NXP Semiconductors MC9S08DZ32AMLH
- Part No.:
- MC9S08DZ32AMLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DZ32AMLH.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:595
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Product details
Overview
MC9S08DZ32AMLH from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control nodes requiring robust communication and low-power operation.
For engineers reviewing the MC9S08DZ32AMLH datasheet, MC9S08DZ32AMLH pinout, MC9S08DZ32AMLH application, or MC9S08DZ32AMLH equivalent, key selection criteria include CAN protocol compliance, 24-channel 12-bit ADC performance, single-wire background debug support, and LQFP-48 package compatibility with automotive temperature range (−40°C to 125°C).
Technical Context
The MC9S08DZ32AMLH implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with a Multi-Purpose Clock Generator supporting FLL/PLL modes and factory-trimmed internal reference. Its MSCAN module supports standard/extended frames, five receive buffers with FIFO, and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit).
Peripherals include two SCIs compliant with LIN 2.0 and SAE J2602, a 6-channel + 2-channel TPM for PWM and capture, RTC with external crystal or 1 kHz internal oscillator, and dual analog comparators with bandgap reference option - all operating across full automotive voltage (2.7–5.5 V) and temperature ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core clock (20-MHz bus) |
| Memory | 32 KB Flash (in-circuit programmable), 4 KB RAM, 2 KB EEPROM |
| ADC | 24-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor |
| CAN Interface | MSCAN v1.0, CAN 2.0A/B compliant, 5 receive buffers with FIFO, flexible ID filtering |
| Package | 48-pin LQFP (7×7 mm), RoHS-compliant, −40°C to +125°C operating range |
| Debug | Single-wire background debug interface (BDM), on-chip ICE with real-time bus capture |
| Power Modes | Two very low-power stop modes, reduced-power wait mode, real-time interrupt in all states |
Pinout & Package
MC9S08DZ32AMLH is housed in a 48-pin LQFP (7×7 mm) package with exposed thermal pad (MLP variant not applicable). Pin functions align with MC9S08DZ60 series mechanical drawings and electrical assignments per Rev. 4 datasheet, Chapter 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 1–16 MHz crystals or ceramic resonators; enables precise timing for CAN and RTC |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface; active-low during reset for mode configuration |
| CANL, CANH | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; integrated CAN protocol engine handles arbitration and error handling |
| AD0–AD23 | Analog input channels | 24 multiplexed inputs shared with GPIO; configurable for single-ended or differential acquisition |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 total GPIO pins with configurable pull-up/pull-down, slew rate, drive strength, and edge-triggered interrupts |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN controller | Enables standalone CAN node implementation without external protocol IC; supports wake-on-CAN in stop mode |
| Factory-trimmed internal reference clock | Reduces BOM count by eliminating external crystal for non-timing-critical subsystems; trim value stored in Flash |
| Real-time counter with 1 kHz internal oscillator | Provides autonomous wake-up scheduling without external components - critical for battery-powered modules |
| Flash block protection and security | Prevents unauthorized read-out or reprogramming of firmware; supports field updates while protecting calibration data |
| Single-wire background debug (BDM) | Minimizes PCB routing overhead vs. JTAG; enables in-system programming and real-time trace during development |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lifts, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN-based command arbitration, ADC-based sensor monitoring (e.g., rain/light sensors), and PWM-driven motor control. Use Value: Integrated MSCAN and 24-channel ADC eliminate need for discrete CAN controller and external ADC, reducing component count and board area. | Use Scenario: Localized control of power windows, door locks, and side mirror positioning in vehicle door assemblies. IC Role / Device Role / Timing Role: Standalone node communicating via low-speed CAN; uses RTC for timed lock/unlock sequences and ACMP for tamper detection. Use Value: Very low-power stop modes extend battery life during vehicle sleep; hysteresis-enabled GPIOs tolerate noisy automotive environments. |
| Industrial CAN Node | Smart Sensor Hub |
Use Scenario: Distributed I/O module collecting analog/digital signals and relaying data over industrial CAN bus. IC Role / Device Role / Timing Role: Edge-processing node performing local ADC sampling, digital filtering, and CAN message formatting before transmission. Use Value: On-chip 2 KB EEPROM stores calibration coefficients and device configuration; SPI/SCI interfaces enable local diagnostics and firmware updates. | Use Scenario: Multi-sensor aggregation unit (temperature, humidity, vibration) with CAN output for predictive maintenance systems. IC Role / Device Role / Timing Role: Sensor fusion processor using internal temperature sensor and ADC channels; RTC schedules periodic wake-up for low-duty-cycle sampling. Use Value: 125°C rating allows placement near heat sources (e.g., motors); internal bandgap reference ensures stable ADC accuracy across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ32F1MLH | Same core, memory, and peripherals; differs only in mask set revision and minor errata fixes - functionally identical silicon | No change in CAN timing, ADC linearity, or power consumption specs; validated for same automotive qualification tests | Select when latest mask set and documented errata resolution are required for new designs |
| MC9S08DZ48AMLH | 48 KB Flash (vs. 32 KB), identical package, pinout, and peripheral set; otherwise electrically and functionally compatible | Enables larger firmware images (e.g., bootloader + application + OTA update partition) without layout change | Choose for future-proofing or when firmware size exceeds 32 KB; drop-in upgrade path confirmed in Freescale migration guide |
Compared with MC9S08DZ32AMLH, S9S08DZ32F1MLH offers identical functionality with updated manufacturing mask, while MC9S08DZ48AMLH provides 16 KB additional Flash in the same footprint - both preserve CAN timing, ADC performance, and debug interface behavior for seamless integration.
