NXP Semiconductors MC9S08GB60ACFUER
- Part No.:
- MC9S08GB60ACFUER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MC9S08GB60ACFUER.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08GB60ACFUER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and integrated peripherals including dual SCI, SPI, I²C, 16-channel 10-bit ADC, and two 16-bit TPM timer/PWM modules. It operates at up to 40 MHz bus frequency using internal or external clock sources and targets cost-sensitive industrial control and automotive body electronics applications.
For engineers reviewing the MC9S08GB60ACFUER datasheet, MC9S08GB60ACFUER pinout, MC9S08GB60ACFUER application, or MC9S08GB60ACFUER equivalent, key selection criteria include its QFN-48 package, 5 V tolerant I/O, low-power stop modes (Stop3 current < 1 µA), and compatibility with S08 background debug mode for in-circuit programming and debugging.
Technical Context
The MC9S08GB60ACFUER implements the S08CPUV2 core with 16-bit index register, 8-bit accumulator, and 16-level hardware stack. Its internal clock generator (S08ICGV2) supports multiple modes - FEI, FEE, FBE - enabling flexible clocking from 32 kHz crystals to 4 MHz external oscillators, with bus frequencies scalable up to 40 MHz via FLL multiplication.
Peripheral integration includes two serial communication interfaces (SCI1/SCI2), one I²C module (S08IICV1), one SPI controller (S08SPIV3), a 16-channel 10-bit analog-to-digital converter (S08ATDV3), and dual 16-bit timer/PWM modules (TPM1/TPM2) with input capture, output compare, and edge-aligned PWM capabilities - all accessible through dedicated port pins mapped in the 48-pin QFN package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with 16-bit index register and 16-level hardware stack |
| Flash Memory | 60 KB program Flash with block protection, 512-byte EEPROM emulation |
| RAM Size | 4 KB on-chip RAM, zero-wait-state access at full bus speed |
| Max Bus Frequency | 40 MHz - determines maximum peripheral timing resolution and instruction throughput |
| ADC Resolution | 10-bit SAR ADC with 16 input channels and programmable sample time |
| Timer Modules | Two independent 16-bit TPM modules supporting input capture, output compare, and PWM generation |
| I/O Pins | 42 general-purpose I/O pins with configurable pull-ups, slew rate control, and 5 V tolerance |
| Low-Power Modes | Stop3 mode draws < 1 µA typical - enables battery-powered operation with wake-on-IRQ or LVD |
Pinout & Package
MC9S08GB60ACFUER is housed in a 48-pin QFN (Quad Flat No-lead) package with exposed thermal pad (98ASA00466D), measuring 7 mm × 7 mm × 0.85 mm. The package uses copper wire bonding and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power supply and ground rails | Dual power domains: digital (VDD/VSS) and analog (VDDA/VSSA) for noise isolation in mixed-signal operation |
| EXTAL / XTAL | Crystal oscillator inputs | Supports 32 kHz watch crystal or 1–8 MHz fundamental-mode crystals; enables precise real-time clock and low-power modes |
| PTA0–PTA7 | Port A I/O with KBI | 8-bit port with keyboard interrupt capability - used for matrix keypad scanning or wake-on-key events |
| PTB0–PTB7 | Port B I/O with ADC inputs | 8 analog input channels (AD0–AD7) plus digital I/O; supports single-ended or differential ADC conversions |
| PTC0–PTC7 | Port C I/O with I²C/SCI2 | Includes I²C SDA/SCL and SCI2 TX/RX - enables multi-drop sensor networks and secondary UART communication |
| PTD0–PTD7 | Port D I/O with TPM1/TPM2 | Four TPM channel I/O pins (TPM1CH0–TPM1CH3, TPM2CH0–TPM2CH3) for PWM motor control or pulse measurement |
| PTE0–PTE7 | Port E I/O with SCI1/SPI | SCI1 TX/RX and SPI MOSI/MISO/SCK/SS - supports primary UART and synchronous serial peripheral interfacing |
| PTF0–PTF3 | Port F high-current drivers | 4 pins rated for 20 mA sink/source - suitable for LED driving or direct solenoid control without external buffers |
| PTG0 | BKGD/MS debug pin | Single-wire background debug interface - enables flash programming, breakpoints, and real-time register inspection |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external pushbutton or supervisor IC assertion |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Enables 100,000 write/erase cycles and 20-year data retention - critical for field-upgradable firmware storage |
| Background Debug Mode (BDM) | Single-pin debug interface with full memory and register visibility - eliminates need for JTAG header or debug probe footprint |
| Programmable Low-Voltage Detect (LVD) | Configurable trip points (2.5 V, 2.7 V, 2.9 V, 3.1 V) with reset or interrupt output - prevents erratic operation during brown-out conditions |
| Real-Time Interrupt (RTI) | Free-running 16-bit counter with selectable prescaler (1–128) generating periodic interrupts up to 1.28 s interval - replaces external RTC in simple timing applications |
| High-Current I/O Pins (PTF0–PTF3) | 20 mA drive capability per pin - directly drives LEDs, relays, or small solenoids without external transistors or drivers |
| Stop3 Mode Power Consumption | < 1 µA typical at 25°C - extends battery life in remote sensors or infrequent-wake systems such as tire pressure monitors |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN/LIN gateway logic, PWM motor control, and analog sensor acquisition. Use Value: Integrated 16-channel ADC and dual TPM modules eliminate external signal conditioning and timing ICs - reducing BOM count and PCB area. | Use Scenario: Battery-powered environmental monitoring node measuring temperature, humidity, and CO₂ via analog and digital sensors. IC Role / Device Role / Timing Role: System controller managing sensor polling, data logging to Flash, and low-power wireless transmission scheduling. Use Value: Stop3 mode current < 1 µA and programmable LVD enable multi-year operation on coin-cell batteries without external power management ICs. |
| Smart Appliance Control Panel | Medical Diagnostic Handheld |
