NXP Semiconductors MC9S08GT16ACBE

Overview

MC9S08GT16ACBE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 2 KB RAM, 40-MHz CPU, 10-bit 8-channel ADC, dual SCI, SPI, I²C, and dual TPM timer/PWM modules. It operates from 1.8–3.6 V and targets low-power industrial control, sensor interfaces, and embedded appliance systems.

For engineers reviewing the MC9S08GT16ACBE datasheet, MC9S08GT16ACBE pinout, MC9S08GT16ACBE application, or MC9S08GT16ACBE equivalent, key selection criteria include its QFN-32 package, copper-wire bonded construction per 98ASA00473D, integrated real-time interrupt in all power modes, ±0.5% internal clock accuracy across voltage/temperature, and background debug via single-wire BDM interface.

Technical Context

The MC9S08GT16ACBE implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and hardware frequency-locked-loop (FLL) clock generation. Its memory subsystem includes Flash programmable down to 1.8 V and block protection with security features.

Peripherals include two serial communications interfaces (SCI), one SPI, one I²C, dual timer/PWM modules (TPM1 with 3 channels, TPM2 with 2 channels), 8-pin keyboard interrupt (KBI), and 8 high-current I/O pins (20 mA each). Power management supports three very low-power stop modes and a reduced-power wait mode.

Key Specifications

Pinout & Package

MC9S08GT16ACBE is housed in a 32-pin QFN package (exposed pad), per mechanical drawing 98ASA00473D, using copper wire bonding. The package measures 5 mm × 5 mm × 0.85 mm with 0.5-mm pitch and thermal pad for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08AC16CFUE, the MC9S08GT16ACBE offers smaller 32-pin QFN packaging and copper-wire bonding for improved thermal and mechanical reliability; versus S9S08SG16E2MTJR, it lacks extended temperature rating and newer ESD specs but maintains full toolchain compatibility with legacy CodeWarrior IDE and proven field reliability.

Availability

MC9S08GT16ACBE is available at Aetrix Electronics and suitable for industrial sensor nodes, smart appliance control, embedded metering interfaces, and legacy protocol converters requiring stable component supply and long-lifecycle support.

Supply support for MC9S08GT16ACBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08GT16ACBE belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control applications where Flash flexibility, debug accessibility, and mixed-signal integration are essential.

FAQ

What is the package type and mechanical specification for MC9S08GT16ACBE?

The MC9S08GT16ACBE uses a 32-pin QFN package with an exposed thermal pad, conforming to mechanical drawing 98ASA00473D. It measures 5 mm × 5 mm × 0.85 mm with 0.5-mm pitch and employs copper wire bonding - a migration from earlier gold-wire versions to improve thermal performance and reliability under thermal cycling stress. This package is RoHS-compliant and optimized for automated reflow assembly.

Does MC9S08GT16ACBE support in-circuit debugging, and what interface does it use?

Yes, the MC9S08GT16ACBE supports full in-circuit debugging via a single-wire background debug (BDM) interface. This interface enables breakpoint setting, real-time bus capture, and on-chip ICE with two comparators and nine trigger modes. The MC9S08GT16ACBE integrates an 8-deep FIFO for change-of-flow address storage, allowing deep code flow analysis without external probes - critical for validating timing-critical firmware in resource-constrained systems.

What clock sources and accuracy does MC9S08GT16ACBE provide internally?

The MC9S08GT16ACBE features an internal clock generator with frequency-locked-loop (FLL) architecture, supporting internal RC, external crystal (32 kHz or 1–20 MHz), or external clock inputs. Its internal trimmed oscillator achieves ±0.2% trimming resolution and ±0.5% deviation across voltage and temperature ranges - enabling accurate timing for UART baud rates, PWM frequencies, and RTI intervals without external precision components.

How many I/O pins does MC9S08GT16ACBE offer, and what are their drive capabilities?

The MC9S08GT16ACBE provides up to 38 general-purpose I/O pins plus one output-only pin, depending on package configuration; the 32-pin QFN variant (MC9S08GT16ACBE) allocates 28 usable I/O pins. Eight of these pins support 20-mA sink/source capability for direct LED or relay driving. All ports feature software-selectable internal pullups, slew rate control, and keyboard interrupt capability on Port A - reducing external component count in human-interface applications.

What power-saving modes are implemented in MC9S08GT16ACBE, and how does RTI function in them?

The MC9S08GT16ACBE implements three very low-power stop modes (Stop1/Stop2/Stop3), a reduced-power wait mode, and run mode. Its real-time interrupt (RTI) remains fully operational in all modes, generating wake-up events at programmable intervals (e.g., 1 ms to 1 s) without exiting low-power state. This allows the MC9S08GT16ACBE to maintain precise timing for sensor sampling or communication scheduling while consuming sub-µA current - ideal for battery-operated edge devices.