NXP Semiconductors MC9S08DZ32ACLF
- Part No.:
- MC9S08DZ32ACLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S08DZ32ACLF.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08DZ32ACLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control nodes requiring robust communication and low-power operation.
For engineers reviewing the MC9S08DZ32ACLF datasheet, MC9S08DZ32ACLF pinout, MC9S08DZ32ACLF application, or MC9S08DZ32ACLF equivalent, key selection criteria include CAN protocol compliance, 12-bit ADC conversion time (2.5 μs), single-wire background debug interface, and support for Stop3/Stop2 ultra-low-power modes in automotive temperature range.
Technical Context
The MC9S08DZ32ACLF implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with HC08 instruction set extension including BGND for debug. It integrates a Multi-Purpose Clock Generator (MCG) supporting FLL (±1.5% accuracy with internal trim) and PLL modes, plus factory-trimmed internal reference clock.
Peripherals include MSCAN with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), two SCIs compliant with LIN 2.0 and SAE J2602, and a 24-channel 12-bit ADC with temperature sensor and internal bandgap reference - all operating across –40°C to +125°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core frequency (20-MHz bus) |
| Memory | 32 KB Flash (read/program/erase over full VDD/temp), 4 KB RAM, 2 KB EEPROM (in-circuit programmable, 4-/8-byte erase sectors) |
| ADC | 24-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames, remote frames, and FIFO-based 5-buffer receive |
| Power Modes | Run, Wait, Stop2, Stop3; RTC wake-up from Stop using 1-kHz internal oscillator; real-time interrupt active in all modes |
| Package & Temp | 48-pin LQFP (7×7 mm), rated for –40°C to +125°C ambient operation |
| Debug | Single-wire background debug interface (BDM), on-chip in-circuit emulation with real-time bus capture |
Pinout & Package
MC9S08DZ32ACLF is housed in a 48-pin low-profile quad flat-pack (LQFP) package measuring 7×7 mm with 0.5 mm pitch, optimized for automotive PCB layouts requiring thermal reliability and EMI resilience.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply pins (VDDAD/VSSAD for analog domain; VDD/VSS for digital/core); decoupling required per datasheet layout guidelines |
| XTAL, EXTAL | Crystal/resonator interface | Connects to 1–16 MHz crystal or ceramic resonator for primary clock source; supports Pierce oscillator configuration |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication pin; also selects boot mode during reset; requires pull-up for normal operation |
| RESET | Active-low reset input | Asynchronous reset assertion; internal pull-up; compatible with external supervisor ICs for power-on and brownout detection |
| CANH, CANL | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; supports 125 kbps to 1 Mbps data rates with proper termination |
| AD0–AD23 | Analog input channels | 24 multiplexed ADC inputs shared with GPIO; configurable hysteresis and pull devices; VREFH/VREFL define conversion range |
| PTA0–PTG7 | General-purpose I/O | 53 total GPIO pins (including one input-only); each supports configurable slew rate, drive strength, interrupt on edge/level, and internal pull devices |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B controller | Enables direct connection to automotive CAN networks without external protocol translation; supports message filtering and FIFO buffering for deterministic latency |
| Real-time counter (RTC) with 1-kHz oscillator | Provides autonomous wake-up from Stop3 mode without external crystal; enables battery-backed timekeeping and periodic task scheduling |
| Flash and EEPROM with program/erase while execute (PEWE) | Allows firmware updates and data logging during runtime; sector erase abort prevents corruption during power loss |
| Multi-Purpose Clock Generator (MCG) | Combines FLL, PLL, and internal/external reference sources; factory-trimmed IRC enables accurate timing without external components in cost-sensitive designs |
| Single-wire background debug (BDM) | Reduces debug footprint to one pin; supports full memory access, register inspection, and breakpoint execution without halting real-time peripherals |
Applications
| Automotive Door Module | Industrial CAN Gateway |
|---|---|
|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU executing CAN message handling, PWM motor control, and analog sensor acquisition (e.g., position, temperature). Use Value: Integrated MSCAN and 24-channel ADC eliminate external interface ICs; Stop3 mode reduces quiescent current to <10 µA for battery-conscious always-on functions. |
Use Scenario: Protocol translation between CAN FD backbone and legacy CAN 2.0 subnetworks in factory automation systems. IC Role / Device Role / Timing Role: Bridge controller managing dual CAN interfaces, message filtering, and timestamped forwarding with minimal latency jitter. Use Value: Hardware-accelerated identifier filtering (2×32-bit mode) and five-receive-buffer FIFO ensure deterministic message handling under 100% bus load. |
| Body Control Module (BCM) Subnode | Off-Highway Equipment Monitor |
|
Use Scenario: Distributed node monitoring HVAC actuators, seat position sensors, and ambient light levels in passenger compartment subsystems. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog, digital, and CAN inputs; generating LIN-compliant outputs to local actuators. Use Value: Dual SCI modules with LIN 2.0 and SAE J2602 support enable direct communication with LIN slaves; internal temperature sensor aids thermal derating logic. |
Use Scenario: Harsh-environment telemetry unit collecting engine oil pressure, coolant temperature, and hydraulic flow data in construction or agricultural machinery. IC Role / Device Role / Timing Role: Ruggedized data logger with CAN reporting, EEPROM-based event storage, and RTC-triggered sampling intervals. Use Value: AEC-Q100 qualified operation to +125°C ensures reliability in engine bay mounting; 2 KB EEPROM provides nonvolatile storage for fault logs without external serial flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48ACLF | 48 KB Flash, same peripheral set and pinout; identical package and temperature rating | Supports larger firmware images and more complex CAN message tables; no change to hardware design | Select when firmware size exceeds 32 KB or future scalability is required without PCB revision |
| S9S08DZ32F1CLK | NXP rebranded successor with identical architecture, Flash/RAM/EEPROM sizes, and pin compatibility; updated qualification per AEC-Q100 Rev G | Offers extended lifecycle support and enhanced automotive qualification; drop-in replacement for new designs | Prefer for new automotive programs requiring latest NXP product assurance and long-term availability commitment |
Compared with MC9S08DZ32ACLF, MC9S08DZ48ACLF provides headroom for feature expansion without layout changes, while S9S08DZ32F1CLK delivers identical functionality with updated automotive qualification and guaranteed supply continuity - both preserve the same CAN timing behavior, ADC performance, and debug interface.
