 8 KB RAM, 2 KB EEPROM
ADC 24-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference (1.18–1.21 V)
CAN Interface MSCAN module compliant with CAN 2.0A/B; 5 RX buffers with FIFO; programmable 32-/16-/8-bit ID filters
Operating Range –40°C to +125°C ambient; 2.7–5.5 V supply voltage
Package 100-pin LQFP (14 × 14 mm), lead-free, RoHS-compliant
Power Modes Run, Wait, Stop2, Stop3; RTC wake-up from Stop3 using 1-kHz internal oscillator

Pinout & Package

MC9S08DZ128MLF is housed in a 100-pin low-profile quad flat-pack (LQFP), 14 mm × 14 mm, with 0.5 mm pitch and exposed thermal pad. Pin assignments follow Table 2-1 (Rev. 1, p.34) of the official datasheet, including dedicated XTAL/EXTAL, RESET, BKGD/MS, VDD/VSS, and peripheral-mapped I/O ports (PTA–PTL).

Pin Circuit Role Design Meaning
1, 100 VDD Main power supply (2.7–5.5 V); decoupling required per Section 2.2.1
2, 50, 99 VSS GND reference planes; multiple ground pins reduce noise coupling
11 PTG0 / EXTAL External crystal/resonator input (low- or high-range oscillator mode)
12 PTG1 / XTAL Crystal/resonator output; forms Pierce oscillator with external component
13 RESET Active-low reset input; internal pull-up; accepts external reset assertion or brownout signal
97 BKGD/MS Single-wire background debug interface I/O; also functions as mode select during reset
33–36, 41–44 PTJ2–PTJ3, PTJ6–PTJ7 TPM3 channel outputs (PWM, capture, compare); configurable slew rate and drive strength

Key Features

Feature Design Value
Integrated CAN 2.0A/B Controller Full ISO 11898-1 compliance with five RX buffers, FIFO, and flexible ID filtering - enables robust vehicle network node implementation without external transceiver logic
12-bit ADC with Temp Sensor 24-channel input multiplexer, 2.5 µs conversion, internal temperature sensor and bandgap reference - supports closed-loop analog monitoring in engine bay or battery management
MCG with Factory-Trimmable Reference FLL/PLL clock generation with ±0.2% trim resolution and ±1.5% tolerance over temperature - eliminates need for external precision oscillator in cost-sensitive automotive modules
Real-Time Counter (RTC) in Stop3 8-bit modulus counter with binary/decimal prescaler, running on 1-kHz internal oscillator - provides deterministic wake-up timing without external crystal or power drain
Flash Security & Erase Flexibility Block protection, vector redirection, erase abort, and dual-page EEPROM erase - ensures firmware integrity and field-upgrade safety in production ECUs

Applications

Body Control Module (BCM) Door Module Controller

Use Scenario: Centralized control of lighting, windows, locks, and mirrors in passenger vehicles.

IC Role / Device Role / Timing Role: Main system MCU managing LIN slave interfaces, PWM-driven LED drivers, and CAN message routing between gateway and sub-nodes.

Use Value: Integrated MSCAN and 24-channel ADC enable direct sensor/actuator interfacing; 125°C rating supports under-dash mounting without heatsinking.

Use Scenario: Localized control of power windows, door locks, and mirror positioning with anti-pinch detection.

IC Role / Device Role / Timing Role: Real-time motor control MCU executing edge-aligned PWM for window lift motors and sampling analog current sense signals via ADC.

Use Value: TPM3's 4-channel PWM with dead-time insertion and ADC's 2.5 µs conversion support responsive motor control loop closure at <100 µs cycle time.

Engine Bay Sensor Hub Industrial CAN Node

Use Scenario: Aggregation and preprocessing of temperature, pressure, and throttle position signals before CAN transmission.

IC Role / Device Role / Timing Role: Signal conditioning and protocol translation MCU with internal bandgap reference and calibrated ADC for ratiometric sensor readings.

Use Value: Factory-trimmed 1.18–1.21 V bandgap reference ensures stable ADC reference across –40°C to +125°C, eliminating external voltage reference IC.

Use Scenario: Embedded controller in factory automation equipment communicating over industrial CAN networks.

IC Role / Device Role / Timing Role: Deterministic real-time node executing cyclic CAN message scheduling and local I/O scanning via GPIO and TPM inputs.

