NXP Semiconductors MC9S08DZ96MLL
- Part No.:
- MC9S08DZ96MLL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
MC9S08DZ96MLL.pdf
- Description:
- IC MCU 8BIT 96KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,688
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Product details
Overview
MC9S08DZ96MLL from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 96 KB flash, 6 KB RAM, and 2 KB EEPROM, featuring integrated CAN 2.0A/B controller, 12-bit ADC, dual SCI/LIN, dual SPI, dual I²C, and real-time counter - used in automotive body control modules and industrial sensor nodes.
For engineers reviewing the MC9S08DZ96MLL datasheet, MC9S08DZ96MLL pinout, MC9S08DZ96MLL application, or MC9S08DZ96MLL equivalent, key selection criteria include CAN protocol compliance, on-chip EEPROM endurance (100k erase/write cycles), stop3-mode current (1.5 µA typical), and background debug interface compatibility with S08 BDM tools.
Technical Context
The MC9S08DZ96MLL implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND instruction for single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming (0.2% resolution).
Peripherals include a 24-channel 12-bit ADC with 2.5 µs conversion time and temperature sensor, two analog comparators operational in stop3 mode, and MSCAN with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core / 20-MHz bus frequency |
| Flash Memory | 96 KB on-chip FLASH with program/erase during execution and block protection |
| EEPROM | 2 KB in-circuit programmable EEPROM with 8-byte sector erase and erase abort |
| RAM | 6 KB SRAM with retention in low-power wait and stop modes |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames and remote frames |
| ADC | 24-channel, 12-bit SAR ADC with 2.5 µs conversion time, internal bandgap reference, and temperature sensor channel |
| Low-Power Modes | Stop3 mode draws 1.5 µA typical; real-time interrupt available in run/wait/stop for wake-up without external components |
Pinout & Package
MC9S08DZ96MLL is housed in a 64-pin LQFP (10×10 mm, 0.5 mm pitch) package with 59 general-purpose I/O pins, 3 dedicated power/ground pins, and dedicated peripheral function pins including CANH/CANL, SCI0/SCI1, SPI0/SPI1, I²C0/I²C1, TPM channels, ADC inputs, and reset/debug signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Separate analog/digital power domains; VDDAD/VSSAD required for ADC operation |
| CANH, CANL | CAN differential bus interface | Direct connection to ISO 11898-compliant transceiver; supports 1 Mbps nominal bit rate |
| SCI0_TX, SCI0_RX | UART transmit/receive | Supports LIN 2.0 and SAE J2602 protocols with master/slave break generation/detection |
| TPM1_CH0–TPM1_CH5 | PWM/capture/compare outputs | 6-channel timer for motor control, LED dimming, or encoder input with edge-aligned or center-aligned PWM |
| AD0–AD23 | Analog input channels | 24 multiplexed inputs; includes dedicated temperature sensor and internal bandgap reference channel |
| BKGD/MS | Single-wire background debug | Enables in-circuit debugging and programming without JTAG; requires external pull-up |
Key Features
| Feature | Design Value |
|---|---|
| On-chip CAN controller | Full CAN 2.0A/B implementation with hardware message filtering, FIFO buffering, and loss-of-lock detection |
| In-system programmable EEPROM | 2 KB EEPROM with 100,000 erase/write cycles and 10-year data retention at 85°C |
| Real-time counter (RTC) | 8-bit modulus counter with binary/decimal prescaler; runs from 32.768 kHz crystal or internal 1 kHz oscillator for calendar/time-of-day functions |
| Low-voltage detection | Configurable trip points (e.g., 2.7 V, 3.0 V, 3.3 V) with reset or interrupt output and hysteresis |
| Background debug interface | Single-wire BDM with real-time bus capture and non-intrusive emulation - no debug overhead in target application |
Applications
| Automotive Body Control Unit | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, ADC-based potentiometer/sensor reading, and PWM-driven motor actuation. Use Value: Integrated MSCAN eliminates external CAN controller; 2 KB EEPROM stores calibration data and fault logs across power cycles. | Use Scenario: Remote environmental monitoring using temperature, humidity, and voltage sensors in factory automation systems. IC Role / Device Role / Timing Role: Data acquisition hub with 24-channel ADC sampling, RTC-stamped logging, and CAN-based telemetry transmission. Use Value: Stop3-mode current of 1.5 µA enables battery-powered operation >5 years; internal temperature sensor reduces BOM cost. |
| Motor Drive Interface Module | Smart Lighting Controller |
Use Scenario: Closed-loop DC motor control in HVAC actuators and seat positioners with feedback from hall-effect sensors. IC Role / Device Role / Timing Role: Real-time PWM generation (TPM), analog comparator-based overcurrent detection, and CAN status reporting. Use Value: Dual analog comparators operate in stop3 mode for fast wake-on-fault; 6-channel TPM supports three-phase commutation timing. | Use Scenario: DALI- or 0–10 V-compatible LED driver with dimming profile storage and thermal derating logic. IC Role / Device Role / Timing Role: System manager handling I²C sensor reads, PWM dimming control, and nonvolatile configuration storage. Use Value: 2 KB EEPROM retains user-defined lighting scenes and thermal thresholds; dual I²C interfaces support sensor + DALI bridge coexistence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ96F1MLF | Same die, but in 64-pin QFP with different moisture sensitivity level (MSL3 vs MSL3); identical electrical specs and pinout | No functional difference; differs only in packaging compliance and tape-and-reel orientation | Select based on assembly line requirements and JEDEC MSL handling capability |
| MC9S08DZ60MLL | Reduced memory: 60 KB flash, 4 KB RAM, no EEPROM; same peripheral set and pin-compatible in 64-pin LQFP | Limited firmware footprint and data logging depth; unsuitable for applications requiring persistent parameter storage | Choose when cost-sensitive designs can omit EEPROM and reduce code size below 60 KB |
Compared with MC9S08DZ96MLL, S9S08DZ96F1MLF offers identical functionality with alternate packaging compliance, while MC9S08DZ60MLL sacrifices EEPROM and memory capacity for lower unit cost - both require validation of flash layout and EEPROM-dependent routines before substitution.
