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NXP Semiconductors MC9S08DZ16AMLC
- Part No.:
- MC9S08DZ16AMLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DZ16AMLC.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,165
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Product details
Overview
MC9S08DZ16AMLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 4 KB RAM, and 2 KB in-circuit programmable EEPROM. It integrates MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0 support, 12-bit 24-channel ADC, two analog comparators, RTC, and six-channel TPM - designed for automotive body electronics and industrial control nodes requiring CAN connectivity and low-power operation.
For engineers reviewing the MC9S08DZ16AMLC datasheet, MC9S08DZ16AMLC pinout, MC9S08DZ16AMLC application, or MC9S08DZ16AMLC equivalent, this page delivers verified specifications, package mapping, functional alternatives, and design-critical timing/peripheral behavior confirmed for the exact MC9S08DZ16AMLC variant.
Technical Context
The MC9S08DZ16AMLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND instruction for single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal/resonator support (1–16 MHz or 31.25 kHz–38.4 kHz).
Peripherals include a full-featured MSCAN module with five receive buffers and flexible identifier filtering (2×32-bit/4×16-bit/8×8-bit), dual SCIs compliant with LIN 2.0 and SAE J2602, and a 12-bit ADC with 2.5 µs conversion time, temperature sensor, and internal bandgap reference - all operating across run, wait, and stop modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core frequency (20-MHz bus) |
| Flash Memory | 16 KB on-chip flash with read/program/erase over full voltage/temperature range |
| RAM | 4 KB on-chip RAM for data and stack operations |
| EEPROM | 2 KB in-circuit programmable EEPROM with 4-byte dual-page or 8-byte single-page erase sectors |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supporting standard/extended frames and remote frames |
| ADC | 12-bit, 24-channel SAR ADC with 2.5 µs conversion time, automatic compare, and integrated temperature sensor |
| Debug Interface | Single-wire background debug (BDM) interface compatible with standard Freescale/NXP BDM tools |
Pinout & Package
MC9S08DZ16AMLC is housed in a 48-pin LQFP (7×7 mm) package with 53 general-purpose I/O pins and one input-only pin. All I/O pins support configurable pull devices, hysteresis, slew rate, and drive strength; 24 pins support edge-selectable interrupts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation in mixed-signal operation |
| XTAL, EXTAL | Crystal/resonator connection | Supports Pierce oscillator for 1–16 MHz or 31.25 kHz–38.4 kHz crystals; enables precise real-time clock and CAN bit timing |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and chip mode configuration during reset; no dedicated debug header required |
| CANL, CANH | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; supports dominant/recessive signaling and fault detection |
| SCI1_TX, SCI1_RX | Serial communication interface | Full-duplex NRZ UART supporting LIN 2.0 master break generation and slave wakeup detection |
| AD0–AD23 | Analog input channels | 24 multiplexed ADC inputs with internal temperature sensor and bandgap reference channel for self-calibration |
Key Features
| Feature | Design Value |
|---|---|
| Two very low-power stop modes (Stop2/Stop3) | Enables <1 µA current draw in Stop3 with RTC wake-up via 1-kHz internal oscillator - no external crystal needed for cyclic sleep/wake |
| On-chip RTC with modulus counter | Provides calendar/time-of-day capability using external 32.768 kHz crystal or free-running 1-kHz internal oscillator for task scheduling |
| Program/erase while executing flash | Allows firmware updates and parameter storage without halting application code - critical for field-upgradable automotive modules |
| Flash block protection and security | Prevents unauthorized read-out or reprogramming of flash contents; supports secure boot and intellectual property protection |
| Integrated MSCAN with FIFO buffering | Five receive buffers with FIFO storage reduce CPU overhead during high-CAN-traffic conditions (e.g., gateway or ECU polling) |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lifts, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN message routing, PWM dimming control, and analog sensor monitoring (e.g., door position, ambient light). Use Value: 16 KB flash accommodates multi-function firmware; MSCAN ensures deterministic communication with other ECUs; low-power stop modes extend battery life during vehicle sleep. | Use Scenario: Local control of power windows, side mirrors, and interior lighting in individual vehicle doors. IC Role / Device Role / Timing Role: CAN node with LIN slave capability for intra-door actuator coordination and diagnostic reporting. Use Value: Dual SCI interfaces enable LIN communication with window motors/mirrors while MSCAN handles vehicle network integration; 24 ADC channels support multiple potentiometers and temperature sensors. |
| Industrial CAN Gateway | Smart Sensor Node |
