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NXP Semiconductors MC9S08DZ60AMLF
- Part No.:
- MC9S08DZ60AMLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MC9S08DZ60AMLF.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,385
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Product details
Overview
MC9S08DZ60AMLF from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB in-circuit programmable EEPROM. It integrates MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0/SAE J2602 support, 24-channel 12-bit ADC, two analog comparators, RTC, and six-channel TPM - designed for automotive body electronics and industrial control nodes requiring CAN connectivity and robust real-time I/O.
For engineers reviewing the MC9S08DZ60AMLF datasheet, MC9S08DZ60AMLF pinout, MC9S08DZ60AMLF application, or MC9S08DZ60AMLF equivalent, key selection criteria include CAN protocol compliance, Flash memory size, integrated temperature sensor, single-wire background debug interface, and 53 GPIO with configurable slew rate and pull devices.
Technical Context
The MC9S08DZ60AMLF implements the HCS08 CPU core operating at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and HC08 instruction set with BGND. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and external crystal support from 31.25 kHz to 16 MHz.
System protection includes COP watchdog with dual-clock source (1 kHz internal or bus clock), low-voltage detect with reset/interrupt, illegal opcode/address detection, and Flash block protection. Peripherals operate across run, wait, and stop modes - including RTC wake-up via 1 kHz on-chip oscillator and MSCAN with five receive buffers and flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz operation (20-MHz bus frequency) |
| Flash Memory | 60 KB on-chip Flash with program/erase during execution and block protection |
| RAM / EEPROM | 4 KB RAM; 2 KB EEPROM with 4-byte dual-page or 8-byte single-page erase sectors |
| ADC | 24-channel, 12-bit resolution, 2.5 μs conversion time, internal bandgap reference, and temperature sensor channel |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supporting standard/extended frames and remote frames |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all with hysteresis, configurable pull, slew rate, and drive strength |
| Debug Interface | Single-wire background debug (BDM) with on-chip in-circuit emulation and real-time bus capture |
Pinout & Package
MC9S08DZ60AMLF is housed in a 64-pin LQFP package (10 × 10 mm, 0.5 mm pitch), with dedicated pins for VDD/VSS, XOSC, RESET, BKGD/MS, VREFH/VREFL, CANH/CANL, SCI0/SCI1, SPI, I²C, TPM, ADC, and 53 GPIO distributed across Ports A–G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD) and analog (VDDAD/VSSAD) with separate pins for noise isolation |
| XOSC, EXTAL, XTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; enables precise timing for CAN, RTC, and communication peripherals |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface for programming and debugging; also selects boot mode on reset |
| CANH, CANL | CAN differential bus interface | Direct connection to external CAN transceiver; supports high-speed (up to 1 Mbps) and fault-tolerant physical layer |
| VREFH, VREFL | ADC reference voltage inputs | Enable external precision reference or internal bandgap (1.2 V); critical for accurate 12-bit ADC measurements |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 GPIO mapped across Ports A–G; each pin supports interrupt-on-change, configurable pull, and slew control |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN controller | Fully compliant CAN 2.0A/B implementation with five FIFO-based receive buffers and programmable acceptance filters |
| Dual LIN-capable SCI modules | SCI0 and SCI1 support LIN 2.0 and SAE J2602 protocols with master break generation and slave break detection |
| Real-time counter with wake-up capability | RTC uses external 32.768 kHz crystal or internal 1 kHz oscillator to enable cyclic wake-up from Stop3 mode without external components |
| On-chip temperature sensor | Integrated sensor connected to ADC channel for system thermal monitoring without external components |
| Flash security and protection | Block-level Flash protection and security byte prevent unauthorized read/write access to firmware and configuration data |
Applications
| Automotive Body Control Module | Industrial CAN Node Controller |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in passenger vehicles using CAN bus communication. IC Role / Device Role / Timing Role: Primary MCU executing body control logic, managing CAN message routing, and interfacing with analog sensors and discrete actuators. Use Value: Integrated MSCAN eliminates need for external CAN controller; 60 KB Flash accommodates complex state machines and diagnostics; single-wire BDM simplifies production programming. | Use Scenario: Distributed I/O node in factory automation systems collecting sensor data and controlling valves/motors over CANopen network. IC Role / Device Role / Timing Role: Edge-node controller performing local decision-making, analog signal acquisition (via 24-channel ADC), and deterministic CAN messaging. Use Value: 12-bit ADC with temperature sensor enables direct thermal compensation; RTC supports scheduled maintenance alerts; 53 GPIO allow flexible peripheral expansion. |
| Smart Power Distribution Unit | Off-Road Vehicle Telematics Gateway |
