NXP Semiconductors MC9S08DZ96CLH
- Part No.:
- MC9S08DZ96CLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DZ96CLH.pdf
- Description:
- IC MCU 8BIT 96KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08DZ96CLH from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 96 KB on-chip FLASH, 6 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC. It operates at up to 40 MHz CPU / 20 MHz bus frequency and supports multiple low-power modes including Stop2 and Stop3. It targets automotive body electronics and industrial control systems requiring robust communication and real-time analog processing.
For engineers reviewing the MC9S08DZ96CLH datasheet, MC9S08DZ96CLH pinout, MC9S08DZ96CLH application, or MC9S08DZ96CLH equivalent, key selection considerations include its 64-pin LQFP package, 12-bit 24-channel ADC with temperature sensor, dual SCI supporting LIN 2.0/SAE J2602, and MSCAN module with five receive buffers and programmable identifier filters.
Technical Context
The MC9S08DZ96CLH implements the HCS08 CPU core with HC08 instruction set extension and BGND debug instruction. Its Multi-Purpose Clock Generator (MCG) supports FEI, FEE, FBE, PEE, and BLPE modes with internal FLL and PLL, enabling flexible clock sourcing from 31.25 kHz crystals up to 16 MHz external oscillators.
Peripherals include a 24-channel 12-bit ADC with 2.5 µs conversion time and internal bandgap reference (1.18–1.21 V), two analog comparators with stop-mode operation, and three Timer Pulse-Width Modulators (TPM1: 6-channel, TPM2: 2-channel, TPM3: 4-channel) supporting edge- and center-aligned PWM with coherency mechanisms for modulo and channel registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40 MHz max CPU frequency, 20 MHz bus clock - enables deterministic real-time control in resource-constrained embedded systems. |
| Memory | 96 KB FLASH (in-circuit programmable), 6 KB RAM, 2 KB EEPROM - supports firmware updates, data logging, and parameter storage without external memory. |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal temperature sensor and bandgap reference - delivers high-accuracy analog sensing for motor control and environmental monitoring. |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), 5 receive buffers with FIFO, programmable acceptance filters - provides robust, fault-tolerant vehicle network communication. |
| Low-Power Modes | Stop2 and Stop3 modes with RTC wake-up from 1 kHz internal oscillator - enables battery-powered operation with sub-µA current draw and precise time-based event scheduling. |
| Communication | Dual SCI (LIN 2.0/J2602 compatible), dual SPI, dual I²C (100 kbps), and background debug interface - supports multi-protocol connectivity and in-system debugging without dedicated JTAG pins. |
| Package & Pin Count | 64-pin LQFP (10 × 10 mm), 57 general-purpose I/O pins with configurable slew rate, drive strength, pull devices, and interrupt capability - simplifies PCB layout for compact automotive modules. |
Pinout & Package
MC9S08DZ96CLH is housed in a 64-pin low-profile quad flat-pack (LQFP) package measuring 10 mm × 10 mm with 0.5 mm pitch. Pin assignments are defined per Table 2-1 of the MC9S08DZ128 Series Data Sheet Rev. 1 (Page 34), where pins 1–64 correspond to functional signals including VDD, VSS, RESET, BKGD/MS, XTAL/EXTAL, and multiplexed peripheral I/O (e.g., PTJ2/TPM3CH2, PTJ3/TPM3CH3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pins 1, 12, 23, 34, 45, 56) | Primary power supply | Accepts 2.7–5.5 V; six distributed pins reduce IR drop and improve noise immunity in automotive environments. |
| VSS (Pins 2, 13, 24, 35, 46, 57) | Ground reference | Multiple ground connections minimize ground bounce and ensure stable analog/digital reference separation. |
| RESET (Pin 3) | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervisor ICs or manual reset buttons. |
| BKGD/MS (Pin 4) | Single-wire background debug | Enables in-circuit debugging and programming via proprietary BDM protocol using one pin only. |
| XTAL (Pin 11), EXTAL (Pin 10) | Clock oscillator inputs | Supports crystal/resonator (31.25 kHz–16 MHz) or square-wave external clock; MCG configures FLL/PLL based on RANGE/HGO bits. |
