My Inquiry
My Account
NXP Semiconductors MC9S08DZ60AMLC
- Part No.:
- MC9S08DZ60AMLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
MC9S08DZ60AMLC.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,315
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08DZ60AMLC from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB in-circuit programmable EEPROM. It integrates MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0/SAE J2602 support, 24-channel 12-bit ADC, two analog comparators, RTC, and dual TPM modules. Designed for automotive body electronics and industrial control systems requiring CAN connectivity and robust real-time I/O.
For engineers reviewing the MC9S08DZ60AMLC datasheet, MC9S08DZ60AMLC pinout, MC9S08DZ60AMLC application, or MC9S08DZ60AMLC equivalent, this page delivers verified technical context, validated package mapping, confirmed peripheral capabilities, and real-world design implications - all grounded in Rev. 4 (June 2008) official documentation and mechanical drawings.
Technical Context
The MC9S08DZ60AMLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND instruction for single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.
On-chip peripherals include a 24-channel 12-bit ADC with 2.5 μs conversion time and integrated temperature sensor, dual SCIs with master/slave extended break handling, and MSCAN with five receive buffers, FIFO storage, and flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit). All I/O pins feature configurable slew rate, drive strength, hysteresis, and pull devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz operation (20-MHz bus); enables deterministic real-time control in resource-constrained automotive ECUs. |
| Memory | 60 KB Flash (read/program/erase over full voltage/temp range), 4 KB RAM, 2 KB EEPROM with 4-byte dual-page erase; supports firmware updates and data logging without external memory. |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames, remote frames, and programmable acceptance filters - essential for vehicle network integration. |
| ADC | 24-channel, 12-bit resolution, 2.5 μs conversion time, internal bandgap reference and temperature sensor; suitable for precision sensor monitoring in engine control or climate systems. |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and 1-kHz RTC wake-up; enables battery-powered operation with sub-μA quiescent current in deep sleep. |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all support configurable pull, hysteresis, slew rate, and edge-sensitive interrupts - ideal for mixed-signal automotive wiring harness interfaces. |
| Clock Sources | Crystal/ceramic resonator support (31.25 kHz–16 MHz), internal trimmed reference clock, and MCG with FLL/PLL; eliminates need for external oscillator in cost-sensitive designs. |
Pinout & Package
MC9S08DZ60AMLC is housed in a 64-pin LQFP package (10×10 mm, 0.5 mm pitch), with pin assignments defined in Chapter 2 of the Rev. 4 datasheet. Pin functions include VDD/VSS power rails, XOSC/EXTAL/XTAL oscillator connections, BKGD/MS debug interface, VREFH/VREFL for ADC reference, and dedicated CANH/CANL differential pair.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains (digital/analog) with decoupling requirements per Section 2.2.1; critical for noise immunity in automotive EMI environments. |
| XTAL, EXTAL | Crytal/resonator connection | Supports 1–16 MHz crystals for main system clock; enables precise timing for CAN bit rate generation and synchronous serial communication. |
| BKGD/MS | Single-wire background debug | Enables in-circuit debugging and programming via single pin; eliminates need for JTAG header space and reduces BOM count. |
| CANH, CANL | CAN differential bus interface | Direct connection to ISO 11898-compliant transceiver; requires external termination resistor and common-mode choke per automotive EMC standards. |
| VREFH, VREFL | ADC reference voltage inputs | Accept external precision reference or internal bandgap; determines full-scale ADC range and measurement accuracy for sensor signal conditioning. |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | Configurable as digital input/output, analog input, or peripheral function (SCI, SPI, TPM); mapped to specific peripheral registers per Port A–G chapters. |
Key Features
| Feature | Design Value |
|---|---|
| MSCAN with FIFO and filter flexibility | Five receive buffers with FIFO storage and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit) reduce CPU overhead during high-traffic CAN bus operation. |
| Dual SCI with LIN 2.0 support | Full-duplex NRZ SCI with master/slave extended break generation/detection enables compliance with LIN 2.0 and SAE J2602 for body control networks. |
| Real-time counter with 1-kHz oscillator | Free-running 8-bit RTC powered by on-chip 1-kHz low-power oscillator allows cyclic wake-up from Stop modes without external crystal or components. |
| Flash security and block protection | Programmable flash block protect and illegal opcode/address detection prevent unauthorized code access and runtime execution errors in safety-critical applications. |
| On-chip emulation with bus capture | In-circuit ICE with real-time bus capture supports non-intrusive debugging of timing-critical sequences and peripheral interactions during development. |
Applications
| Automotive Door Module | Industrial CAN Gateway |
|---|---|
|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU managing LIN slave nodes, driving relays/LEDs, processing switch inputs, and communicating via CAN to body control module. Use Value: Integrated MSCAN, dual SCI (for LIN), and 24-channel ADC enable direct sensor/actuator interfacing without external logic, reducing PCB area and component count. |
Use Scenario: Protocol translation between Modbus RTU (RS-485) and CANopen networks in factory automation systems. IC Role / Device Role / Timing Role: Bridge controller executing protocol stack, buffering messages, and maintaining timing synchronization across heterogeneous fieldbuses. Use Value: Dual SCI with hardware break detection and MSCAN with FIFO reduce firmware latency in message forwarding, improving determinism in time-sensitive motion control loops. |
| Engine Coolant Temperature Monitor | Smart HVAC Control Unit |
|
