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NXP Semiconductors MC9S08EL32CTJ
- Part No.:
- MC9S08EL32CTJ
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MC9S08EL32CTJ.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,975
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Product details
Overview
MC9S08EL32CTJ from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and 1 KB EEPROM, featuring a 40-MHz CPU, dual analog comparators, 10-bit 16-channel ADC, LIN-capable SLIC, and RTC - deployed in automotive body control modules for sensor signal conditioning and LIN network node management.
For engineers reviewing the MC9S08EL32CTJ datasheet, MC9S08EL32CTJ pinout, MC9S08EL32CTJ application, or MC9S08EL32CTJ equivalent, key selection criteria include stop3-mode operation with ADC/ACMP active, SLIC compliance with LIN 2.0/SAE J2602, internal clock source trimming accuracy (±2% over voltage/temperature), and TSSOP-28 package compatibility with automotive PCB layouts.
Technical Context
The MC9S08EL32CTJ integrates an HCS08 CPU core with BGND instruction support and up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (0.2% resolution, ±2% deviation), enabling bus frequencies from 2–20 MHz without external crystal.
Peripherals include a LIN-compliant Slave Interface Controller (SLIC) supporting automatic bit-rate synchronization and checksum verification, plus two analog comparators with bandgap reference option and output routable to TPM - all operable in Stop3 mode with 1-kHz RTC wake-up capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz max frequency and HC08 instruction set plus BGND debug instruction |
| Memory | 32 KB FLASH (in-circuit programmable/erasable), 2 KB RAM, 1 KB EEPROM (program/erase while executing FLASH) |
| ADC | 16-channel, 10-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| SLIC | LIN 2.0 and SAE J2602 compliant; full message buffering, automatic frame sync, checksum generation/verification |
| Clock Source | Internal ICS with FLL + trimmable reference (0.2% resolution, ±2% deviation over VDD/temp); supports 2–20 MHz bus frequency |
| Power Modes | Stop3 mode with RTC, ADC, ACMP, SCI, SPI, IIC, TPM active; very low-power real-time interrupt available in run/wait/stop |
| Package | 28-pin Thin Shrink Small Outline Package (TSSOP), lead-free, RoHS-compliant, 4.4 mm × 9.7 mm footprint |
Pinout & Package
MC9S08EL32CTJ is housed in a 28-pin TSSOP package with 22 general-purpose I/O pins, 16 interrupt-capable inputs, and configurable slew rate/drive strength on all outputs. All input pins feature hysteresis and selectable pull-up devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5-V analog/digital supply rails; separate VDDAD/VSSAD pins support noise-isolated ADC operation |
| XTAL, EXTAL | Crystal oscillator interface | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators; optional bypass for internal ICS-only operation |
| BKGD/MS | Single-wire background debug | Enables in-circuit debugging via BDM interface; also serves as mode select during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervisor or manual reset button |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt capability on all pins; configurable pull-up, hysteresis, and drive strength |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port; PTA0–PTB7 collectively provide 22 GPIOs; some pins multiplexed with ADC/TPM/SCI functions |
| PTC0–PTC5 | Port C general-purpose I/O | 6-bit port; includes SLIC_TX/RX, SPI_MOSI/MISO/SCK, IIC_SCL/SDA, and RTC_CLKOUT functions |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Mode Operation | Enables ADC, ACMP, SLIC, RTC, and TPM to remain functional during ultra-low-power sleep - critical for battery-powered LIN nodes requiring periodic sensor sampling |
| SLIC Hardware Acceleration | Offloads LIN protocol handling (bit timing, sync, checksum, frame buffering) from CPU - reduces firmware overhead and improves deterministic response |
| Trimmed Internal Clock Source | ICS achieves ±2% bus frequency accuracy across -40°C to +125°C and 4.5–5.5 V without external crystal - lowers BOM cost and board space in cost-sensitive automotive modules |
| On-Chip Security Circuitry | Prevents unauthorized read-out of FLASH, EEPROM, and RAM contents - meets basic ECU firmware protection requirements per ISO 15765-4 |
| Background Debug Interface | Single-wire BDM enables field firmware updates and real-time debugging without JTAG header - simplifies production test and service diagnostics |
Applications
| Automotive Door Module | Body Control Unit (BCU) |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU managing LIN slave nodes (e.g., mirror actuators, seat position sensors) and local analog inputs (potentiometers, thermistors). Use Value: SLIC handles LIN communication autonomously while ADC monitors window current for anti-pinch detection - enabling responsive, fail-safe operation within tight timing budgets. | Use Scenario: Integration hub coordinating lighting, wiper, horn, and HVAC controls across multiple vehicle domains. IC Role / Device Role / Timing Role: Real-time controller executing cyclic tasks (e.g., 10-ms lighting dimming PWM, 100-ms wiper interval logic) with RTC-driven scheduling. Use Value: Stop3 mode with RTC wake-up allows 95% duty-cycle sleep while maintaining precise 100-ms task intervals - extending battery life in parked-state monitoring. |
| Smart Rearview Mirror | Seat Position Memory System |
Use Scenario: Auto-dimming mirror with ambient light sensing and glare detection via photodiodes. IC Role / Device Role / Timing Role: Signal conditioner and LIN gateway relaying mirror status to instrument cluster. Use Value: Dual ACMPs compare photodiode outputs against internal bandgap reference to detect glare onset within 1 μs - enabling sub-50-ms dimming response. | Use Scenario: Storing and recalling driver seat position using potentiometer feedback and non-volatile memory. IC Role / Device Role / Timing Role: EEPROM-based configuration manager with tamper-resistant storage of seat profile data. Use Value: In-circuit programmable EEPROM retains 100,000+ write cycles and survives >10-year data retention at 125°C - ensuring reliability across vehicle lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08EL32F2CTJ | Same die, updated mask set with enhanced ESD rating (±8 kV HBM) and extended temperature range (-40°C to +125°C vs. original -40°C to +105°C) | Required for under-hood applications exceeding 105°C ambient; identical pinout and firmware compatibility | Select when operating in high-temperature zones (e.g., engine bay proximity) or where higher ESD robustness is mandated by OEM spec. |
| MC9S08DZ128CLC | 128 KB FLASH, CAN 2.0B interface, 48-pin LQFP; lacks SLIC but adds CAN transceiver support and larger memory | Suitable for gateway ECUs needing CAN-LIN bridging; not drop-in due to different pin count, peripheral set, and package | Choose for systems requiring CAN connectivity and higher code capacity - requires PCB redesign and firmware adaptation. |
Compared with MC9S08EL32CTJ, S9S08EL32F2CTJ offers direct replacement capability with improved thermal/ESD specs, while MC9S08DZ128CLC provides expanded connectivity and memory at the cost of layout and software rework - making the former ideal for lifecycle refresh and the latter for architecture upgrades.
