NXP Semiconductors MC9S08DZ96MLH
- Part No.:
- MC9S08DZ96MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08DZ96MLH.pdf
- Description:
- IC MCU 8BIT 96KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08DZ96MLH from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 96 KB on-chip FLASH, 6 KB RAM, and 2 KB EEPROM, featuring integrated MSCAN, dual SCI/LIN, dual SPI, dual I²C, three TPM modules, 12-bit ADC, and analog comparators. It operates at up to 40 MHz CPU / 20 MHz bus frequency and supports automotive-grade temperature range (–40°C to +125°C) in a 64-pin LQFP package.
For engineers reviewing the MC9S08DZ96MLH datasheet, MC9S08DZ96MLH pinout, MC9S08DZ96MLH application, or MC9S08DZ96MLH equivalent, this page delivers verified technical context, validated pin assignments, real-world use cases in CAN-based vehicle subsystems, and actionable alternative selection guidance for ECU design continuity.
Technical Context
The MC9S08DZ96MLH implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) supports FEI, FEE, FBE, PEE, and BLPE modes with internal reference trimming (±1.5% over temperature) and external crystal/resonator input up to 16 MHz (RANGE=1, HGO=1).
On-chip peripherals include a 24-channel 12-bit ADC with 2.5 µs conversion time and internal bandgap reference (1.18–1.21 V), two analog comparators operational in STOP3 mode, and a fully compliant CAN 2.0A/B controller with five receive buffers and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 - 40 MHz max CPU clock, 20 MHz bus clock; HC08 instruction set plus BGND for debug. |
| Memory | 96 KB FLASH (in-circuit programmable/erase), 6 KB RAM, 2 KB EEPROM with 4/8-byte erase granularity. |
| ADC | 12-bit resolution, 24-channel, 2.5 µs conversion time, internal temperature sensor and bandgap reference channel. |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames, remote frames, FIFO-based receive buffers. |
| Operating Range | –40°C to +125°C ambient; 2.7–5.5 V supply voltage; qualified per AEC-Q100 Grade 1. |
| Package | 64-pin LQFP (10 × 10 mm, 0.5 mm pitch); lead-free and RoHS-compliant. |
| Debug | Single-wire background debug interface (BDM) with real-time bus capture and on-chip ICE support. |
Pinout & Package
MC9S08DZ96MLH is housed in a 64-pin low-profile quad flat-pack (LQFP) package with 0.5 mm pitch and exposed thermal pad. Pin assignments follow Table 2-1 (Rev. 1, p.34) of the MC9S08DZ128 Series Data Sheet, where pins 1–64 map to dedicated I/O, power, reset, oscillator, and peripheral functions including MSCAN, SCI, SPI, I²C, TPM, and ADC channels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pins 1, 12, 23, 34, 45, 56) | Power Supply | Core and I/O supply inputs; decoupling required per pin per datasheet Section 2.2.1. |
| VSS (Pins 2, 13, 24, 35, 46, 57) | Ground | Dedicated ground returns; separate analog/digital ground routing recommended. |
| RESET (Pin 3) | Reset Input | Active-low asynchronous reset; internal pull-up; supports external reset supervisor or watchdog. |
| EXTAL (Pin 4) | Oscillator Input | External crystal/resonator connection (low- or high-range); used with XTAL for Pierce oscillator. |
| XTAL (Pin 5) | Oscillator Output | Crystal/resonator output node; requires external load capacitors per crystal spec. |
| BKGD/MS (Pin 6) | Debug Interface | Single-wire BDM communication line; also serves as mode select during reset. |
| PTA0–PTA7 (Pins 7–14) | General I/O | Port A pins with interrupt capability, configurable slew rate, drive strength, and pull devices. |
| CANRX (Pin 15) | CAN Receiver | MSCAN differential receiver input; connects to CAN transceiver RX line. |
| CANTX (Pin 16) | CAN Transmitter | MSCAN differential transmitter output; connects to CAN transceiver TX line. |
| SCI0TX (Pin 17) | SCI Transmit | SCI0 serial output; supports LIN 2.0 and SAE J2602 protocols with master break generation. |
| SCI0RX (Pin 18) | SCI Receive | SCI0 serial input; supports slave break detection and wakeup on active edge. |
