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NXP Semiconductors MC9S08DZ32AMLC

Part No.:
MC9S08DZ32AMLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixMC9S08DZ32AMLC.pdf
Description:
IC MCU 8BIT 32KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,305

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Product details

Overview

MC9S08DZ32AMLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control nodes requiring robust communication and low-power operation.

For engineers reviewing the MC9S08DZ32AMLC datasheet, MC9S08DZ32AMLC pinout, MC9S08DZ32AMLC application, or MC9S08DZ32AMLC equivalent, this page delivers verified specifications, package mapping to 48-pin LQFP (7×7 mm), functional peripheral details, and validated alternative options for CAN-enabled embedded control designs.

Technical Context

The MC9S08DZ32AMLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal support from 1–16 MHz.

On-chip peripherals include a 24-channel 12-bit ADC (2.5 µs conversion), two analog comparators, dual SCI modules compliant with LIN 2.0 and SAE J2602, SPI, I²C, two TPM timers (6- and 2-channel), and a real-time counter with 1 kHz low-power oscillator - all operating across run, wait, and stop3 modes.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40-MHz max core frequency (20-MHz bus)
Memory32 KB Flash (in-circuit programmable/erase), 4 KB RAM, 2 KB EEPROM
CAN InterfaceMSCAN module: CAN 2.0A/B compliant, 5 receive buffers with FIFO, programmable acceptance filters
ADC24-channel, 12-bit resolution, 2.5 µs conversion time, internal temperature sensor & bandgap reference
Package48-pin LQFP (7×7 mm), RoHS-compliant, lead-free
Power ModesRun, Wait, Stop2, Stop3; real-time interrupt active in all modes; 1-kHz low-power RTC oscillator
DebugSingle-wire background debug interface (BKGD/MS pin), on-chip ICE with real-time bus capture

Pinout & Package

MC9S08DZ32AMLC is housed in a 48-pin low-profile quad flat-pack (LQFP) measuring 7×7 mm with 0.5 mm pitch. Pin functions are defined per Freescale MC9S08DZ60 Series Data Sheet Rev. 4 (2008), Section 2.1.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD); separate decoupling required
XTAL, EXTALCrystal oscillator inputsSupports 1–16 MHz crystals/resonators for primary system clock; enables MCG FLL/PLL modes
BKGD/MSBackground debug / mode selectSingle-wire debug interface pin; also selects boot mode (normal vs. background); requires pull-up for normal operation
RESETActive-low reset inputAsynchronous reset with internal pull-up; supports external reset supervisor or manual reset button
VREFH, VREFLADC reference voltage terminalsAccept external reference (0.5–VDD) or connect to internal bandgap; define full-scale ADC range
PTA0–PTA7Port A general-purpose I/O8-bit port with configurable slew rate, drive strength, pull devices, and edge-sensitive interrupts
CANRX, CANTXCAN transceiver interfaceDedicated differential CAN bus pins; require external transceiver (e.g., MC33886, TJA1040) for physical layer

Key Features

FeatureDesign Value
Integrated MSCAN ControllerFull CAN 2.0A/B protocol stack with five hardware receive buffers and flexible identifier filtering - eliminates need for external CAN controller in cost-sensitive nodes
In-System Programmable EEPROM2 KB of EEPROM with 4-byte dual-page or 8-byte single-page erase sectors - enables field firmware updates and parameter storage without Flash wear
Low-Power Real-Time Interrupt1-kHz free-running oscillator powers RTC and wake-up logic in Stop3 mode - allows periodic wake-up every 1 ms without external components
Temperature-Sensing ADC ChannelDedicated internal temperature sensor with calibrated output - provides on-chip thermal monitoring for fan control or overtemperature shutdown without external sensors
Single-Wire Background DebugUses only BKGD/MS pin for full debug visibility - reduces PCB routing complexity and BOM count versus JTAG solutions

Applications

Body Control Module (BCM)Door Module Control

Use Scenario: Centralized vehicle subsystem managing lighting, window lifts, locks, and mirrors via CAN network.

IC Role / Device Role / Timing Role: Primary CAN node executing real-time actuator control and sensor polling using TPM PWM outputs and ADC inputs.

Use Value: 32 KB Flash accommodates multi-function firmware; MSCAN ensures deterministic message handling; Stop3 mode extends battery life during vehicle sleep.

Use Scenario: Distributed door electronics controlling power windows, side mirrors, and anti-pinch detection.

IC Role / Device Role / Timing Role: Local CAN endpoint with analog comparator inputs for motor current sensing and ADC-based position feedback.

Use Value: Dual ACMPs enable fast overcurrent detection; 24-channel ADC supports multiple potentiometers and thermistors; LIN-capable SCI interfaces with master BCM.

Industrial CAN GatewaySmart Sensor Node

Use Scenario: Protocol translator bridging Modbus RTU (via SCI) to CANopen networks in factory automation.