Availability
MC9S08EL32CTJ is available at Aetrix Electronics and suitable for automotive body electronics, LIN sensor nodes, and embedded control applications requiring stable component supply, long-term industrial availability, and AEC-Q100 qualification support.
Supply support for MC9S08EL32CTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's automotive MCU legacy.
The MC9S08EL32CTJ belongs to NXP's legacy HCS08 automotive microcontroller family, designed specifically for cost-optimized, LIN-based body electronics where low power, functional safety, and protocol offload are critical.
FAQ
What is the maximum operating frequency of the MC9S08EL32CTJ CPU core?
The MC9S08EL32CTJ features an HCS08 CPU core rated for a maximum frequency of 40 MHz. This speed is achievable when the internal clock source (ICS) is configured to deliver a 20-MHz bus clock with a 2× prescaler, or directly from an external crystal oscillator. The core maintains full instruction set compatibility and interrupt latency performance at this rate, as verified in the Rev. 3 datasheet section 7.1.1.
Does the MC9S08EL32CTJ support LIN 2.0 communication natively?
Yes, the MC9S08EL32CTJ includes a dedicated Slave LIN Interface Controller (SLIC) module that fully complies with LIN 2.0 and SAE J2602 standards. It provides hardware-level frame synchronization, automatic checksum generation and verification, and up to 120 kbps data rates - eliminating the need for bit-banged software LIN stacks and reducing CPU load during communication.
Can the MC9S08EL32CTJ operate in low-power modes while retaining ADC functionality?
Yes, the MC9S08EL32CTJ supports ADC operation in Stop3 mode - its deepest low-power state with selected peripherals active. In Stop3, the 10-bit 16-channel ADC continues sampling with 2.5 μs conversion time, using either internal or external clock sources. This capability is confirmed in Section 10.4.7 of the Rev. 3 datasheet and enables energy-efficient sensor monitoring in battery-powered automotive nodes.
What package type and pin count does the MC9S08EL32CTJ use?
The MC9S08EL32CTJ is packaged in a 28-pin Thin Shrink Small Outline Package (TSSOP), with a 0.65 mm lead pitch and RoHS-compliant lead finish. Its mechanical dimensions are 4.4 mm × 9.7 mm, and it exposes 22 general-purpose I/O pins alongside dedicated power, debug, reset, and oscillator terminals - as documented in Appendix B of the Rev. 3 datasheet.
Is the MC9S08EL32CTJ qualified for automotive applications?
Yes, the MC9S08EL32CTJ is AEC-Q100 qualified for automotive applications, with guaranteed operation over the -40°C to +105°C temperature range. It incorporates automotive-grade features including watchdog COP reset, low-voltage detection with interrupt/reset, illegal opcode/address protection, and FLASH/EEPROM block security - meeting baseline functional safety requirements for body electronics per ISO 26262 ASIL-A readiness.
MC9S08EL32CTJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08EL32CTJ FAQ
1.How can I place an order for MC9S08EL32CTJ through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08EL32CTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08EL32CTJ reliable?
The price and inventory of MC9S08EL32CTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08EL32CTJ is usually 5 days.
3.What payment methods are accepted for MC9S08EL32CTJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08EL32CTJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08EL32CTJ?
MC9S08EL32CTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08EL32CTJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08EL32CTJ?
For technical support, including MC9S08EL32CTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08EL32CTJ requirements.
6.How does Aetrix verify that MC9S08EL32CTJ is sourced from the original manufacturer or authorized distributors?
All MC9S08EL32CTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08EL32CTJ meets industry standards.
7.What is the process for return or replacement of MC9S08EL32CTJ?
All MC9S08EL32CTJ units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08EL32CTJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08EL32CTJ part is unused and in its original packaging.
Return procedure for MC9S08EL32CTJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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