NXP Semiconductors MC9S08GT16ACFCER

Overview

MC9S08GT16ACFCER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 2 KB RAM, 40-MHz CPU, and integrated peripherals including dual SCI, SPI, I²C, 10-bit ADC, and dual TPM timer/PWM modules. It operates from 1.8–3.6 V and supports three low-power stop modes, making it suitable for battery-powered industrial sensors and motor control interfaces.

For engineers reviewing the MC9S08GT16ACFCER datasheet, MC9S08GT16ACFCER pinout, MC9S08GT16ACFCER application, or MC9S08GT16ACFCER equivalent, key selection criteria include QFN-32 package compatibility, internal FLL clock generation with ±0.5% accuracy across voltage/temperature, background debug interface support, and Flash security features for firmware protection in cost-sensitive embedded systems.

Technical Context

The MC9S08GT16ACFCER implements the HCS08 CPU core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and real-time interrupt capability active in run, wait, and stop modes. Its internal clock generator includes FLL with selectable reference sources (internal, crystal, resonator, or external clock) and ±0.2% trimming resolution.

Peripherals are tightly integrated: two serial communication interfaces (SCI1/SCI2), one SPI module, one I²C bus controller, eight-channel 10-bit ATD converter, and two timer/PWM modules (TPM1 with 3 channels, TPM2 with 2 channels). The device uses SuperFlash® technology enabling Flash read/program/erase down to 1.8 V.

Key Specifications

Pinout & Package

MC9S08GT16ACFCER is housed in a 32-pin QFN package (98ASA00473D) with exposed thermal pad, copper-wire interconnect, and 0.5 mm pitch. The package supports automated optical inspection and provides enhanced thermal performance over legacy gold-wire variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Compared with MC9S08GT16ACFCER, MC9S08AC16CFUE provides more I/O in a larger package but removes KBI functionality critical for keypad interfaces, while S9KEAZ128AMLH delivers significantly higher compute throughput and modern peripherals at the cost of architectural discontinuity and increased design effort.

Availability

MC9S08GT16ACFCER is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostat controllers, motor drive interfaces, and legacy equipment retrofit modules requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08GT16ACFCER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The HCS08 family-including MC9S08GT16ACFCER-was designed for cost-sensitive, low-power embedded control applications requiring robust debug capability, Flash security, and mixed-signal integration in compact packages.

FAQ

What is the package type and thermal pad configuration of the MC9S08GT16ACFCER?

The MC9S08GT16ACFCER uses a 32-pin QFN package (document number 98ASA00473D) with an exposed thermal pad on the bottom surface. This copper-wire interconnect variant replaces earlier gold-wire versions and requires solder paste stencil design per Freescale EB806 guidelines to ensure reliable thermal and electrical connection to the PCB ground plane. The thermal pad must be connected to a solid ground plane for optimal junction temperature control during sustained operation.

Does the MC9S08GT16ACFCER support in-system programming via its background debug interface?

Yes, the MC9S08GT16ACFCER supports full in-system programming and debugging through its single-wire BKGD/MS pin. Using standard BDM protocol, the MC9S08GT16ACFCER allows Flash erase, program, and verify operations without removing the device from the target board. Firmware updates can be performed in the field or during production test, and security bits can be set to prevent unauthorized access after programming.

What are the clock source options supported by the MC9S08GT16ACFCER's internal clock generator?

The MC9S08GT16ACFCER supports multiple clock sources via its internal clock generator (ICG): internal RC oscillator, external crystal (32 kHz–4 MHz), ceramic resonator, or external CMOS clock signal applied to EXTAL. The FLL can lock to any of these sources to generate precise bus frequencies up to 40 MHz. Trim registers allow calibration to ±0.2% resolution, achieving ±0.5% total deviation across voltage and temperature ranges.

How many analog input channels does the MC9S08GT16ACFCER's ADC support, and what is its resolution?

The MC9S08GT16ACFCER integrates an 8-channel, 10-bit successive-approximation analog-to-digital converter (ATD). All eight channels are mapped to Port B pins (PTB0–PTB7), and each channel supports programmable sample time and conversion trigger sources including software, TPM overflow, or external event. The ADC operates across the full 1.8–3.6 V supply range with typical INL of ±1 LSB.

Can the MC9S08GT16ACFCER operate reliably in low-power battery applications?

Yes, the MC9S08GT16ACFCER is optimized for low-power operation with three distinct stop modes: Stop1 (1.2 µA typical), Stop2 (0.7 µA), and Stop3 (0.36 µA), all retaining RAM contents and supporting wake-up via RTI, KBI, or external interrupt. Its Flash memory operates down to 1.8 V, and the real-time interrupt module functions in all stop modes, enabling precise, ultra-low-power periodic wake-up for sensor sampling or communication tasks.