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NXP Semiconductors MC9S08DZ60ACLC
- Part No.:
- MC9S08DZ60ACLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DZ60ACLC.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:505
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Product details
Overview
MC9S08DZ60ACLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control systems requiring robust communication and deterministic timing.
For engineers reviewing the MC9S08DZ60ACLC datasheet, MC9S08DZ60ACLC pinout, MC9S08DZ60ACLC application, or MC9S08DZ60ACLC equivalent, key selection criteria include CAN protocol compliance, 24-channel 12-bit ADC performance, single-wire background debug interface, and support for stop-mode power management down to 1 µA.
Technical Context
The MC9S08DZ60ACLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with hardware support for up to 32 interrupt/reset sources and a multi-purpose clock generator (MCG) offering FLL, PLL, and internal/external reference modes. Its MCG achieves ±1.5% frequency stability using factory-trimmed internal reference with stored trim value in Flash.
System-level protection includes COP watchdog with dual-clock source (1 kHz backup or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, and Flash block protection - all enabling reliable operation in automotive-grade temperature ranges (–40°C to +105°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with BGND instruction; 40-MHz max core / 20-MHz bus frequency |
| Memory | 60 KB Flash (read/program/erase over full VDD/temp), 4 KB RAM, 2 KB EEPROM with 4-/8-byte erase sectors |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time; includes temperature sensor and internal bandgap reference |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames, 5-RX FIFO buffers, programmable acceptance filters |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; configurable slew rate, drive strength, pull devices, and hysteresis |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and real-time interrupt wake-up from all modes |
| Debug Interface | Single-wire background debug (BDM) with on-chip in-circuit emulation (ICE) and real-time bus capture |
Pinout & Package
MC9S08DZ60ACLC is housed in a 64-pin LQFP package (10 × 10 mm, 0.5 mm pitch), with dedicated pins for CANH/CANL, VREFH/VREFL, BKGD/MS, RESET, and multiple port groups (Ports A–G) supporting peripheral multiplexing and interrupt-capable inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BKGD/MS | Background Debug / Mode Select | Single-wire BDM interface pin; controls entry into active background mode during debug or reset sequence |
| RESET | Active-low Reset Input | Asynchronous reset assertion; triggers power-on reset, COP timeout, or external reset event |
| CANH, CANL | CAN Bus Differential Pair | Direct connection to ISO 11898-compliant transceiver; supports dominant/recessive bit encoding and fault-tolerant signaling |
| VREFH, VREFL | ADC Reference Voltage Inputs | Define 0 V to VREFH conversion range; support external precision reference or internal bandgap (1.2 V) |
| XTAL, EXTAL | Crystal Oscillator Inputs | Support 1–16 MHz crystal or ceramic resonator; feed MCG for high-accuracy system clock generation |
| PORTA[7:0] | General-Purpose I/O Group | Configurable as digital I/O, ADC inputs, SCI/SPI/IIC signals, or TPM channels; each pin supports edge-sensitive interrupts |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0 Controller | Enables direct connection to automotive CAN networks without external protocol IC; supports remote frames and flexible identifier filtering |
| On-Chip Real-Time Counter (RTC) | Provides calendar/time-of-day functions using external 32.768 kHz crystal or internal 1 kHz oscillator - eliminating need for external RTC IC |
| Program/Erase While Execute (PEWE) | Allows Flash reprogramming during runtime - critical for firmware updates and data logging in field-deployed systems |
| Temperature Sensor with ADC | Delivers calibrated die temperature readings via dedicated ADC channel - used for thermal monitoring and compensation in motor control or battery management |
| Factory-Trimmed Internal Reference Clock | Reduces BOM cost by enabling accurate clock generation without external crystal in non-CAN or low-jitter applications |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU managing LIN slave interfaces, PWM-driven motor drivers, and CAN gateway functions between body domain and main bus. Use Value: Integrated MSCAN and 24-channel ADC enable direct sensor feedback (position, current, temperature) and actuator control without external signal conditioning. | Use Scenario: Closed-loop speed/torque regulation of BLDC or stepper motors in HVAC blowers, conveyor drives, and pump controllers. IC Role / Device Role / Timing Role: Real-time execution of commutation logic and current sensing via ADC-triggered TPM PWM outputs with sub-microsecond jitter. Use Value: On-chip 12-bit ADC with automatic compare and 6-channel TPM allows precise phase current sampling and synchronized gate drive timing. |
| Smart Lighting Node | Building Automation Sensor Hub |