IC Role / Device Role / Timing Role: Dual-SCI + MSCAN hub performing frame translation, buffering, and priority arbitration.

Use Value: Two independent SCIs support simultaneous master/slave LIN and legacy RS-485; 4 KB RAM enables packet queuing; EEPROM stores routing tables.

Use Scenario: Self-contained environmental monitor with temperature, humidity, and vibration sensing deployed in remote locations.

IC Role / Device Role / Timing Role: Low-power data acquisition node using RTC wake-up, ADC sampling, and CAN transmission bursts.

Use Value: 1-kHz RTC oscillator enables precise 1-second wake intervals; internal temperature sensor reduces component count; Stop3 mode draws <1 µA typical.

Equivalent & Alternatives

The following parts are listed as comparable options for similar CAN-enabled microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08DZ32F1MLCSame die, newer mask set; enhanced ESD rating (±8 kV HBM), updated MCG trim calibration, minor errata fixesIdentical peripheral set and memory map; drop-in replacement for new designs requiring extended lifecycle supportSelect S9S08DZ32F1MLC for new designs where long-term availability and improved robustness are prioritized
MC9S08DZ48AMLCSame package and pinout; +16 KB Flash (48 KB total), same RAM/EEPROM/peripheralsEnables larger firmware images (e.g., bootloader + application), more complex state machines, or additional protocol stacksChoose MC9S08DZ48AMLC when firmware size exceeds 32 KB or future scalability is required

Compared with MC9S08DZ32AMLC, S9S08DZ32F1MLC offers enhanced reliability without design changes, while MC9S08DZ48AMLC provides headroom for feature expansion - both retain identical CAN timing, ADC performance, and low-power behavior.

Availability

MC9S08DZ32AMLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, smart sensor nodes, and door module control requiring stable component supply and long-lifecycle support.

Supply support for MC9S08DZ32AMLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08DZ series was developed by Freescale (acquired by NXP in 2015) specifically for cost-sensitive, CAN-based automotive body electronics and industrial control nodes demanding high integration and low-power operation.

FAQ

What is the maximum operating frequency of the MC9S08DZ32AMLC CPU core?

The MC9S08DZ32AMLC features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding 20 MHz bus frequency. This timing is achievable under full voltage (4.5–5.5 V) and temperature (–40°C to +125°C) ranges as specified in the Freescale MC9S08DZ60 Series Data Sheet Rev. 4. The actual bus speed depends on the selected MCG mode and divider settings.

Does the MC9S08DZ32AMLC include a built-in CAN transceiver?

No, the MC9S08DZ32AMLC integrates only the MSCAN controller (protocol layer), not the physical CAN transceiver. External transceivers such as the TJA1040 or MC33886 must be used on the CANTX/CANRX pins to drive the CAN bus. This separation allows design flexibility in selecting transceivers optimized for voltage range, fault protection, or EMC performance.

How much EEPROM memory does the MC9S08DZ32AMLC provide, and what are its key usage characteristics?

The MC9S08DZ32AMLC includes 2 KB of in-circuit programmable EEPROM with 4-byte dual-page or 8-byte single-page erase sectors. It supports program-and-erase-while-executing Flash, enabling runtime parameter updates without halting application code. Erase operations can be aborted, and the EEPROM retains data for >10 years with >100,000 write cycles per sector.

What debug interface does the MC9S08DZ32AMLC support, and what hardware is required?

The MC9S08DZ32AMLC supports a single-wire background debug interface via the BKGD/MS pin. No dedicated debug header is needed - only a compatible debugger (e.g., P&E Multilink, SEGGER J-Link with SWD adapter) and a simple pull-up resistor on BKGD/MS for normal operation. On-chip ICE provides real-time bus capture without intrusive probes.

Is the MC9S08DZ32AMLC pin-compatible with other members of the DZ series, such as the MC9S08DZ48AMLC?

Yes, the MC9S08DZ32AMLC in the 48-pin LQFP package is pin-compatible with the MC9S08DZ48AMLC and MC9S08DZ16AMLC in the same package variant. All share identical pin assignments, electrical characteristics, and peripheral mappings - enabling hardware reuse across memory variants during design scaling or cost optimization.

MC9S08DZ32AMLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08DZ32AMLC FAQ

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Please submit a Request for Quotation (RFQ) for MC9S08DZ32AMLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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5.How can I obtain technical support or documentation for MC9S08DZ32AMLC?

For technical support, including MC9S08DZ32AMLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ32AMLC requirements.

6.How does Aetrix verify that MC9S08DZ32AMLC is sourced from the original manufacturer or authorized distributors?

All MC9S08DZ32AMLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ32AMLC meets industry standards.

7.What is the process for return or replacement of MC9S08DZ32AMLC?

All MC9S08DZ32AMLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ32AMLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08DZ32AMLC part is unused and in its original packaging.

Return procedure for MC9S08DZ32AMLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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