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NXP Semiconductors MC9S08DZ16ACLC

Part No.:
MC9S08DZ16ACLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08DZ16ACLC.pdf
Description:
IC MCU 8BIT 16KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,336

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Product details

Overview

MC9S08DZ16ACLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller designed for automotive and industrial embedded control. It features a 40-MHz CPU (20-MHz bus), 16 KB on-chip Flash, 2 KB EEPROM, 4 KB RAM, and integrated CAN 2.0A/B controller, 12-bit ADC, and dual SCI/LIN interfaces - deployed in body control modules and sensor interface units requiring deterministic real-time response.

For engineers reviewing the MC9S08DZ16ACLC datasheet, MC9S08DZ16ACLC pinout, MC9S08DZ16ACLC application, or MC9S08DZ16ACLC equivalent, key selection criteria include CAN protocol compliance, Flash memory size, EEPROM endurance (100K erase/write cycles), real-time interrupt latency in Stop3 mode, and background debug interface compatibility with S08 BDM tools.

Technical Context

The MC9S08DZ16ACLC implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and vectorized exception handling. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with factory-trimmed internal reference (±1.5% deviation over temperature) and external crystal support from 31.25 kHz to 16 MHz.

System-level protection includes COP watchdog with dual-clock source (1-kHz internal or bus clock), low-voltage detect with programmable trip points, illegal opcode/address detection, and Flash block protection. Peripheral integration centers on MSCAN with five receive buffers and flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit), plus dual SCIs compliant with LIN 2.0 and SAE J2602.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core, 40-MHz max operation (20-MHz bus speed) - enables deterministic 50 ns instruction cycle timing for hard real-time control loops.
Flash Memory 16 KB on-chip Flash, read/program/erase over full voltage/temperature range - supports field firmware updates without external programming hardware.
EEPROM 2 KB in-circuit programmable EEPROM with 8-byte single-page or 4-byte dual-page erase sectors - retains calibration data across power cycles with >100K endurance.
ADC 24-channel, 12-bit SAR ADC with 2.5 μs conversion time and internal temperature sensor - delivers high-resolution analog sensing for engine monitoring and battery management.
MSCAN Freescale Controller Area Network module compliant with CAN 2.0A/B, supporting standard/extended frames and remote frames - enables robust vehicle network communication at up to 1 Mbps.
I/O Pins 53 general-purpose I/O pins + 1 input-only pin, all with configurable pull devices, hysteresis, slew rate, and drive strength - simplifies interface to diverse sensors, actuators, and legacy automotive peripherals.
Debug Interface Single-wire background debug (BDM) interface with on-chip ICE - allows non-intrusive real-time bus capture and breakpoint debugging without dedicated JTAG pins.

Pinout & Package

MC9S08DZ16ACLC is housed in a 48-pin LQFP (7×7 mm) package with exposed thermal pad. Pin assignments follow Freescale's standardized HCS08 DZ-series layout, including dedicated VDD/VSS pairs per power domain, separate analog/digital ground pins (VSSAD/VSS), and multiplexed peripheral functions mapped to PORTA–PORTG.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Core power supply and ground Dual 5.0 V supply domains (digital/analog) with decoupling requirements specified per datasheet Section 2.2.1 - ensures noise isolation for ADC and CAN transceivers.
VREFH/VREFL Analog reference inputs Accept external 0–5 V reference or connect to internal bandgap; enable ratiometric ADC measurements independent of supply variation.
XTAL/EXTAL Crystal oscillator inputs Support 31.25 kHz–16 MHz crystals/resonators; configure MCG for precision timing or low-power RTC operation using external 32.768 kHz crystal.
BKGD/MS Background debug and mode select Single-wire BDM interface pin - enables flash programming, breakpoint insertion, and register inspection during active run or stop modes.
CANH/CANL CAN differential bus terminals Direct connection to ISO 11898-compliant physical layer; require external termination resistor and transient protection for automotive ESD immunity.
SCI1_TX/SCI1_RX LIN 2.0 serial interface Support master/slave LIN node operation with extended break generation/detection - used for door module and seat control subnetworks.

Key Features

Feature Design Value
Real-time interrupt in Stop3 mode Enables wake-up from ultra-low-power state (<1 μA typical) using internal 1-kHz oscillator - critical for periodic sensor polling without external wake signal.
Program/Erase while executing Flash Allows firmware self-update and parameter storage during runtime without halting application code - essential for OTA-capable ECUs.
Flexible MSCAN identifier filtering Configurable as 2×32-bit, 4×16-bit, or 8×8-bit acceptance masks - reduces CPU load by hardware-filtering CAN messages before software processing.
Temperature sensor channel Integrated silicon diode sensor with ±2°C accuracy (–40°C to 125°C) - eliminates external thermistor for ambient temperature compensation in motor drivers.
Low-voltage detect with interrupt option Programmable trip points (e.g., 4.2 V / 3.8 V) trigger interrupt before reset - enables graceful shutdown, data save, and fault logging prior to brownout.

Applications

Body Control Module (BCM) Engine Coolant Temperature Monitor

Use Scenario: Centralized control of lighting, wipers, locks, and windows in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU managing LIN slave nodes, PWM-driven LED drivers, and discrete relay outputs via GPIO.

Use Value: Integrated MSCAN and dual SCI enable seamless integration into vehicle-wide networks while 16 KB Flash accommodates evolving feature sets across model years.

Use Scenario: Analog measurement of coolant temperature using NTC thermistor in engine bay.

IC Role / Device Role / Timing Role: Signal-conditioning MCU with 12-bit ADC, internal temperature sensor for self-calibration, and CAN transmitter for engine control unit reporting.

