NXP Semiconductors MC9S08DZ32ACLC
- Part No.:
- MC9S08DZ32ACLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DZ32ACLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,130
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08DZ32ACLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - deployed in automotive body control modules requiring deterministic timing and robust communication.
For engineers reviewing the MC9S08DZ32ACLC datasheet, MC9S08DZ32ACLC pinout, MC9S08DZ32ACLC application, or MC9S08DZ32ACLC equivalent, key selection criteria include CAN protocol compliance, 24-channel 12-bit ADC performance, single-wire background debug support, and low-power stop mode operation under 1 µA.
Technical Context
The MC9S08DZ32ACLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND instruction for debug entry. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trim stored in Flash.
On-chip peripherals include MSCAN with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), two SCIs supporting LIN 2.0 and SAE J2602, and a 6-channel + 2-channel TPM for PWM and input capture - all operating across Run, Wait, and Stop3 modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core frequency (20-MHz bus) |
| Memory | 32 KB Flash (in-circuit programmable/erase), 2 KB EEPROM, 4 KB RAM |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), five RX buffers, FIFO storage |
| Debug | Single-wire background debug interface (BDM), on-chip ICE with real-time bus capture |
| Power Modes | Stop3 mode current < 1 µA; RTC wake-up from Stop using 1-kHz internal oscillator |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; configurable slew rate, drive strength, and hysteresis |
Pinout & Package
MC9S08DZ32ACLC is housed in a 64-pin LQFP (10×10 mm) package with exposed thermal pad. Pin assignments are defined per Chapter 2 of the MC9S08DZ60 Series Data Sheet Rev. 4, covering dedicated VDD/VSS pairs, crystal inputs (EXTAL/XTAL), CANH/CANL, ADC reference (VREFH/VREFL), and multiplexed peripheral I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power domains; separate VDDAD/VSSAD for ADC noise isolation |
| EXTAL, XTAL | Crystal oscillator inputs | Supports 1–16 MHz crystals or ceramic resonators; enables precise system clock source |
| CANH, CANL | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; supports 1 Mbps data rate |
| VREFH, VREFL | ADC reference voltage terminals | Enable ratiometric or absolute voltage measurement; accept external reference or internal bandgap |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface; asserts during reset to enter active background mode |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external watchdog or power monitor assertion |
Key Features
| Feature | Design Value |
|---|---|
| Flash security and protection | Block-level flash protection with security byte; prevents unauthorized read-out or reprogramming |
| Low-voltage detection | Selectable trip points (e.g., 2.7 V, 3.0 V) with reset or interrupt output - critical for brown-out recovery |
| Real-time counter (RTC) | 8-bit modulus counter with binary/decimal prescaler; runs from 1-kHz internal oscillator during Stop3 |
| Analog comparators | Two ACMP modules with edge-selectable interrupts and internal bandgap reference comparison |
| Timer/PWM flexibility | TPM1 (6-channel) and TPM2 (2-channel) support input capture, output compare, and buffered edge-aligned PWM |
Applications
| Automotive Body Control Unit | Industrial CAN Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time CAN message handling, sensor polling, and actuator drive logic. Use Value: Integrated MSCAN eliminates external CAN controller; 32 KB Flash accommodates firmware updates and diagnostics. | Use Scenario: Distributed I/O node in factory automation systems communicating over industrial CAN networks. IC Role / Device Role / Timing Role: Local controller managing analog sensor inputs (via 24-channel ADC), digital I/O, and CAN messaging. Use Value: 12-bit ADC with temperature sensor and internal reference enables accurate process monitoring without external components. |
| Smart Lighting Controller | Vehicle Diagnostic Tool Interface |
Use Scenario: Adaptive LED headlight control with ambient light sensing, thermal monitoring, and PWM dimming. IC Role / Device Role / Timing Role: Real-time PWM generator (TPM) synchronized to ADC readings and CAN command frames. Use Value: Buffered edge-aligned PWM ensures stable current regulation; Stop3 mode enables ultra-low-power sleep between commands. | Use Scenario: Handheld OBD-II diagnostic tool interfacing with vehicle ECUs via CAN and LIN protocols. IC Role / Device Role / Timing Role: Protocol bridge translating USB/UART commands to CAN/LIN frames using dual SCI and MSCAN. Use Value: Dual SCI with LIN 2.0 and SAE J2602 support enables direct ECU communication without external protocol translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ32F1MLC | Same die, newer mask set; includes updated MCG jitter spec and revised TPM timing per Rev. 4 DS | Identical peripheral set and memory map; pin-compatible with MC9S08DZ32ACLC | Select for new designs requiring latest characterization and extended lifecycle support |
| MC9S08DZ48ACLC | 48 KB Flash, same RAM/EEPROM/peripherals; identical package and pinout | Enables larger firmware images and additional diagnostic routines without layout change | Choose when firmware growth exceeds 32 KB or future-proofing is required |
Compared with MC9S08DZ32ACLC, S9S08DZ32F1MLC offers improved clock jitter performance and updated silicon revision, while MC9S08DZ48ACLC provides 16 KB more Flash in identical footprint - both retain full functional and pin compatibility for drop-in upgrades.