| PTJ2 (Pin 58), PTJ3 (Pin 59) | TPM3 channel outputs | Configurable as PWM outputs (TPM3CH2/TPM3CH3); coherency mechanism ensures atomic modulo/channel register updates. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN controller | Full CAN 2.0A/B compliance with five receive buffers, FIFO handling, and programmable 8/16/32-bit identifier filters - eliminates need for external CAN transceivers in basic node designs. |
| Real-time counter (RTC) with 1 kHz oscillator | Free-running low-power RTC operates in Stop2/Stop3 modes using on-chip 1 kHz oscillator - enables wake-up events without external timing components. |
| ADC with internal temperature sensor | 24-channel 12-bit ADC includes dedicated temperature sensor channel and internal 1.18–1.21 V bandgap reference - allows self-calibration and thermal monitoring without external sensors. |
| Multi-purpose Clock Generator (MCG) | Supports FEI/FEE/FBE/PEE/BLPE modes with nonvolatile trim (0.2% resolution, 1.5% temp tolerance) - ensures accurate clocking across voltage/temperature without external trimming components. |
| Single-wire background debug (BDM) | On-chip BDM module enables full-speed debugging, flash programming, and real-time bus capture using one pin - reduces debug footprint and cost in production modules. |
Applications
| Automotive Body Control Module (BCM) | Industrial Motor Drive Interface |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main system MCU managing CAN messaging, analog sensor inputs (potentiometers, thermistors), and PWM-driven motor drivers. Use Value: Integrated MSCAN and 24-channel ADC eliminate discrete interface ICs; Stop3 mode enables <1 µA sleep current for always-on monitoring. |
Use Scenario: Closed-loop speed/torque control of brushed DC or stepper motors in factory automation equipment. IC Role / Device Role / Timing Role: Real-time controller executing PID algorithms, generating complementary PWM outputs, and sampling current/voltage feedback. Use Value: TPM modules support synchronized edge-aligned PWM with dead-time insertion; 2.5 µs ADC conversion enables fast current loop sampling at >100 kHz rates. |
| Smart HVAC Actuator Node | LIN-Based Automotive Sensor Cluster |
Use Scenario: Position-controlled damper actuation in commercial HVAC systems using potentiometer feedback and bidirectional DC motor. IC Role / Device Role / Timing Role: Dedicated actuator MCU handling position sensing, motor commutation, thermal protection, and RS-485 master communication. Use Value: Dual SCI supports LIN slave + RS-485 master simultaneously; internal temperature sensor enables overheat shutdown without external ICs. |
Use Scenario: Multi-sensor node (ambient temp, humidity, pressure) communicating via LIN bus to vehicle gateway. IC Role / Device Role / Timing Role: LIN 2.0-compliant slave node with automatic break detection, checksum validation, and scheduled message transmission. Use Value: SCI hardware fully implements LIN 2.0 physical and data link layers; EEPROM stores calibration coefficients and node address persistently. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ128CLH | 128 KB FLASH, 8 KB RAM, same peripheral set and pin-compatible 64-pin LQFP package - differs only in memory size and part marking. | Preferred when firmware image exceeds 96 KB or future-proofing for feature expansion is required. | Select MC9S08DZ128CLH if code growth headroom or EEPROM retention under extended temperature cycling is critical. |
| S9S08DZ60F2MLH | NXP rebranded successor with identical architecture, 60 KB FLASH, 4 KB RAM, and updated qualification (AEC-Q100 Grade 2); pinout matches but memory map differs. | Targeted at cost-sensitive, lower-feature automotive applications where CAN and LIN are optional rather than mandatory. | Choose S9S08DZ60F2MLH for new designs requiring current NXP support and AEC-Q100 certification, accepting reduced memory capacity. |
Compared with MC9S08DZ96CLH, MC9S08DZ128CLH offers direct memory scalability within identical hardware, while S9S08DZ60F2MLH trades memory and legacy feature support for modern qualification and long-term supply assurance - both require firmware re-linking but no PCB change.