Use Scenario: Fuseless power management unit monitoring load currents, battery voltage, and temperature while communicating status via CAN. IC Role / Device Role / Timing Role: System monitor and protector with real-time current sensing (using ADC), low-voltage detection, and fail-safe shutdown sequencing. Use Value: On-chip LVD with selectable trip points enables adaptive brown-out response; EEPROM stores calibration and event logs; Stop3 mode extends battery life during sleep. | Use Scenario: Ruggedized telematics gateway aggregating GPS, IMU, and engine CAN data for satellite transmission in agricultural or construction equipment. IC Role / Device Role / Timing Role: Protocol bridge between high-speed engine CAN and lower-speed chassis CAN, plus serial interfaces for GPS/IMU modules. Use Value: Dual SCI with LIN support enables GPS NMEA parsing; MSCAN's flexible filter setup isolates critical engine messages; 4 KB RAM buffers multi-frame CAN payloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ60F1MLF | Same die, identical Flash/RAM/peripherals; differs only in factory-programmed trim values and qualification grade (automotive AEC-Q100 Grade 2 vs. commercial) | Qualified for under-hood automotive use (-40°C to +105°C); includes extended temperature validation and enhanced ESD/EMC testing | Select S9S08DZ60F1MLF for automotive production; MC9S08DZ60AMLF remains suitable for industrial prototypes and non-automotive CAN nodes. |
| MKE02Z64VLD4 | Kinetis E-series ARM Cortex-M0+ MCU with 64 KB Flash, 8 KB RAM, and CAN 2.0B; lacks integrated temperature sensor and LIN-capable SCI but adds USB and higher clock speed (40 MHz core) | Targets next-generation designs requiring ARM ecosystem compatibility, larger memory, and mixed-signal integration beyond legacy HCS08 capabilities | Choose MKE02Z64VLD4 for new designs needing ARM toolchain support and future scalability; retain MC9S08DZ60AMLF for cost-sensitive, CAN-centric legacy replacements. |
Compared with S9S08DZ60F1MLF, MC9S08DZ60AMLF offers identical functionality at commercial temperature grade, reducing BOM cost where AEC-Q100 is not mandated. Against MKE02Z64VLD4, MC9S08DZ60AMLF delivers proven CAN+LIN+ADC integration in a mature, low-power 8-bit architecture ideal for stable, long-lifecycle industrial deployments.
Availability
MC9S08DZ60AMLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, smart power distribution units, and off-road telematics gateways requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08DZ60AMLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.
The MC9S08DZ60AMLF belongs to the HCS08 DZ family - engineered specifically for cost-sensitive, CAN-enabled automotive body control and industrial automation applications requiring high peripheral integration and robust flash memory reliability.
FAQ
What is the maximum operating frequency of the MC9S08DZ60AMLF CPU core?
The MC9S08DZ60AMLF features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus frequency. This performance level supports real-time CAN message handling, ADC sampling at 2.5 μs per conversion, and deterministic execution of automotive body control algorithms without external acceleration.
Does the MC9S08DZ60AMLF support CAN FD or only classical CAN?
The MC9S08DZ60AMLF implements the MSCAN module compliant exclusively with ISO 11898-1 CAN 2.0A/B (classical CAN), supporting standard and extended identifiers, remote frames, and bit rates up to 1 Mbps. It does not support CAN FD features such as flexible data-rate or extended payload length.
How much EEPROM is available on the MC9S08DZ60AMLF and what are its erase characteristics?
The MC9S08DZ60AMLF includes 2 KB of in-circuit programmable EEPROM with sector erase granularity: 8-byte single-page or 4-byte dual-page erase. Erase operations can be aborted, and both program and erase functions operate while Flash code executes - enabling reliable data logging and parameter storage in live systems.
What debug interface does the MC9S08DZ60AMLF provide and is external hardware required?
The MC9S08DZ60AMLF features a single-wire background debug (BDM) interface integrated into the BKGD/MS pin, requiring only a compatible BDM pod (e.g., PE Micro Cyclone or SEGGER J-Link with BDM firmware). No external debug controller IC is needed, enabling low-cost programming and real-time emulation during development and field updates.
Is the MC9S08DZ60AMLF pin-compatible with other members of the DZ series such as MC9S08DZ48AMLF?
Yes - the MC9S08DZ60AMLF in the 64-pin LQFP package shares identical pinout, electrical characteristics, and peripheral mapping with MC9S08DZ48AMLF, MC9S08DZ32AMLF, and MC9S08DZ16AMLF. Firmware and PCB layouts are interchangeable across these variants, differing only in Flash size (60 KB vs. 48 KB vs. 32 KB vs. 16 KB) and EEPROM/RAM allocation.
MC9S08DZ60AMLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ60AMLF FAQ
1.How can I place an order for MC9S08DZ60AMLF through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ60AMLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ60AMLF reliable?
The price and inventory of MC9S08DZ60AMLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ60AMLF is usually 5 days.
3.What payment methods are accepted for MC9S08DZ60AMLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ60AMLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08DZ60AMLF?
MC9S08DZ60AMLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ60AMLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ60AMLF?
For technical support, including MC9S08DZ60AMLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ60AMLF requirements.
6.How does Aetrix verify that MC9S08DZ60AMLF is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ60AMLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ60AMLF meets industry standards.
7.What is the process for return or replacement of MC9S08DZ60AMLF?
All MC9S08DZ60AMLF units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ60AMLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ60AMLF part is unused and in its original packaging.
Return procedure for MC9S08DZ60AMLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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