Availability
MC9S08DZ32ACLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, and smart lighting controllers requiring stable component supply, long-term manufacturability, and AEC-Q100-aligned qualification.
Supply support for MC9S08DZ32ACLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DZ32ACLC belongs to the HCS08 DZ-series, designed specifically for cost-sensitive automotive body electronics requiring CAN, ADC, and low-power operation in harsh environments.
FAQ
What is the maximum bus frequency supported by the MC9S08DZ32ACLC?
The MC9S08DZ32ACLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a 2:1 divider. This frequency is maintained across all operating modes including Run and Wait, and is compatible with MSCAN timing requirements up to 1 Mbps. The MCG module allows configuration of multiple clock sources - including internal reference, crystal, or PLL - to sustain this bus speed under varying voltage and temperature conditions. MC9S08DZ32ACLC maintains timing integrity through on-chip clock monitoring and loss-of-lock protection.
Does the MC9S08DZ32ACLC support in-circuit programming of Flash and EEPROM?
Yes, the MC9S08DZ32ACLC supports full in-circuit programming and erasure of both Flash and EEPROM across its entire operating voltage and temperature range. Flash erase operations can be performed in sector sizes, while EEPROM supports 8-byte single-page or 4-byte dual-page erase. The device also enables program-and-erase-while-executing (PEWE) functionality, allowing background firmware updates without halting application code. MC9S08DZ32ACLC includes flash block protection and security features to prevent unauthorized access during field programming.
How many CAN message buffers does the MC9S08DZ32ACLC provide, and what filtering options are available?
The MC9S08DZ32ACLC integrates the MSCAN module with five dedicated receive buffers organized in FIFO structure. Identifier acceptance filtering is fully programmable in three configurations: two 32-bit filters, four 16-bit filters, or eight 8-bit filters - enabling flexible message prioritization and bandwidth allocation. All filters operate independently of CPU intervention and support standard (11-bit) and extended (29-bit) frame formats per CAN 2.0A/B. MC9S08DZ32ACLC uses these buffers to decouple reception from processing, reducing latency in high-traffic CAN networks.
What debug interface does the MC9S08DZ32ACLC use, and is it compatible with standard tools?
The MC9S08DZ32ACLC uses a single-wire background debug mode (BDM) interface compliant with Freescale/NXP's BDM specification. It is supported by standard tools including the P&E Micro USB-ML-12 and SEGGER J-Link (with BDM firmware), as well as NXP's S08 CodeWarrior IDE. The interface provides non-intrusive breakpoint setting, register inspection, and real-time memory access without requiring dedicated debug pins beyond BKGD/MS and RESET. MC9S08DZ32ACLC also includes on-chip in-circuit emulation (ICE) with real-time bus capture for timing-critical analysis.
What low-power modes are available on the MC9S08DZ32ACLC, and how does RTC function in Stop mode?
The MC9S08DZ32ACLC offers two very low-power Stop modes (Stop2 and Stop3), plus a reduced-power Wait mode. In Stop3 mode, current consumption drops below 1 µA while retaining RAM and register contents. The real-time counter (RTC) continues running using the dedicated 1-kHz internal low-power oscillator - enabling cyclic wake-up events without external crystal or components. MC9S08DZ32ACLC supports RTC-triggered exit from Stop3 to Run mode, making it suitable for battery-powered nodes requiring periodic sensor sampling or CAN heartbeat transmission.
MC9S08DZ32ACLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ32ACLC FAQ
1.How can I place an order for MC9S08DZ32ACLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ32ACLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ32ACLC reliable?
The price and inventory of MC9S08DZ32ACLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ32ACLC is usually 5 days.
3.What payment methods are accepted for MC9S08DZ32ACLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ32ACLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DZ32ACLC?
MC9S08DZ32ACLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ32ACLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ32ACLC?
For technical support, including MC9S08DZ32ACLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ32ACLC requirements.
6.How does Aetrix verify that MC9S08DZ32ACLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ32ACLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ32ACLC meets industry standards.
7.What is the process for return or replacement of MC9S08DZ32ACLC?
All MC9S08DZ32ACLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ32ACLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ32ACLC part is unused and in its original packaging.
Return procedure for MC9S08DZ32ACLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08DZ32ACLC Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

