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NXP Semiconductors MC9S08GB60CFUER

Part No.:
MC9S08GB60CFUER
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixMC9S08GB60CFUER.pdf
Description:
IC MCU 8BIT 60KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,978

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Product details

Overview

MC9S08GB60CFUER from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB Flash, 4 KB RAM, and integrated peripherals including SCI, SPI, I²C, TPM, ATD, and KBI. It operates at up to 20 MHz bus frequency, supports multiple low-power stop/wait modes, and targets cost-sensitive industrial control and automotive body electronics.

For engineers reviewing the MC9S08GB60CFUER datasheet, MC9S08GB60CFUER pinout, MC9S08GB60CFUER application, or MC9S08GB60CFUER equivalent, key selection criteria include Flash endurance (100k erase/write cycles), on-chip ICG clock generation with FLL support, 5V-tolerant I/O capability, and background debug mode (BDM) interface compatibility.

Technical Context

The MC9S08GB60CFUER implements the HCS08 CPU core with 16-bit index register, 8-bit accumulator, and 16-bit stack pointer. Its internal clock generator (ICG) supports four operational modes-FEI, FBE, FEE, and SCM-with programmable FLL multiplication and external crystal or RC oscillator input.

Peripheral integration includes two serial communication interfaces (SCI1/SCI2), one SPI module, one I²C module, two 16-bit timer/PWM modules (TPM1/TPM2), a 10-bit 8-channel analog-to-digital converter (ATD), and keyboard interrupt (KBI) support on Port A pins-all mapped to dedicated I/O ports with configurable pull-ups and slew rate control.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS08 8-bit CPU with 16-bit index register and 16-bit stack pointer
Flash Memory60 KB on-chip Flash with 100,000 erase/write cycles and block protection
RAM Size4 KB on-chip RAM for data and stack storage
Max Bus Frequency20 MHz - determines instruction throughput and peripheral timing resolution
ADC Resolution10-bit successive approximation ATD with 8 input channels and software/hardware trigger
Supply Voltage2.7–5.5 V - enables direct interfacing with 3.3 V and 5 V logic systems
Operating Temp–40°C to +105°C - qualified for under-hood automotive and industrial environments

Pinout & Package

MC9S08GB60CFUER is housed in a 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments follow Freescale's standard HCS08 GB/GT series layout, supporting multiplexed peripheral functions per port.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD supplies core/peripherals; VSS is common reference
PTA0–PTA7Port A I/O with KBI8-bit general-purpose port; KBI0–KBI7 enable wake-from-stop via edge-triggered inputs
PTB0–PTB7Port B I/O with ATD8-bit port; PTB0–PTB7 serve as analog inputs for 10-bit ATD channel 0–7
PTC0–PTC7Port C I/O with SCI2/IICSCI2 transmit/receive and I²C SDA/SCL shared on PTC0/PTC1; high-current drive capability
PTD0–PTD7Port D I/O with TPM1/TPM2TPM1 and TPM2 channel I/O (e.g., PTD0–PTD3 = TPM1CH0–TPM1CH3)
PTE0–PTE7Port E I/O with SCI1/SPISCI1 TX/RX and SPI MOSI/MISO/SCK mapped to PTE0–PTE3
PTF0–PTF7Port F I/O with high-current driversUp to 20 mA sink/source per pin; suitable for LED/driver direct interface
PTG0BKGD/MSSingle-wire background debug and mode select; requires external pull-up for BDM entry
EXTAL/XTALOscillator interfaceSupports 32 kHz crystal (RTC) or 1–8 MHz crystal/resonator for ICG reference

Key Features

FeatureDesign Value
On-chip ICG with FLLEnables precise bus frequency derivation (e.g., 20 MHz) from low-cost 4 MHz crystal without external PLL components
Background Debug Mode (BDM)Single-pin (PTG0) debug interface supports real-time memory/register access and breakpoint execution without dedicated JTAG hardware
Low-voltage detect (LVD)Configurable reset/interrupt thresholds (e.g., 2.5 V, 2.7 V, 3.0 V) protect firmware integrity during brown-out conditions
Flash security bytePrevents unauthorized read-out of Flash contents via BDM or mass erase, enabling IP protection in production units
Multiple stop modes (Stop1/Stop2/Stop3)Reduces current consumption to ≤1 µA in Stop3 while retaining RAM content and enabling wake via KBI/SCI/RTI

Applications

Automotive Body Control ModuleIndustrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in 12 V vehicle electrical architecture.

IC Role / Device Role / Timing Role: Main system MCU managing CAN/LIN gateway logic, PWM motor control, and analog sensor signal acquisition.

Use Value: 5.5 V tolerant I/O eliminates level-shifting for direct connection to automotive switches and actuators; 105°C rating ensures reliability near engine compartments.

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data in factory settings.

IC Role / Device Role / Timing Role: Low-power data aggregator with ATD sampling, SPI flash logging, and SCI UART telemetry transmission.

Use Value: Stop3 mode draws <1 µA, extending battery life to >5 years; integrated RTI provides accurate time-stamping without external RTC.

Smart Appliance Control BoardMedical Diagnostic Handheld

Use Scenario: Washing machine main controller handling motor phase sequencing, water valve actuation, and user interface feedback.

