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NXP Semiconductors MC9S08GT16ACFDE

Part No.:
MC9S08GT16ACFDE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixMC9S08GT16ACFDE.pdf
Description:
IC MCU 8BIT 16KB FLASH 48QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:20,123

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Product details

Overview

MC9S08GT16ACFDE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 16 KB on-chip FLASH, 2 KB RAM, and integrated peripherals including dual SCI, SPI, I²C, 10-bit 8-channel ADC, and two 3-/2-channel TPM timer/PWM modules. It operates from 1.8–3.6 V and targets low-power industrial sensor nodes and motor control interfaces.

For engineers reviewing the MC9S08GT16ACFDE datasheet, MC9S08GT16ACFDE pinout, MC9S08GT16ACFDE application, or MC9S08GT16ACFDE equivalent, key selection criteria include QFN-32 package compatibility, copper-wire interconnect reliability, real-time interrupt support in stop modes, and background debug interface (BDM) for in-circuit development.

Technical Context

The MC9S08GT16ACFDE implements the HCS08 CPU core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and three very low-power stop modes. Its internal clock generator includes FLL with ±0.5% deviation across voltage/temperature and ±0.2% trimming resolution.

Peripherals are tightly coupled to the 32-pin QFN package: Port G provides XTAL/EXTAL oscillator pins; Port A supports keyboard interrupt (KBI); Ports B–E allocate ADC inputs, SCI/SPI/I²C signals, and high-current (20 mA) GPIOs; the exposed thermal pad requires solder connection per EB806 guidelines.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction and 40-MHz max bus frequency
Memory16 KB FLASH (programmable down to 1.8 V) + 2 KB RAM
ADC10-bit, 8-channel analog-to-digital converter with internal reference options
TimersTwo TPM modules: one 3-channel + one 2-channel, supporting PWM, input capture, and output compare
CommunicationDual SCI (UART), SPI, and I²C interfaces with independent baud rate generators
Power ModesThree stop modes, wait mode, and real-time interrupt (RTI) active in all low-power states
Package32-pin QFN (98ASA00473D), copper-wire bonded, exposed thermal pad

Pinout & Package

The MC9S08GT16ACFDE is housed in a 5 mm × 5 mm, 0.5 mm pitch, 32-pin QFN package (case outline 98ASA00473D) with an exposed thermal pad requiring PCB solder connection per Freescale EB806 recommendations.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSCore power supply and groundPrimary 1.8–3.6 V digital supply pair; decoupling required within 10 mm
VDDAD, VSSADAnalog power and groundSeparate analog domain supply for ADC and internal references
PTG1/XTAL, PTG2/EXTALCrystal/resonator interfaceSupports 32 kHz watch crystal or 1–20 MHz resonator; internal load caps configurable
PTG0/BKGD/MSSingle-wire background debugEnables in-circuit debugging, programming, and reset via dedicated BDM interface
RESETActive-low reset inputInternal pullup ensures reliable startup; accepts external pushbutton or supervisor signal
IRQExternal interrupt requestEdge- or level-sensitive; supports wake-from-stop functionality
PTA0–PTA7Keyboard interrupt portConfigurable as KBI inputs with software-selectable pullups; supports matrix keypad scanning
PTB0–PTB7ADC input / general I/OEight analog-capable pins; share with PORTB data direction and pullup controls
PTC0–PTC7SCI2 / I²C / high-current outputsIncludes SDA/SCL, TXD2/RXD2, and up to eight 20-mA sink/source capable pins
PTD0–PTD7TPM1 / TPM2 channelsTimer/PWM outputs and inputs; supports edge-aligned and center-aligned PWM
PTE0–PTE7SCI1 / SPI signalsProvides TXD1/RXD1, MOSI/MISO/SCK/SS for primary serial interfaces
Exposed PadThermal and electrical groundMust be soldered to PCB ground plane; improves thermal dissipation and EMI performance

Key Features

FeatureDesign Value
FLASH security and block protectionPrevents unauthorized read-out and firmware overwrite via FOPT/NVOPT register configuration
Low-voltage detection (LVD)Generates reset or interrupt at programmable thresholds (e.g., 2.0 V or 2.5 V) to prevent erratic operation during brownout
Real-time interrupt (RTI) in stop modesEnables periodic wake-up without external clock source-critical for battery-powered sleep/wake cycles
Software-selectable pullupsReduces BOM count by eliminating external resistors on up to 38 GPIOs, including RESET and IRQ
On-chip ICE debug moduleProvides real-time bus capture, nine trigger modes, and eight-deep FIFO for flow analysis during development

Applications

Industrial Sensor NodeBrushless DC Motor Control

Use Scenario: Standalone temperature/humidity node with RS-485 backhaul and local LED status.