Availability
MC9S08DZ96MLL is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN networks, and embedded sensor systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for MC9S08DZ96MLL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08DZ96MLL belongs to the HCS08 DZ-series, designed specifically for cost-sensitive, CAN-enabled automotive body electronics and industrial control applications requiring robust flash endurance, EEPROM data retention, and ultra-low-power operation.
FAQ
What is the maximum operating frequency of the MC9S08DZ96MLL CPU core?
The MC9S08DZ96MLL CPU core operates at up to 40 MHz, with a corresponding bus clock frequency of 20 MHz. This timing is achieved via the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, using either internal trimmed reference or external crystal/resonator input. The MC9S08DZ96MLL maintains full peripheral functionality at this speed, including CAN communication at 1 Mbps and ADC conversions within specification.
Does the MC9S08DZ96MLL support in-application programming (IAP) of its EEPROM?
Yes, the MC9S08DZ96MLL supports in-application programming of its 2 KB EEPROM, allowing firmware to write and erase EEPROM sectors while executing from flash memory. It supports 8-byte single-page or 4-byte dual-page erase operations, with erase abort capability and automatic wear leveling managed by application code. The MC9S08DZ96MLL EEPROM is rated for 100,000 erase/write cycles and 10-year data retention at 85°C.
What low-power modes are available on the MC9S08DZ96MLL, and what is the typical current draw in stop3 mode?
The MC9S08DZ96MLL supports two very low-power stop modes (stop2 and stop3), plus reduced-power wait mode. In stop3 mode - the deepest sleep state - typical current consumption is 1.5 µA at 25°C and 3.3 V, with optional real-time interrupt wake-up using the internal 1 kHz oscillator. The MC9S08DZ96MLL retains RAM contents and allows wake-up via CAN, SCI, TPM, or pin interrupts, making it suitable for battery-powered CAN nodes.
Is the MC9S08DZ96MLL pin-compatible with other members of the HCS08 DZ series?
The MC9S08DZ96MLL is pin-compatible with the MC9S08DZ128MLL and MC9S08DZ60MLL in the same 64-pin LQFP package, sharing identical pin assignments for power, I/O, CAN, SCI, SPI, I²C, and debug signals. However, memory mapping and some peripheral register defaults differ; firmware must be validated for flash size, EEPROM presence, and RAM allocation when migrating to or from the MC9S08DZ96MLL.
What development tools are supported for debugging the MC9S08DZ96MLL?
The MC9S08DZ96MLL supports NXP's S08 BDM (Background Debug Mode) interface via the BKGD/MS pin, compatible with P&E Micro's USB-ML-12 and Cyclone Pro debug probes, as well as older Freescale DEMO9S08DZ60 evaluation boards. It enables single-wire in-circuit debugging, flash programming, real-time bus capture, and non-intrusive breakpoints - all without requiring additional debug pins or JTAG header. The MC9S08DZ96MLL does not support SWD or JTAG.
MC9S08DZ96MLL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 87
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08DZ96MLL FAQ
1.How can I place an order for MC9S08DZ96MLL through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08DZ96MLL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08DZ96MLL reliable?
The price and inventory of MC9S08DZ96MLL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08DZ96MLL is usually 5 days.
3.What payment methods are accepted for MC9S08DZ96MLL?
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4.How is shipping managed for MC9S08DZ96MLL?
MC9S08DZ96MLL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08DZ96MLL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08DZ96MLL?
For technical support, including MC9S08DZ96MLL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08DZ96MLL requirements.
6.How does Aetrix verify that MC9S08DZ96MLL is sourced from the original manufacturer or authorized distributors?
All MC9S08DZ96MLL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08DZ96MLL meets industry standards.
7.What is the process for return or replacement of MC9S08DZ96MLL?
All MC9S08DZ96MLL units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08DZ96MLL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08DZ96MLL part is unused and in its original packaging.
Return procedure for MC9S08DZ96MLL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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