Use Scenario: Protocol translation between CANopen fieldbus and RS-485 Modbus networks in factory automation. IC Role / Device Role / Timing Role: Bridge controller managing message filtering, store-and-forward, and error handling across heterogeneous buses. Use Value: Flexible MSCAN identifier filters (2×32-bit/4×16-bit/8×8-bit) allow precise message routing; 4 KB RAM supports dual-buffered protocol stacks without external memory. | Use Scenario: Self-contained environmental monitor with temperature, humidity, and voltage sensing in distributed IIoT deployments. IC Role / Device Role / Timing Role: Standalone data acquisition node with CAN telemetry upload and local decision logic (e.g., threshold alarms). Use Value: Integrated 12-bit ADC with temperature sensor and bandgap reference eliminates external precision references; 2 KB EEPROM stores calibration coefficients and event logs non-volatily. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ16F2MLC | Same die, but with enhanced flash endurance (100k program/erase cycles vs. 10k) and extended temperature range (−40°C to 105°C vs. −40°C to 85°C) | Required for under-hood automotive applications with higher thermal stress and longer field life expectations | Select S9S08DZ16F2MLC when extended temperature rating or higher flash endurance is mandatory; otherwise MC9S08DZ16AMLC remains cost-optimized for cabin/body applications. |
| MC9S08DZ32AMLC | Identical pinout and peripheral set, but with 32 KB flash and same 4 KB RAM/2 KB EEPROM | Preferred where firmware complexity or future feature expansion requires additional code space without changing PCB layout | Choose MC9S08DZ32AMLC if firmware growth headroom is needed; MC9S08DZ16AMLC is optimal for fixed-function, space-constrained designs. |
Compared with S9S08DZ16F2MLC and MC9S08DZ32AMLC, the MC9S08DZ16AMLC offers the lowest-cost entry point for CAN-enabled 8-bit control with validated 16 KB flash capacity - ideal for production-stable, volume-sensitive automotive body modules where thermal margin and code size are tightly bounded.
Availability
MC9S08DZ16AMLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, smart sensor nodes, and door module controllers requiring stable component supply across long production lifecycles.
Supply support for MC9S08DZ16AMLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's automotive microcontroller legacy.
The MC9S08DZ16AMLC belongs to the HCS08 DZ-series - a family engineered specifically for cost-sensitive, CAN-based automotive body control applications demanding robustness, low-power operation, and integrated mixed-signal peripherals.
FAQ
What is the maximum bus frequency supported by the MC9S08DZ16AMLC?
The MC9S08DZ16AMLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via an internal divide-by-2 mechanism. This bus speed is fully supported across all operating voltage ranges (2.7–5.5 V) and temperatures (−40°C to +85°C), enabling deterministic timing for CAN bit sampling, ADC conversions, and SCI baud generation without derating.
Does the MC9S08DZ16AMLC include hardware CAN arbitration and error handling?
Yes, the MC9S08DZ16AMLC's MSCAN module implements full ISO 11898-1 CAN 2.0A/B compliance, including hardware-based arbitration, bit stuffing, CRC calculation, acknowledgment handling, and error frame generation. It autonomously manages bus-off recovery and supports error interrupt reporting - reducing CPU load during network fault conditions.
Can the MC9S08DZ16AMLC perform ADC conversions while in stop mode?
No - the MC9S08DZ16AMLC ADC cannot operate in Stop2 or Stop3 modes. However, it supports ADC conversions in Run and Wait modes, and the module retains configuration during Stop entry/exit. For ultra-low-power sensing, use the 1-kHz internal RTC oscillator to wake the device periodically and trigger ADC sampling in Run mode.
What debug interface does the MC9S08DZ16AMLC use, and is external hardware required?
The MC9S08DZ16AMLC uses a single-wire background debug (BDM) interface via the BKGD/MS pin. No external debug header is required - standard NXP/Freescale BDM tools (e.g., USB-ML-PPS, OSJTAG) connect directly to this pin with appropriate level-shifting. The interface supports full-speed execution control, register inspection, and flash programming.
Is the MC9S08DZ16AMLC pin-compatible with other members of the DZ-series?
Yes - the MC9S08DZ16AMLC in the 48-pin LQFP package shares identical pinout with MC9S08DZ32AMLC and MC9S08DZ48AMLC in the same package variant. This allows direct PCB reuse when upgrading flash capacity, provided the application firmware fits within the larger memory footprint and no package-specific peripheral restrictions apply.
MC9S08DZ16AMLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ16AMLC FAQ
1.How can I place an order for MC9S08DZ16AMLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ16AMLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ16AMLC reliable?
The price and inventory of MC9S08DZ16AMLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ16AMLC is usually 5 days.
3.What payment methods are accepted for MC9S08DZ16AMLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ16AMLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DZ16AMLC?
MC9S08DZ16AMLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ16AMLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ16AMLC?
For technical support, including MC9S08DZ16AMLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ16AMLC requirements.
6.How does Aetrix verify that MC9S08DZ16AMLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ16AMLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ16AMLC meets industry standards.
7.What is the process for return or replacement of MC9S08DZ16AMLC?
All MC9S08DZ16AMLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ16AMLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ16AMLC part is unused and in its original packaging.
Return procedure for MC9S08DZ16AMLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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