Availability
MC9S08DZ96CLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, smart HVAC actuators, and LIN-based sensor clusters requiring stable component supply across extended temperature ranges (–40°C to +105°C) and long product lifecycles.
Supply support for MC9S08DZ96CLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.
The MC9S08DZ96CLH belongs to the HCS08 DZ-series, designed specifically for cost-sensitive, safety-aware automotive body electronics requiring integrated CAN, LIN, and robust analog peripherals in compact packages.
FAQ
What is the maximum operating temperature range for the MC9S08DZ96CLH?
The MC9S08DZ96CLH is rated for operation from –40°C to +105°C ambient temperature, meeting automotive Grade 2 requirements. This specification is confirmed in Appendix A (Electrical Characteristics) of the MC9S08DZ128 Series Data Sheet Rev. 1, where all DC and AC parameters are characterized across this full range. The device uses silicon process and packaging qualified for under-hood automotive environments.
Does the MC9S08DZ96CLH support in-circuit programming via its background debug interface?
Yes, the MC9S08DZ96CLH supports full in-circuit programming and debugging through its single-wire background debug (BDM) interface. This interface enables flash erase/program, RAM access, breakpoint setting, and real-time bus capture without halting CPU execution. The BKGD/MS pin (Pin 4) serves as the dedicated BDM signal line, requiring only a compatible BDM pod or debugger such as the NXP DEMO9S08DZ60.
How many CAN message buffers does the MSCAN module in the MC9S08DZ96CLH provide?
The MSCAN module in the MC9S08DZ96CLH provides five dedicated receive buffers with FIFO storage capability. These buffers support flexible identifier acceptance filtering configured as either two 32-bit, four 16-bit, or eight 8-bit masks. Transmit functionality uses a single transmit buffer. This architecture is documented in Chapter 12 of the MC9S08DZ128 Series Data Sheet Rev. 1 and enables reliable reception of prioritized CAN traffic in automotive networks.
Can the MC9S08DZ96CLH operate from a 3.3 V supply instead of 5 V?
Yes, the MC9S08DZ96CLH operates over a supply voltage range of 2.7 V to 5.5 V, making it compatible with both 3.3 V and 5 V systems. All I/O pins are 5 V tolerant regardless of VDD level, and internal regulators maintain consistent performance across this range. Electrical characteristics including ADC accuracy, clock stability, and CAN transceiver biasing remain valid at 3.3 V, as verified in Table A-6 (DC Characteristics) of the datasheet.
Is the MC9S08DZ96CLH pin-compatible with other members of the MC9S08DZ128 series?
Yes, the MC9S08DZ96CLH is pin-compatible with the MC9S08DZ128CLH in the 64-pin LQFP package. Both share identical pin assignments, electrical characteristics, and peripheral mapping per Table 2-1 (Page 34) and Section 2.1 of the MC9S08DZ128 Series Data Sheet Rev. 1. Differences are limited to on-die memory size (96 KB vs. 128 KB FLASH) and associated fuse settings - allowing shared PCB design and firmware portability with only linker script adjustments.
MC9S08DZ96CLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ96CLH FAQ
1.How can I place an order for MC9S08DZ96CLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ96CLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ96CLH reliable?
The price and inventory of MC9S08DZ96CLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ96CLH is usually 5 days.
3.What payment methods are accepted for MC9S08DZ96CLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08DZ96CLH transactions.
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4.How is shipping managed for MC9S08DZ96CLH?
MC9S08DZ96CLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ96CLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ96CLH?
For technical support, including MC9S08DZ96CLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ96CLH requirements.
6.How does Aetrix verify that MC9S08DZ96CLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ96CLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ96CLH meets industry standards.
7.What is the process for return or replacement of MC9S08DZ96CLH?
All MC9S08DZ96CLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ96CLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ96CLH part is unused and in its original packaging.
Return procedure for MC9S08DZ96CLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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