Availability
MC9S08DZ32ACLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, and off-highway equipment monitors requiring stable component supply, extended temperature operation, and long-lifecycle assurance.
Supply support for MC9S08DZ32ACLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.
The MC9S08DZ32ACLF belongs to the HCS08 DZ-series, engineered specifically for cost-sensitive, safety-aware automotive body control and chassis applications demanding integrated CAN, robust analog sensing, and ultra-low-power sleep modes.
FAQ
What is the maximum operating frequency of the MC9S08DZ32ACLF CPU core?
The MC9S08DZ32ACLF features an HCS08 CPU core with a maximum core frequency of 40 MHz, delivering a 20-MHz bus speed. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, with internal reference trimming ensuring ±1.5% accuracy across temperature and voltage. The MC9S08DZ32ACLF maintains this performance within its specified –40°C to +125°C operating range.
Does the MC9S08DZ32ACLF support CAN FD or only classical CAN?
The MC9S08DZ32ACLF implements the MSCAN module compliant exclusively with ISO 11898-1 (Classical CAN 2.0A/B), supporting standard and extended identifiers, remote frames, and five-receive-buffer FIFO operation - but it does not support CAN FD data rates or protocol extensions. For CAN FD capability, designers must consider newer NXP S32K or Kinetis families. The MC9S08DZ32ACLF remains fully interoperable with legacy CAN 2.0 networks used in automotive body control systems.
How much EEPROM is integrated into the MC9S08DZ32ACLF, and what are its erase characteristics?
The MC9S08DZ32ACLF integrates 2 KB of in-circuit programmable EEPROM with flexible erase granularity: 8-byte single-page or 4-byte dual-page sectors. Erase operations can be aborted safely to prevent data corruption during power interruption, and both program and erase functions operate concurrently with Flash execution. This EEPROM is rated for 100,000 erase/write cycles and retains data for 10 years at +85°C - making it suitable for calibration storage and fault logging in automotive applications.
What debug interface does the MC9S08DZ32ACLF provide, and is JTAG supported?
The MC9S08DZ32ACLF uses a single-wire background debug mode (BDM) interface via the BKGD/MS pin - not JTAG. This interface supports full memory access, register read/write, breakpoint insertion, and real-time bus capture without halting peripheral operation. No external debug header or multi-pin connector is required. The MC9S08DZ32ACLF does not implement IEEE 1149.1 (JTAG) or SWD; BDM is the sole standardized debug path defined in its documentation and supported by NXP's CodeWarrior and S32DS toolchains.
Is the MC9S08DZ32ACLF qualified for automotive use, and what temperature grade does it meet?
Yes, the MC9S08DZ32ACLF is AEC-Q100 qualified for automotive applications and rated for operation from –40°C to +125°C ambient temperature. Its qualification covers stress testing for reliability, including HTOL, TC, and ESD per AEC standards. The "ACLF" suffix explicitly denotes the automotive-grade 48-pin LQFP variant. This makes the MC9S08DZ32ACLF suitable for under-hood and cabin-mounted body control modules where thermal robustness and long-term stability are mandatory - consistent with its original Freescale design intent and NXP's continued automotive support.
MC9S08DZ32ACLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ32ACLF FAQ
1.How can I place an order for MC9S08DZ32ACLF through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ32ACLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ32ACLF reliable?
The price and inventory of MC9S08DZ32ACLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ32ACLF is usually 5 days.
3.What payment methods are accepted for MC9S08DZ32ACLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ32ACLF transactions.
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4.How is shipping managed for MC9S08DZ32ACLF?
MC9S08DZ32ACLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ32ACLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ32ACLF?
For technical support, including MC9S08DZ32ACLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ32ACLF requirements.
6.How does Aetrix verify that MC9S08DZ32ACLF is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ32ACLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ32ACLF meets industry standards.
7.What is the process for return or replacement of MC9S08DZ32ACLF?
All MC9S08DZ32ACLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ32ACLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ32ACLF part is unused and in its original packaging.
Return procedure for MC9S08DZ32ACLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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