IC Role / Device Role / Timing Role: Real-time motor timing engine using TPM PWM outputs and KBI-driven keypad scanning.

Use Value: Dual TPM modules deliver independent 16-bit PWM channels for inverter gate drive and buzzer tone generation; 4 KB RAM accommodates multi-tasking state machines.

Use Scenario: Portable blood glucose meter requiring precise analog measurement, LCD display control, and USB/UART diagnostics.

IC Role / Device Role / Timing Role: Signal conditioning MCU acquiring 10-bit ATD readings from electrochemical sensor strips.

Use Value: On-chip 10-bit ATD achieves ±1 LSB INL/DNL accuracy over full temperature range; internal voltage reference reduces BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9S08SG64F1MLCSame HCS08 core, 64 KB Flash, but uses 44-pin LQFP; lacks PTG0 BDM pin - requires separate BDM podTargeted at cost-optimized consumer appliances where debug access is limited to production programming onlySelect when PCB layout prioritizes LQFP manufacturability over single-wire debug convenience
MC9S08AC60CPUEIdentical 60 KB Flash and peripheral set, but rated only to 85°C and packaged in 64-pin QFPSuitable for commercial-grade HVAC controllers where extended temperature operation is not requiredChoose when industrial temperature grade is unnecessary and larger footprint allows easier hand-soldering or test probe access

Compared with MC9S08GB60CFUER, the S9S08SG64F1MLC trades BDM integration for lower package cost, while the MC9S08AC60CPUE sacrifices automotive temperature range for broader commercial availability and legacy QFP compatibility - both require design review for thermal, debug, and layout implications.

Availability

MC9S08GB60CFUER is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control boards, and medical diagnostic handhelds requiring stable component supply across long product lifecycles.

Supply support for MC9S08GB60CFUER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08GB60CFUER belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control in harsh environments where robustness, debug accessibility, and analog integration are critical.

FAQ

What is the maximum operating frequency of the MC9S08GB60CFUER?

The MC9S08GB60CFUER supports a maximum bus frequency of 20 MHz, achieved via its internal clock generator (ICG) with FLL engaged in FEE mode using a 4 MHz external crystal. This frequency governs instruction execution speed, peripheral timing resolution, and maximum baud rates for SCI/SPI/I²C interfaces. The HCS08 core executes most instructions in 1–5 bus cycles, making 20 MHz the practical upper limit for deterministic real-time response in control loops.

Does the MC9S08GB60CFUER support in-circuit debugging?

Yes, the MC9S08GB60CFUER supports single-wire background debug mode (BDM) via the PTG0 pin, enabling full read/write access to memory and registers, real-time breakpoints, and flash programming without halting system operation. This capability is implemented in silicon and does not require external debug hardware beyond a BDM interface adapter. The MC9S08GB60CFUER's BDM implementation complies with Freescale's standard protocol and is supported by CodeWarrior Development Studio v5.1+.

What analog features are integrated into the MC9S08GB60CFUER?

The MC9S08GB60CFUER integrates a 10-bit successive approximation analog-to-digital converter (ATD) with 8 input channels mapped to Port B pins (PTB0–PTB7), programmable sample time, software/hardware triggering, and conversion completion interrupts. It also includes an internal 1.25 V bandgap reference and supports external reference inputs. No DAC or analog comparators are included - the ATD is the sole analog acquisition peripheral.

Is the MC9S08GB60CFUER pin-compatible with other HCS08 devices?

No, the MC9S08GB60CFUER is not universally pin-compatible across the HCS08 family. While it shares the same 48-pin QFN footprint with MC9S08GT60CFUE, differences exist in peripheral mapping - for example, SCI2 signals appear on PTC0/PTC1 in MC9S08GB60CFUER but on different pins in GT-series variants. Pin compatibility must be verified per specific variant using Table 2-2 in the MC9S08GB/GT Data Sheet Rev. 2.3.

What packaging and RoHS status does the MC9S08GB60CFUER have?

The MC9S08GB60CFUER is supplied in a 48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad and is RoHS-compliant per EU Directive 2011/65/EU. The "E" suffix in the part number confirms lead-free termination and green molding compound. Full compliance documentation, including substance declarations and test reports, is available through NXP's official product change notifications and material declarations portal.

MC9S08GB60CFUER Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08GB60CFUER FAQ

1.How can I place an order for MC9S08GB60CFUER through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08GB60CFUER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08GB60CFUER reliable?

The price and inventory of MC9S08GB60CFUER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08GB60CFUER is usually 5 days.

3.What payment methods are accepted for MC9S08GB60CFUER?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08GB60CFUER transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08GB60CFUER?

MC9S08GB60CFUER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08GB60CFUER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08GB60CFUER?

For technical support, including MC9S08GB60CFUER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GB60CFUER requirements.

6.How does Aetrix verify that MC9S08GB60CFUER is sourced from the original manufacturer or authorized distributors?

All MC9S08GB60CFUER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GB60CFUER meets industry standards.

7.What is the process for return or replacement of MC9S08GB60CFUER?

All MC9S08GB60CFUER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GB60CFUER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08GB60CFUER part is unused and in its original packaging.

Return procedure for MC9S08GB60CFUER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC9S08GB60CFUER Tags

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