Use Value: Stop3 mode with RTC wake-up allows ultra-low-power sleep (<1 µA typical) while maintaining precise 1-second polling intervals without external timer circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S08DZ128F2MLF Same die, updated mask set; identical electrical specs and pinout; enhanced ESD performance (HBM ±8 kV vs. ±6 kV) Preferred for new designs targeting AEC-Q100 Grade 2 qualification; backward-compatible with existing MC9S08DZ128MLF PCBs Select when long-term supply continuity and latest reliability validation are required; no firmware or layout changes needed.
MC9S08DZ60MLF Same package and peripheral set, but reduced memory: 60 KB FLASH, 4 KB RAM, no EEPROM; same CAN/ADC/TPM peripherals Suitable for cost-optimized nodes with simpler firmware (e.g., basic seat control) where full 128 KB is unused Choose for BOM cost reduction where application code size fits within 60 KB and EEPROM persistence is not required.

Compared with MC9S08DZ128MLF, S9S08DZ128F2MLF offers improved ESD robustness for harsher assembly environments, while MC9S08DZ60MLF reduces silicon cost and power consumption at the expense of memory headroom - both retain identical CAN timing behavior, ADC linearity, and MCG clock generation architecture.

Availability

MC9S08DZ128MLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, and engine bay sensor hubs requiring stable component supply, extended temperature operation, and long-lifecycle support.

Supply support for MC9S08DZ128MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating to the Motorola 68HC05 era.

The MC9S08DZ128MLF belongs to NXP's legacy HCS08 automotive MCU family, engineered specifically for cost-sensitive, safety-critical body electronics where CAN integration, analog precision, and extended temperature resilience are mandatory.

FAQ

What is the maximum operating temperature range for the MC9S08DZ128MLF?

The MC9S08DZ128MLF is rated for operation from –40°C to +125°C ambient temperature, meeting automotive Grade 2 requirements. This specification is confirmed in Section A.1 (DC Characteristics) of the Rev. 1 datasheet, and the device maintains full functionality-including CAN communication, ADC accuracy, and Flash programming-across this full range without derating.

Does the MC9S08DZ128MLF support CAN FD or only classical CAN?

The MC9S08DZ128MLF supports only classical CAN per ISO 11898-1:2003 (CAN 2.0A/B), with data rates up to 1 Mbps. It does not implement CAN FD features such as flexible data-rate switching, extended data length, or CRC enhancements. Its MSCAN module is functionally identical to that in earlier S08 derivatives and lacks FD-specific registers or timing logic.

What is the ADC reference voltage source for the MC9S08DZ128MLF?

The MC9S08DZ128MLF ADC uses an internal bandgap voltage reference of 1.18–1.21 V (typical 1.20 V), factory trimmed at VDD = 5.0 V. This reference is stable over temperature and supply voltage, and it can be selected via ADCSC1 register bits. External references (VREFH/VREFL pins) are also supported, but the internal bandgap is the default and most commonly used source.

Is the MC9S08DZ128MLF pin-compatible with other members of the DZ series?

Yes - the MC9S08DZ128MLF in the 100-pin LQFP package shares identical pinout with MC9S08DZ96MLF, MC9S08DV128MLF, and MC9S08DV96MLF per Table 2-1 (p.34) of the Rev. 1 datasheet. Memory differences (FLASH/EEPROM/RAM) do not affect pin assignment, enabling hardware reuse across variants during design scaling.

How is debug and programming performed on the MC9S08DZ128MLF?

Debug and programming for the MC9S08DZ128MLF use the single-wire background debug (BDM) interface via the BKGD/MS pin (pin 97). This requires a compatible BDM pod (e.g., P&E Multilink) and supports full-speed debugging, flash erase/program, and real-time bus capture - all documented in Chapter 17 and Appendix B of the datasheet.

MC9S08DZ128MLF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DZ128MLF FAQ

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Please submit a Request for Quotation (RFQ) for MC9S08DZ128MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC9S08DZ128MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ128MLF is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DZ128MLF?

For technical support, including MC9S08DZ128MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ128MLF requirements.

6.How does Aetrix verify that MC9S08DZ128MLF is sourced from the original manufacturer or authorized distributors?

All MC9S08DZ128MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ128MLF meets industry standards.

7.What is the process for return or replacement of MC9S08DZ128MLF?

All MC9S08DZ128MLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ128MLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DZ128MLF part is unused and in its original packaging.

Return procedure for MC9S08DZ128MLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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