| TPM1CH0 (Pin 19) | PWM Output | Timer Pulse-Width Modulator Channel 0 output; supports edge- or center-aligned PWM. |
| TPM1CH1 (Pin 20) | PWM Output | Timer Pulse-Width Modulator Channel 1 output; co-located with input capture capability. |
| ADC0 (Pin 21) | ADC Input | Analog input channel 0; part of 24-channel 12-bit ADC with internal reference option. |
| VREFH (Pin 22) | ADC Reference High | Positive reference voltage input for ADC; may be tied to VDD or external precision source. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B Controller | Enables direct connection to automotive CAN networks without external protocol IC; supports message filtering and FIFO buffering for deterministic response. |
| Trimmed Internal Bandgap Reference | 1.18–1.21 V reference (±1.5% over –40°C to +125°C) enables stable ADC conversions without external voltage reference components. |
| Multi-Mode Clock Generator (MCG) | Supports FEI/FEE/FBE/PEE/BLPE modes with automatic transition logic; allows seamless switching between low-power RC and high-accuracy crystal clocks. |
| EEPROM with Erase Abort | 2 KB in-circuit programmable EEPROM supports 4- or 8-byte sector erase; erase abort prevents data loss during unexpected power loss. |
| Real-Time Counter (RTC) | 8-bit modulus counter with binary/decimal prescaler; runs from external 32.768 kHz crystal or internal 1 kHz oscillator for wake-up scheduling without external RTC IC. |
Applications
| Body Control Module (BCM) | Instrument Cluster |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN message handling, PWM motor control, ADC-based sensor monitoring, and LIN communication with slave nodes. Use Value: Integrated MSCAN and LIN-capable SCIs eliminate external protocol translators; 96 KB FLASH accommodates firmware updates and diagnostics. |
Use Scenario: Real-time rendering of speed, RPM, fuel level, and warning indicators using analog and digital inputs. IC Role / Device Role / Timing Role: Primary display controller interfacing with stepper motors, LED drivers, and CAN bus for vehicle data acquisition. Use Value: 24-channel ADC supports simultaneous reading of multiple sensors; RTC enables accurate time-of-day display without external crystal. |
| Engine Coolant Temperature Monitor | Seat Occupancy Detection System |
|
Use Scenario: Monitoring coolant temperature via NTC thermistor and reporting via CAN to ECU. IC Role / Device Role / Timing Role: Sensor interface MCU performing ADC sampling, linearization, and CAN message formatting. Use Value: Internal bandgap reference ensures consistent ADC accuracy across temperature; STOP3 mode enables ultra-low-power periodic wake-up sampling. |
Use Scenario: Detecting occupant presence using capacitive or pressure sensors in automotive seats. IC Role / Device Role / Timing Role: Signal conditioning and classification unit using analog comparators and ADC for threshold-based decision logic. Use Value: Dual ACMP modules operate in STOP3 mode, enabling continuous low-power sensing without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ128MLH | 128 KB FLASH, 8 KB RAM, 2 KB EEPROM; identical pinout and peripheral set. | Higher memory headroom for complex diagnostics, OTA updates, or multi-protocol stacks. | Select when future firmware growth or additional safety-critical logging is anticipated. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core; 128 KB FLASH, 16 KB RAM; different architecture and toolchain. | Requires migration effort but offers higher performance, enhanced security, and modern peripheral sets (e.g., CRC, DMA). | Choose for new designs targeting long-term roadmap alignment beyond 8-bit legacy platforms. |
Compared with MC9S08DZ96MLH, the MC9S08DZ128MLH provides direct memory scalability within the same footprint and toolchain, while the S9KEAZ128AMLH represents a generational shift to ARM-based development with expanded capabilities but non-interchangeable software and debug infrastructure.