Use Scenario: DALI or 0–10 V dimmable LED driver with occupancy, ambient light, and temperature sensing. IC Role / Device Role / Timing Role: System controller interfacing with analog sensors, driving constant-current LED drivers, and communicating via CAN or SCI to building management system. Use Value: 53 GPIOs support mixed-signal I/O expansion; RTC enables scheduled dimming profiles and energy usage logging without external timekeeping. | Use Scenario: Multi-sensor node aggregating CO₂, humidity, PIR, and ambient light data for HVAC optimization in commercial buildings. IC Role / Device Role / Timing Role: Low-power data concentrator with wake-on-event capability, local processing, and CAN-based backhaul to central controller. Use Value: Stop3 mode draws <1 µA while maintaining RTC and pin-interrupt wake-up - extending battery life beyond 5 years in wireless sensor deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ60F1MLC | Same core, memory, and peripherals; differs only in mask set revision and minor electrical spec updates per Rev. 4 DS | Identical functional coverage; validated for same automotive qualification tests (AEC-Q100 Grade 2) | Select when sourcing newer mask revision with updated PLL jitter spec and MCG trim calibration |
| MC9S08DZ48ACLC | 48 KB Flash (vs. 60 KB), otherwise identical peripheral set, pinout, and package | Reduced firmware footprint requirement; suitable where application code size fits within 48 KB and no future expansion needed | Choose for cost-sensitive designs with stable feature set and no anticipated firmware growth |
Compared with S9S08DZ60F1MLC and MC9S08DZ48ACLC, the MC9S08DZ60ACLC provides maximum Flash headroom for complex CAN messaging stacks and OTA update partitions, while retaining full pin and code compatibility across the DZ60 family.
Availability
MC9S08DZ60ACLC is available at Aetrix Electronics and suitable for automotive body control units, industrial motor drives, smart lighting systems, and building automation nodes requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08DZ60ACLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating to the Motorola 68HC05 era.
The MC9S08DZ60ACLC belongs to the HCS08 DZ-series - engineered specifically for cost-sensitive, CAN-enabled automotive body electronics where integration, reliability, and AEC-Q100 compliance are mandatory.
FAQ
What is the operating temperature range for the MC9S08DZ60ACLC?
The MC9S08DZ60ACLC is rated for operation from –40°C to +105°C, meeting AEC-Q100 Grade 2 requirements for automotive under-hood and body electronics applications. This extended range ensures reliable performance in engine bay modules, door control units, and HVAC systems exposed to wide thermal cycling.
Does the MC9S08DZ60ACLC support CAN FD?
No, the MC9S08DZ60ACLC implements the legacy MSCAN module compliant only with ISO 11898-1 CAN 2.0A/B (up to 1 Mbps). It does not support CAN FD features such as flexible data-rate, larger payloads, or CRC enhancements. For CAN FD, consider NXP's S32K1xx series.
How many CAN message buffers does the MC9S08DZ60ACLC provide?
The MC9S08DZ60ACLC includes five receive buffers organized in FIFO structure within its MSCAN module, plus one dedicated transmit buffer. This configuration supports concurrent reception of multiple priority messages without software polling overhead - essential for real-time automotive network handling.
Can the MC9S08DZ60ACLC perform ADC conversions while in Stop mode?
Yes, the MC9S08DZ60ACLC supports ADC conversions in Stop3 mode using the internal 1 kHz low-power oscillator as the ADC clock source. This enables periodic sensor sampling (e.g., cabin temperature or battery voltage) with total system current below 1 µA - critical for always-on automotive modules.
Is the MC9S08DZ60ACLC pin-compatible with other DZ-series MCUs?
Yes, the MC9S08DZ60ACLC in the 64-pin LQFP package is pin-compatible with MC9S08DZ48ACLC, MC9S08DZ32ACLC, and MC9S08DZ16ACLC - sharing identical pin assignments, peripheral mappings, and electrical characteristics. This enables scalable design reuse across memory variants.
MC9S08DZ60ACLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ60ACLC FAQ
1.How can I place an order for MC9S08DZ60ACLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ60ACLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ60ACLC reliable?
The price and inventory of MC9S08DZ60ACLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ60ACLC is usually 5 days.
3.What payment methods are accepted for MC9S08DZ60ACLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ60ACLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DZ60ACLC?
MC9S08DZ60ACLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ60ACLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ60ACLC?
For technical support, including MC9S08DZ60ACLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ60ACLC requirements.
6.How does Aetrix verify that MC9S08DZ60ACLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ60ACLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ60ACLC meets industry standards.
7.What is the process for return or replacement of MC9S08DZ60ACLC?
All MC9S08DZ60ACLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ60ACLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ60ACLC part is unused and in its original packaging.
Return procedure for MC9S08DZ60ACLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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