Use Scenario: High-accuracy temperature sensing and fault reporting for engine thermal management systems. IC Role / Device Role / Timing Role: Sensor interface MCU acquiring thermistor/RTD readings via 12-bit ADC, applying calibration, and transmitting over CAN. Use Value: On-chip temperature sensor and internal bandgap reference eliminate need for external precision references, lowering BOM cost while maintaining ±1°C measurement accuracy. |
Use Scenario: Zone-based climate control in commercial buildings with occupancy sensing and damper actuation. IC Role / Device Role / Timing Role: Local controller managing PWM fan speeds, relay-driven valves, and CO₂ sensor interfaces while coordinating with central BACnet controller via CAN. Use Value: 53 GPIOs with configurable drive strength support direct connection to diverse actuators (24 V relays, 0–10 V analog outputs), avoiding level-shifting ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ60F1MLC | Same die, but factory-programmed with enhanced flash security and updated COP watchdog behavior per later mask sets; pinout and memory map identical. | Required for new designs targeting long-term lifecycle continuity and updated Freescale/NXP security compliance requirements. | Select S9S08DZ60F1MLC when new production requires documented security enhancements and compatibility with post-2008 toolchains. |
| MC9S08DZ48AMLC | Identical package, pinout, and peripheral set, but with 48 KB Flash and same 4 KB RAM/2 KB EEPROM; shares same Rev. 4 datasheet scope. | Suitable where firmware size is constrained to ≤48 KB and no future expansion is anticipated - reduces cost without sacrificing I/O or CAN capability. | Choose MC9S08DZ48AMLC for cost-optimized variants of existing MC9S08DZ60AMLC-based designs with stable firmware footprint. |
Compared with MC9S08DZ60AMLC, S9S08DZ60F1MLC offers strengthened flash security and updated watchdog behavior for newer compliance needs, while MC9S08DZ48AMLC delivers identical functionality at lower memory capacity - enabling tiered product variants without layout or driver changes.
Availability
MC9S08DZ60AMLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, and smart HVAC control systems requiring stable component supply, long-lifecycle support, and legacy design continuity.
Supply support for MC9S08DZ60AMLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and automotive-grade silicon.
The MC9S08DZ60AMLC belongs to the HCS08 DZ-series, designed specifically for cost-sensitive automotive body electronics and industrial control applications demanding CAN 2.0, LIN, and robust analog integration in a single chip.
FAQ
What is the maximum operating frequency of the MC9S08DZ60AMLC CPU core?
The MC9S08DZ60AMLC features an HCS08 CPU core capable of 40-MHz operation, with a corresponding 20-MHz bus clock. This frequency is achievable using the on-chip Multi-Purpose Clock Generator (MCG) in PLL mode with an external crystal or resonator in the 1–16 MHz range. The core maintains full instruction compatibility with the HC08 architecture while adding the BGND instruction for debug support.
Does the MC9S08DZ60AMLC support CAN FD or only classical CAN?
The MC9S08DZ60AMLC supports only classical CAN per ISO 11898-1 (CAN 2.0A/B), not CAN FD. Its MSCAN module implements standard and extended data frames, remote frames, and five receive buffers with FIFO storage, but lacks the variable bit-rate arbitration and payload length extensions defined in CAN FD. For CAN FD applications, a newer S32K or MPC57xx series device is required.
How much EEPROM does the MC9S08DZ60AMLC include, and what are its erase characteristics?
The MC9S08DZ60AMLC includes 2 KB of in-circuit programmable EEPROM with 4-byte dual-page or 8-byte single-page erase sectors. Erase operations can be aborted, and both program and erase functions operate while executing Flash code. This enables reliable data logging and parameter storage in automotive applications where power interruption must not corrupt persistent settings.
What debug interface does the MC9S08DZ60AMLC use, and is JTAG supported?
The MC9S08DZ60AMLC uses a single-wire background debug (BKGD) interface for programming and in-circuit emulation - not JTAG. The BKGD/MS pin serves as the sole debug port, supporting breakpoint insertion, register inspection, and Flash programming via compatible tools like P&E Multilink or Cyclone Pro. JTAG is not implemented on this device; all debug functionality is consolidated into the BKGD pin.
Is the MC9S08DZ60AMLC qualified for automotive applications, and what temperature grade does it support?
Yes, the MC9S08DZ60AMLC is AEC-Q100 qualified for automotive applications and specified for operation across the –40°C to +125°C ambient temperature range. Its electrical characteristics, including Flash endurance, ADC accuracy, and CAN timing margins, are validated across this full grade. The "A" suffix in the part number denotes the automotive temperature grade, distinguishing it from industrial variants.
MC9S08DZ60AMLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ60AMLC FAQ
1.How can I place an order for MC9S08DZ60AMLC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ60AMLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ60AMLC reliable?
The price and inventory of MC9S08DZ60AMLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ60AMLC is usually 5 days.
3.What payment methods are accepted for MC9S08DZ60AMLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ60AMLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DZ60AMLC?
MC9S08DZ60AMLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ60AMLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ60AMLC?
For technical support, including MC9S08DZ60AMLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ60AMLC requirements.
6.How does Aetrix verify that MC9S08DZ60AMLC is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ60AMLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ60AMLC meets industry standards.
7.What is the process for return or replacement of MC9S08DZ60AMLC?
All MC9S08DZ60AMLC units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ60AMLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ60AMLC part is unused and in its original packaging.
Return procedure for MC9S08DZ60AMLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08DZ60AMLC Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
