NXP Semiconductors MC9S08DZ16AMLF
- Part No.:
- MC9S08DZ16AMLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S08DZ16AMLF.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08DZ16AMLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 2 KB EEPROM, and 4 KB RAM, featuring a 40-MHz CPU core (20-MHz bus), integrated MSCAN v2.0A/B controller, 24-channel 12-bit ADC, and dual SCI/LIN interfaces - used in automotive body control modules requiring CAN-based sensor aggregation and low-power wake-on-event operation.
For engineers reviewing the MC9S08DZ16AMLF datasheet, MC9S08DZ16AMLF pinout, MC9S08DZ16AMLF application, or MC9S08DZ16AMLF equivalent, key selection criteria include verified CAN 2.0B compliance, factory-trimmed internal reference clock accuracy (±1.5% FLL deviation), real-time interrupt capability in Stop3 mode, and single-wire background debug interface support for production programming.
Technical Context
The MC9S08DZ16AMLF implements the HCS08 CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and executing instructions at 20 MHz bus speed. Its Multi-Purpose Clock Generator (MCG) provides PLL and FLL modes with factory-trimmed internal reference clock and external crystal support from 1–16 MHz.
On-chip peripherals include a 24-channel 12-bit ADC with 2.5 μs conversion time and temperature sensor, two analog comparators with bandgap reference option, and Freescale's S08MSCANV1 module supporting standard/extended CAN frames, five receive buffers with FIFO, and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 CPUV3, 40-MHz core / 20-MHz bus - enables deterministic real-time control with sub-μs interrupt latency |
| Flash Memory | 16 KB - sufficient for bootloader + application firmware with field-upgrade capability |
| EEPROM | 2 KB in-circuit programmable - supports parameter storage with 8-byte sector erase and program-while-execute |
| RAM | 4 KB - accommodates stack, heap, and real-time data buffers for CAN+ADC concurrent operation |
| CAN Interface | MSCAN v2.0A/B compliant - handles standard/extended frames, remote frames, and 5-buffer FIFO for robust automotive messaging |
| ADC | 24-channel, 12-bit, 2.5 μs conversion - supports simultaneous sampling of battery voltage, cabin temp, and motor current with internal bandgap reference |
| Debug Interface | Single-wire background debug (BDM) - enables in-circuit emulation and flash programming without dedicated JTAG pins |
Pinout & Package
MC9S08DZ16AMLF is packaged in a 48-pin LQFP (7×7 mm, 0.5 mm pitch), with 53 general-purpose I/O pins and 1 input-only pin - pin-compatible with other MC9S08DZxx family members in same package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (core/I/O) and VSS (digital ground); decoupling required per datasheet layout guidelines |
| XTAL, EXTAL | Clock oscillator inputs | Supports 1–16 MHz crystal/resonator for primary system clock; MCG auto-configures FLL/PLL based on external reference |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin - enables flash programming, breakpoint debugging, and real-time register inspection during operation |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external watchdog or power monitor assertion |
| PTA0–PTA7 | Port A general-purpose I/O | Configurable as GPIO, SCI0 TX/RX, SPI MOSI/MISO, or TPM channel outputs - supports slew rate and drive strength control |
| PTB0–PTB7 | Port B general-purpose I/O | Includes CAN0_TX/CAN0_RX on PTB2/PTB3 - dedicated hardware routing ensures deterministic CAN timing without software overhead |
| AD0–AD23 | Analog input channels | 24 multiplexed ADC inputs mapped across ports A–G; selectable reference (VREFH/VREFL or internal bandgap) per conversion sequence |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt in Stop3 mode | Enables ultra-low-power sleep (≤1 μA) with wake-on-CAN-message or GPIO edge - critical for always-on automotive nodes |
| Factory-trimmed internal reference clock | ±1.5% FLL deviation over temperature/voltage - eliminates need for external crystal in cost-sensitive applications |
| In-circuit programmable EEPROM | 2 KB with 4-byte dual-page erase - preserves calibration data and configuration across power cycles without Flash wear |
| Temperature sensor integration | On-die sensor with 1°C resolution - enables thermal monitoring of MCU die for fan control or derating logic |
| Loss-of-lock protection | Automatic clock failover to backup 1-kHz internal oscillator - maintains COP watchdog and RTC operation during main clock failure |
Applications
| Automotive Door Module | Industrial CAN Gateway |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via LIN slaves, with CAN communication to body control unit. IC Role / Device Role / Timing Role: Primary MCU managing peripheral drivers, LIN protocol stack, and CAN message routing with real-time response to door switch interrupts. Use Value: Integrated MSCAN and dual SCI enable direct LIN-to-CAN bridging; 16 KB Flash hosts both application and LIN bootloader; Stop3 mode reduces quiescent current to <1.5 μA during vehicle sleep. | Use Scenario: Protocol translation between legacy RS-485 fieldbus devices and modern CANopen networks in factory automation systems. IC Role / Device Role / Timing Role: Bridge controller performing data mapping, message filtering, and timestamp synchronization between heterogeneous buses. Use Value: 24-channel ADC monitors analog sensor inputs (e.g., pressure, temp) while MSCAN handles priority CAN traffic; 2 KB EEPROM stores device-specific mapping tables persistently. |
| Smart Battery Monitor | Off-Road Vehicle Telematics Node |