Use Scenario: Keypad-driven user interface for washing machines, microwaves, or HVAC controllers with LED feedback and motor actuation. IC Role / Device Role / Timing Role: Front-end controller handling matrix keypad scan (via Port A KBI), LED PWM dimming (via TPM), and relay/valve switching (via PTF high-current outputs). Use Value: On-chip keyboard interrupt and 20 mA I/O pins reduce external components - simplifying layout and improving ESD robustness in consumer environments. | Use Scenario: Portable blood glucose meter or pulse oximeter requiring analog front-end precision, button interface, and battery efficiency. IC Role / Device Role / Timing Role: Signal acquisition MCU performing 10-bit ADC sampling, button debouncing, and display update timing via RTI. Use Value: 10-bit ADC with internal reference and programmable sample time ensures consistent measurement accuracy across varying supply voltages and temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZN64ACLH | Kinetis E-series ARM Cortex-M0+ core, 64 KB Flash, 8 KB RAM, higher performance but larger code footprint and no native BDM | Requires ARM toolchain and lacks single-pin debug; better for new designs needing >40 MHz throughput or USB | Select when migrating to ARM ecosystem or requiring higher computational throughput; not drop-in compatible |
| MC9S08AC60CFUE | HCS08 family, same core and peripheral set, but 44-pin QFP package and only 60 KB Flash (no RAM difference) | Same instruction set and register map; differs in pin count, package type, and lack of exposed thermal pad | Choose for legacy board redesigns where QFP footprint is retained and thermal pad is not required |
Compared with S9KEAZN64ACLH and MC9S08AC60CFUE, the MC9S08GB60ACFUER offers optimal balance of legacy toolchain support, ultra-low-power Stop3 mode, and QFN thermal performance - making it preferred for cost-constrained, battery-aware HCS08-based designs requiring minimal PCB real estate.
Availability
MC9S08GB60ACFUER is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control panels, and portable medical diagnostics requiring stable component supply and long-term manufacturability.
Supply support for MC9S08GB60ACFUER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08GB60ACFUER belongs to the HCS08 microcontroller family designed for cost-sensitive, low-power embedded control applications where deterministic real-time response, small code size, and minimal external components are essential.
FAQ
What is the maximum operating frequency of the MC9S08GB60ACFUER?
The MC9S08GB60ACFUER supports a maximum bus frequency of 40 MHz, achieved using the internal FLL in FEE mode with an external 4 MHz crystal. This frequency governs instruction execution speed, peripheral timing resolution, and ADC conversion rate - all verified in the Rev. 2 datasheet's electrical characteristics (Appendix A). The MC9S08GB60ACFUER maintains full functionality across its specified voltage and temperature range at this speed.
Does the MC9S08GB60ACFUER support in-circuit debugging without additional hardware?
Yes, the MC9S08GB60ACFUER integrates Background Debug Mode (BDM) accessible via the PTG0 pin, enabling full in-circuit debugging - including flash programming, breakpoint setting, and register inspection - using only a single-wire connection and standard BDM interface tools. No JTAG header, debug probe, or external debug circuitry is required, as confirmed in Chapter 15 of the MC9S08GB60ACFUER datasheet.
What package type and dimensions does the MC9S08GB60ACFUER use?
The MC9S08GB60ACFUER uses a 48-pin QFN package (document number 98ASA00466D), measuring 7 mm × 7 mm × 0.85 mm with an exposed thermal pad. It employs copper wire bonding and complies with RoHS requirements. This package replaces earlier gold-wire variants and is documented in the QFN_Addendum Rev. 0 (July 2014) as part of Freescale's QFN migration program.
Can the MC9S08GB60ACFUER operate from a 32 kHz watch crystal?
Yes, the MC9S08GB60ACFUER supports 32 kHz crystal operation on EXTAL/XTAL pins for low-power real-time clock functions and Stop mode wake-up. In FEI mode, it can generate a 1–4 MHz bus clock from the 32 kHz source using internal FLL multiplication - enabling accurate timekeeping while maintaining system responsiveness, as detailed in Section 7.4.2 of the MC9S08GB60ACFUER datasheet.
How many analog input channels does the MC9S08GB60ACFUER ADC support?
The MC9S08GB60ACFUER integrates a 10-bit successive approximation ADC with 16 input channels - eight dedicated analog inputs (AD0–AD7) on Port B, and eight additional channels accessible via multiplexed pins on Ports A, C, and E. Channel selection, sample time, and conversion triggers are fully software-configurable per the S08ATDV3 module description in Chapter 14 of the MC9S08GB60ACFUER datasheet.
MC9S08GB60ACFUER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08GB60ACFUER FAQ
1.How can I place an order for MC9S08GB60ACFUER through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08GB60ACFUER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08GB60ACFUER reliable?
The price and inventory of MC9S08GB60ACFUER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08GB60ACFUER is usually 5 days.
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Once your MC9S08GB60ACFUER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08GB60ACFUER?
For technical support, including MC9S08GB60ACFUER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GB60ACFUER requirements.
6.How does Aetrix verify that MC9S08GB60ACFUER is sourced from the original manufacturer or authorized distributors?
All MC9S08GB60ACFUER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GB60ACFUER meets industry standards.
7.What is the process for return or replacement of MC9S08GB60ACFUER?
All MC9S08GB60ACFUER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GB60ACFUER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08GB60ACFUER part is unused and in its original packaging.
Return procedure for MC9S08GB60ACFUER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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