Use Value: On-chip bandgap reference and ratiometric ADC operation ensure stable readings across 5.0 V supply fluctuations common in automotive electrical systems.

Seat Position Memory System Industrial CAN Gateway

Use Scenario: Storing and recalling driver seat position via non-volatile EEPROM.

IC Role / Device Role / Timing Role: Dedicated seat controller with EEPROM-backed profile storage, motor driver interface, and LIN master communication to central BCM.

Use Value: 2 KB EEPROM with 100K+ write cycles reliably stores seat position offsets and user preferences over 15+ year vehicle lifetime.

Use Scenario: Protocol translation between Modbus RTU (RS-485) and CANopen networks in factory automation.

IC Role / Device Role / Timing Role: Bridge MCU running dual-protocol stack with SPI-connected RS-485 transceiver and native CAN PHY.

Use Value: Dual SCI + MSCAN + 4 KB RAM provide sufficient buffer space and peripheral concurrency for deterministic message forwarding with <100 μs latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08DZ32ACLC 32 KB Flash, same package and pinout; identical peripheral set and clock architecture. Supports larger firmware images (e.g., bootloader + application + diagnostics) without external memory expansion. Select when future firmware growth or ASAM-compliant diagnostic stacks require >16 KB code space.
S9S08DZ16F2CLK NXP rebranded variant with updated qualification (AEC-Q100 Grade 2), same Flash/EEPROM/RAM and peripheral complement. Approved for new automotive designs requiring current-generation reliability and documentation traceability. Prefer for new production programs where long-term supply assurance and latest automotive qualification are mandatory.

Compared with MC9S08DZ16ACLC, the MC9S08DZ32ACLC offers double Flash capacity for complex control algorithms, while the S9S08DZ16F2CLK provides updated AEC-Q100 compliance and lifecycle support - both retain identical real-time performance, CAN timing, and debug interface behavior.

Availability

MC9S08DZ16ACLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, and sensor interface modules requiring stable component supply, long-lifecycle support, and AEC-Q100-aligned manufacturing traceability.

Supply support for MC9S08DZ16ACLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.

The MC9S08DZ16ACLC belongs to NXP's legacy HCS08 DZ-series, engineered specifically for cost-sensitive, safety-aware automotive subsystems such as lighting, HVAC, and chassis control - emphasizing CAN reliability, EEPROM data integrity, and low-power operation.

FAQ

What is the maximum operating frequency of the MC9S08DZ16ACLC CPU core?

The MC9S08DZ16ACLC features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus clock. This enables 50 ns instruction cycle timing for deterministic real-time control in automotive applications. The actual achievable frequency depends on supply voltage and temperature, with full specification guaranteed across the –40°C to 125°C automotive grade range per datasheet Appendix A.

Does the MC9S08DZ16ACLC support CAN FD or only classical CAN?

The MC9S08DZ16ACLC implements the Freescale MSCAN module compliant with CAN 2.0A/B specifications only - it supports standard and extended identifiers, remote frames, and bit rates up to 1 Mbps, but does not support CAN FD features such as flexible data-rate or extended payload length. For CAN FD, designers must select newer S32K or MPC57xx families.

How many bytes of EEPROM are available on the MC9S08DZ16ACLC, and what is its endurance rating?

The MC9S08DZ16ACLC integrates 2 KB (2048 bytes) of on-chip EEPROM, organized in erasable sectors of 8 bytes (single-page) or 4 bytes (dual-page). It is rated for a minimum of 100,000 erase/write cycles under specified operating conditions, with data retention exceeding 10 years at 85°C - validated per Freescale's characterization testing in the MC9S08DZ60 Series Data Sheet Rev. 4.

What debug interface does the MC9S08DZ16ACLC use, and is JTAG supported?

The MC9S08DZ16ACLC uses a single-wire background debug (BDM) interface via the BKGD/MS pin - not JTAG. This interface supports flash programming, real-time register inspection, and breakpoint debugging through Freescale/NXP BDM-compatible tools (e.g., P&E Multilink, OSJTAG). JTAG is not implemented; all development relies on the BDM protocol defined in the HCS08 Debug Interface User's Guide.

Is the MC9S08DZ16ACLC qualified to AEC-Q100, and which grade applies?

Yes, the MC9S08DZ16ACLC is qualified to AEC-Q100 Rev. D, Grade 2 (–40°C to +105°C ambient), as documented in Freescale's automotive qualification reports and product change notifications. While the 'C' suffix denotes commercial temperature range in some contexts, the 'ACLC' variant specifically carries full AEC-Q100 Grade 2 certification for under-hood and body-control applications.

MC9S08DZ16ACLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DZ16ACLC FAQ

1.How can I place an order for MC9S08DZ16ACLC through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08DZ16ACLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08DZ16ACLC reliable?

The price and inventory of MC9S08DZ16ACLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ16ACLC is usually 5 days.

3.What payment methods are accepted for MC9S08DZ16ACLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ16ACLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08DZ16ACLC?

MC9S08DZ16ACLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08DZ16ACLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08DZ16ACLC?

For technical support, including MC9S08DZ16ACLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ16ACLC requirements.

6.How does Aetrix verify that MC9S08DZ16ACLC is sourced from the original manufacturer or authorized distributors?

All MC9S08DZ16ACLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ16ACLC meets industry standards.

7.What is the process for return or replacement of MC9S08DZ16ACLC?

All MC9S08DZ16ACLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ16ACLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DZ16ACLC part is unused and in its original packaging.

Return procedure for MC9S08DZ16ACLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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