Use Scenario: Monitoring 12V lead-acid battery health (voltage, current, temperature) and reporting faults over CAN to dashboard ECU. IC Role / Device Role / Timing Role: Sensor fusion MCU acquiring analog measurements, calculating state-of-charge, and transmitting diagnostic CAN messages at 100 ms intervals. Use Value: Internal bandgap reference ensures accurate ADC readings across voltage range (5.5–30 V); RTC enables time-stamped event logging even during brief power interruptions. | Use Scenario: Ruggedized telematics unit collecting GPS, IMU, and engine CAN data in agricultural or construction equipment with intermittent cellular connectivity. IC Role / Device Role / Timing Role: Edge data aggregator buffering sensor/CAN data in RAM/EEPROM and initiating wireless transmission only when network available. Use Value: 4 KB RAM supports circular buffer for 5+ seconds of high-rate CAN traffic; single-wire BDM simplifies field firmware updates without exposing debug headers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ16F2MLF | Same core, Flash, and peripherals; differs in mask set revision and factory trim calibration - identical electrical specs and pinout | No functional difference; qualified for same automotive temperature grade (-40°C to 125°C) | Select when sourcing newer mask revision with updated MCG trim values for improved clock stability |
| MC9S08DZ32AMLF | 32 KB Flash, same 2 KB EEPROM and 4 KB RAM; identical peripheral set, package, and pinout | Supports larger firmware images (e.g., dual-bank OTA update, enhanced diagnostics), otherwise drop-in compatible | Choose for future-proofing or applications requiring >16 KB code space without PCB redesign |
Compared with MC9S08DZ16AMLF, S9S08DZ16F2MLF offers identical functionality with updated manufacturing calibration, while MC9S08DZ32AMLF provides scalable Flash headroom - both retain the same CAN timing behavior, ADC performance, and low-power stop-mode characteristics essential for automotive body electronics.
Availability
MC9S08DZ16AMLF is available at Aetrix Electronics and suitable for automotive body control units, industrial CAN gateways, smart battery monitors, and off-road telematics nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC9S08DZ16AMLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08DZ series was designed by Freescale (now NXP) specifically for cost-sensitive, safety-conscious automotive body electronics applications requiring integrated CAN, robust analog sensing, and ultra-low-power sleep modes.
FAQ
What is the maximum operating frequency of the MC9S08DZ16AMLF CPU core?
The MC9S08DZ16AMLF features an HCS08 CPUV3 core running at up to 40 MHz, with a 20-MHz bus clock derived via internal divider. This frequency is sustained across the full industrial temperature range (-40°C to 125°C) and supply voltage (2.7–5.5 V), enabling deterministic real-time execution for automotive control loops without overclocking or derating.
Does the MC9S08DZ16AMLF support CAN FD or only classical CAN?
The MC9S08DZ16AMLF implements the S08MSCANV1 module compliant with ISO 11898-1:2003, supporting only Classical CAN (CAN 2.0A/B) at up to 1 Mbps. It does not support CAN FD features such as flexible data-rate, extended data length, or CRC enhancements - confirmed by the Rev. 4 datasheet section 12 and register-level MSCAN specification.
How much EEPROM endurance does the MC9S08DZ16AMLF guarantee?
The MC9S08DZ16AMLF guarantees 100,000 write/erase cycles for its 2 KB on-chip EEPROM, with 8-byte single-page or 4-byte dual-page erase sectors. Endurance is specified under full operating voltage (2.7–5.5 V) and temperature (-40°C to 125°C), and wear leveling must be implemented in firmware since no hardware wear-leveling logic is present.
Can the MC9S08DZ16AMLF operate without an external crystal?
Yes, the MC9S08DZ16AMLF can operate using its internal reference clock (IRC) with factory-trimmed calibration stored in Flash, achieving ±1.5% FLL deviation over voltage and temperature. The MCG supports standalone IRC operation in FEI (Fast Internal) mode, eliminating need for external crystal in non-timing-critical applications like basic sensor polling or LIN slave control.
What debug interface does the MC9S08DZ16AMLF use, and is JTAG supported?
The MC9S08DZ16AMLF uses a single-wire background debug (BDM) interface on the BKGD/MS pin for programming, debugging, and real-time register inspection. JTAG is not supported - the device lacks TDI/TDO/TCK/TMS pins and associated boundary-scan logic, as confirmed by the pin assignment table (Section 2.1) and debug chapter (Chapter 17) of the Rev. 4 datasheet.
MC9S08DZ16AMLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ16AMLF FAQ
1.How can I place an order for MC9S08DZ16AMLF through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ16AMLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ16AMLF reliable?
The price and inventory of MC9S08DZ16AMLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ16AMLF is usually 5 days.
3.What payment methods are accepted for MC9S08DZ16AMLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ16AMLF transactions.
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4.How is shipping managed for MC9S08DZ16AMLF?
MC9S08DZ16AMLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ16AMLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ16AMLF?
For technical support, including MC9S08DZ16AMLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ16AMLF requirements.
6.How does Aetrix verify that MC9S08DZ16AMLF is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ16AMLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ16AMLF meets industry standards.
7.What is the process for return or replacement of MC9S08DZ16AMLF?
All MC9S08DZ16AMLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ16AMLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ16AMLF part is unused and in its original packaging.
Return procedure for MC9S08DZ16AMLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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