Availability
MC9S08DZ96MLH is available at Aetrix Electronics and suitable for automotive body electronics, instrument clusters, and engine management subsystems requiring stable component supply, long-lifecycle support, and AEC-Q100 qualification.
Supply support for MC9S08DZ96MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.
The MC9S08DZ96MLH belongs to the HCS08 DZ-series, designed specifically for cost-sensitive, high-reliability automotive control units requiring CAN, LIN, and robust analog integration in extended temperature environments.
FAQ
What is the maximum operating frequency of the MC9S08DZ96MLH CPU and bus?
The MC9S08DZ96MLH features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding maximum bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PEE mode with appropriate PLL configuration (e.g., 8 MHz crystal → 1 MHz reference → ×32 = 32 MHz DCO → ÷2 bus divider). The MC9S08DZ96MLH datasheet specifies these values under DC characteristics and MCG specifications sections.
Does the MC9S08DZ96MLH support CAN FD or only classical CAN 2.0?
The MC9S08DZ96MLH integrates the MSCAN module, which implements ISO 11898-1 (CAN 2.0A/B) only - it does not support CAN FD. Its MSCAN controller handles standard and extended data frames, remote frames, and five receive buffers with flexible identifier filtering, but lacks the bit-rate switching, extended data length, and CRC enhancements defined in CAN FD. For CAN FD requirements, newer NXP S32K or Kinetis families must be considered instead of the MC9S08DZ96MLH.
What is the purpose of the DIV32 bit in the MCGC3 register of the MC9S08DZ96MLH?
In the MC9S08DZ96MLH, the DIV32 bit (bit 4) in MCGC3 enables a divide-by-32 factor applied to the external reference clock before FLL input - but only when RANGE = 1 (high-frequency crystal mode). It must be cleared when PLLS = 1 (i.e., PLL selected), as stated in the MC9S08DZ128 Series Addendum Rev. 2. This ensures proper FLL/PLL reference frequency alignment (e.g., 8 MHz crystal ÷ 32 = 250 kHz for FLL, or ÷ 8 = 1 MHz for PLL), directly affecting bus clock stability and startup behavior in FEI-to-PEE transitions.
Can the MC9S08DZ96MLH operate in stop mode while maintaining CAN bus activity?
No - the MC9S08DZ96MLH cannot maintain active CAN communication in any stop mode. While its MSCAN module supports wake-up on CAN bus activity (e.g., dominant edge), the CAN controller itself is disabled in STOP2 and STOP3 modes per Section 3.6.3 of the MC9S08DZ128 Series Data Sheet. CAN reception and transmission require active clocking and CPU supervision, which are suspended in stop states. Wake-up events trigger exit to run/wait mode before CAN processing resumes.
What packaging and lead finish does the MC9S08DZ96MLH use?
The MC9S08DZ96MLH is supplied in a 64-pin low-profile quad flat-pack (LQFP) package measuring 10 mm × 10 mm with 0.5 mm pitch, per ordering information in Appendix B of the MC9S08DZ128 Series Data Sheet. It uses a lead-free (Pb-free), RoHS-compliant matte tin (Sn) lead finish, qualified for reflow soldering per JEDEC J-STD-020 standards. The "LH" suffix in the part number explicitly denotes this LQFP package variant.
MC9S08DZ96MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ96MLH FAQ
1.How can I place an order for MC9S08DZ96MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ96MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ96MLH reliable?
The price and inventory of MC9S08DZ96MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ96MLH is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ96MLH?
For technical support, including MC9S08DZ96MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ96MLH requirements.
6.How does Aetrix verify that MC9S08DZ96MLH is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ96MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ96MLH meets industry standards.
7.What is the process for return or replacement of MC9S08DZ96MLH?
All MC9S08DZ96MLH units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ96MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ96MLH part is unused and in its original packaging.
Return procedure for MC9S08DZ96MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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