NXP Semiconductors MC9S08EL16CTJ

Overview

MC9S08EL16CTJ from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and 128 B EEPROM; features 10-bit ADC, dual analog comparators, LIN-capable SLIC, SCI, SPI, I²C, two TPM modules, RTC, and 22 GPIO pins; designed for automotive body electronics and industrial control nodes requiring robust LIN communication and low-power operation.

For engineers reviewing the MC9S08EL16CTJ datasheet, MC9S08EL16CTJ pinout, MC9S08EL16CTJ application, or MC9S08EL16CTJ equivalent, key selection criteria include LIN 2.0/SAE J2602 compliance, stop3-mode operation with ADC/ACMP active, internal clock source trimming accuracy (±2% over voltage/temperature), and TSSOP-28 package compatibility with automotive-grade thermal and EMI requirements.

Technical Context

The MC9S08EL16CTJ implements the HCS08 CPU core running at up to 40 MHz, with instruction set backward compatibility to HC08 plus BGND debug support. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmable internal reference (0.2% resolution, ±2% deviation across voltage and temperature), enabling stable bus frequencies from 2–20 MHz without external crystal.

Peripherals are optimized for automotive subsystems: SLIC handles full LIN 2.0 message buffering, checksum generation/verification, and automatic bit-rate synchronization; ADC supports 16-channel, 10-bit conversions in <2.5 µs and operates in stop3 mode with temperature sensor and bandgap reference; dual ACMPs route outputs to TPM for hardware-triggered PWM response.

Key Specifications

Pinout & Package

MC9S08EL16CTJ is housed in a 28-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, JEDEC MO-153 compliant, rated for −40°C to +125°C ambient operation and qualified per AEC-Q100 Grade 2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Compared with MC9S08EL16CTJ, MC9S08EL32CTJ offers double FLASH capacity with zero hardware change, while S9S08EL16F2CTJ delivers identical functionality with enhanced automotive qualification and extended manufacturer support - both preserve full software compatibility and PCB reuse.

Availability

MC9S08EL16CTJ is available at Aetrix Electronics and suitable for automotive body electronics, industrial LIN networks, and embedded control systems requiring stable component supply, AEC-Q100 qualification, and long-term manufacturing continuity.

Supply support for MC9S08EL16CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU heritage.

The MC9S08EL16CTJ belongs to the HCS08 EL-series, engineered specifically for cost-sensitive, LIN-based automotive body control units requiring high integration, low power, and AEC-Q100 Grade 2 reliability.

FAQ

What is the maximum operating frequency of the MC9S08EL16CTJ CPU core?

The MC9S08EL16CTJ features an HCS08 CPU core rated for up to 40 MHz operation. Its actual bus frequency depends on the selected clock source and divider settings - the internal ICS supports 2–20 MHz bus frequencies, while external crystal configurations can achieve the full 40-MHz core speed with appropriate PLL/FLL configuration. The MC9S08EL16CTJ datasheet specifies timing parameters for all supported configurations.

Does the MC9S08EL16CTJ support LIN communication natively?

Yes, the MC9S08EL16CTJ integrates a dedicated Slave LIN Interface Controller (SLIC) that fully complies with LIN 2.0 and SAE J2602 standards. It supports up to 120 kbps, automatic bit-rate and frame synchronization, checksum generation and verification, and full message buffering - eliminating the need for external LIN transceivers or software protocol stacks.

Can the MC9S08EL16CTJ operate in low-power modes while maintaining peripheral functionality?

Yes, the MC9S08EL16CTJ supports multiple low-power modes, including stop3 mode where the ADC, analog comparators, RTC, and SLIC remain fully operational. This enables wake-on-event capabilities - such as analog threshold crossing or LIN message reception - while drawing sub-microamp current, making the MC9S08EL16CTJ ideal for battery-powered automotive modules.

What package type and pin count does the MC9S08EL16CTJ use?

The MC9S08EL16CTJ is supplied in a 28-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm lead pitch. This JEDEC MO-153 compliant package supports surface-mount assembly and is rated for −40°C to +125°C operation, meeting automotive Grade 2 requirements. Pin assignments match MC9S08EL32CTJ for direct footprint compatibility.

Is the MC9S08EL16CTJ pin-compatible with other members of the HCS08 EL family?

Yes, the MC9S08EL16CTJ shares identical pinout and package (28-TSSOP) with MC9S08EL32CTJ and MC9S08SL16CTJ. All three devices maintain register-level compatibility across peripherals and memory maps, enabling hardware reuse and firmware scalability. This allows designers to select FLASH size based on application needs without modifying PCB layout or schematic symbols.