Availability
MC9S08DZ32AMLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN networks, and smart sensor nodes requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for MC9S08DZ32AMLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The MC9S08DZ32AMLH belongs to the HCS08 DZ family - engineered specifically for cost-sensitive, high-reliability automotive body control and industrial networking applications requiring integrated CAN, robust analog front-end, and extended temperature operation.
FAQ
What is the maximum operating frequency of the MC9S08DZ32AMLH CPU core?
The MC9S08DZ32AMLH CPU core operates at up to 40 MHz, with a corresponding 20 MHz bus clock. This frequency is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, supported by either external crystal (1–16 MHz) or factory-trimmed internal reference. The MC9S08DZ32AMLH maintains this performance across its full −40°C to +125°C automotive temperature range.
Does the MC9S08DZ32AMLH support CAN FD or only classical CAN?
The MC9S08DZ32AMLH supports only Classical CAN (ISO 11898-1, CAN 2.0A/B) - not CAN FD. Its MSCAN module implements version 1.0 of Freescale's CAN controller, providing standard and extended frame support, five receive buffers with FIFO, and programmable identifier filtering. CAN FD requires higher bit rates and enhanced data length capability not present in the MC9S08DZ32AMLH hardware architecture.
What is the ADC resolution and channel count on the MC9S08DZ32AMLH?
The MC9S08DZ32AMLH integrates a 12-bit successive-approximation ADC with 24 input channels. Conversion time is 2.5 μs per sample, and it includes automatic compare, temperature sensor, and internal bandgap reference channel. All 24 channels are multiplexed onto GPIO pins and share the same analog power domain (VDDAD/VSSAD), as specified in the MC9S08DZ32AMLH datasheet Section 10.
Is the MC9S08DZ32AMLH pin-compatible with other devices in the DZ series?
Yes - the MC9S08DZ32AMLH in the 48-pin LQFP package is pin-compatible with MC9S08DZ48AMLH and MC9S08DZ16AMLH within the same package variant. Pin assignments, peripheral mappings, and power/ground connections match across these variants. However, it is not pin-compatible with the 64-pin or 32-pin LQFP versions of the DZ series due to differing pin counts and signal allocations.
What debug interface does the MC9S08DZ32AMLH provide, and what tools support it?
The MC9S08DZ32AMLH features a single-wire background debug mode (BDM) interface compliant with Freescale's BDM specification. It is supported by NXP's S08 Cyclone Pro, USB-ML-12, and compatible third-party debug probes. The interface enables full in-circuit emulation (ICE), real-time bus capture, flash programming, and breakpoint debugging - all using only the BKGD/MS pin and ground.
MC9S08DZ32AMLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ32AMLH FAQ
1.How can I place an order for MC9S08DZ32AMLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ32AMLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ32AMLH reliable?
The price and inventory of MC9S08DZ32AMLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ32AMLH is usually 5 days.
3.What payment methods are accepted for MC9S08DZ32AMLH?
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MC9S08DZ32AMLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ32AMLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ32AMLH?
For technical support, including MC9S08DZ32AMLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ32AMLH requirements.
6.How does Aetrix verify that MC9S08DZ32AMLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ32AMLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ32AMLH meets industry standards.
7.What is the process for return or replacement of MC9S08DZ32AMLH?
All MC9S08DZ32AMLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ32AMLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ32AMLH part is unused and in its original packaging.
Return procedure for MC9S08DZ32AMLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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