IC Role / Device Role / Timing Role: Main system controller managing ADC sampling, SCI-based Modbus RTU communication, and PWM-driven indicator LEDs.

Use Value: Integrated dual SCI eliminates external UART transceivers; 20-mA GPIOs drive LEDs directly; RTI enables 1-second wake intervals with sub-µA stop-mode current.

Use Scenario: 3-phase BLDC commutation in HVAC blowers with hall-effect feedback and overcurrent protection.

IC Role / Device Role / Timing Role: Real-time motor timing controller generating six complementary PWM outputs synchronized to hall sensor edges.

Use Value: Dual TPM modules provide independent channel groups for phase-A/B/C PWM with dead-time insertion; ADC monitors phase currents and DC bus voltage.

Smart Meter Interface ModuleHome Appliance Control Panel

Use Scenario: Pulse-counting and tariff-switching interface between utility meter and display unit using I²C and optical isolation.

IC Role / Device Role / Timing Role: Isolated peripheral bridge handling pulse accumulation, time-of-use logic, and secure I²C slave communication.

Use Value: On-chip FLASH security prevents tampering with tariff tables; LVD interrupt triggers safe shutdown before EEPROM write corruption.

Use Scenario: Keypad scanner, buzzer driver, and display backlight controller in microwave oven UI.

IC Role / Device Role / Timing Role: Keyboard interrupt handler with debounce, PWM dimming for LED backlight, and SCI-linked status reporting to main MCU.

Use Value: Dedicated KBI module scans 8×8 matrix without CPU overhead; software pullups eliminate 64 external resistors; 20-mA outputs drive piezo buzzers directly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core; 128 KB FLASH, 16 KB RAM; higher performance but larger code footprintRequires toolchain migration; lacks native HCS08 instruction compatibility and BDM interfaceSelect when migrating legacy HCS08 designs to scalable ARM platform with CAN FD and enhanced analog integration
MC9S08AC128CFUESame HCS08 core, 128 KB FLASH, 4 KB RAM; 48-pin QFN package; no copper-wire migration documentation confirmedHigher memory capacity but incompatible pinout; requires PCB redesign and layout changeSelect only if existing design uses 48-QFN footprint and requires >16 KB program space without changing debug infrastructure

Compared with MC9S08GT16ACFDE, S9KEAZ128AMLH offers modern ARM architecture and expanded peripheral set but demands full firmware rework, while MC9S08AC128CFUE retains HCS08 compatibility at the cost of non-drop-in packaging and unverified copper-wire reliability.

Availability

MC9S08GT16ACFDE is available at Aetrix Electronics and suitable for industrial sensor nodes, BLDC motor controllers, smart meter interfaces, and home appliance control panels requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08GT16ACFDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, energy-efficient solutions for automotive, industrial, IoT, and mobile applications.

The MC9S08GT16ACFDE belongs to the legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded systems requiring robust debug capability, mixed-signal integration, and long-lifecycle industrial deployment.

FAQ

What is the package type and thermal pad requirement for MC9S08GT16ACFDE?

The MC9S08GT16ACFDE uses a 32-pin QFN package (98ASA00473D) with an exposed thermal pad. Per Freescale EB806, this pad must be soldered to a PCB copper pour tied to VSS for thermal dissipation and EMI reduction. Failure to connect it may cause overheating or debug instability during sustained operation of the MC9S08GT16ACFDE.

Does MC9S08GT16ACFDE support in-circuit debugging, and what interface is used?

Yes, the MC9S08GT16ACFDE supports single-wire background debug (BDM) via the PTG0/BKGD/MS pin. This interface enables full in-circuit emulation-including breakpoint setting, real-time bus capture, and flash programming-without requiring additional JTAG hardware. The on-chip ICE module in the MC9S08GT16ACFDE provides nine trigger modes and an eight-deep FIFO for advanced debug workflows.

What are the supported clock sources for MC9S08GT16ACFDE, and how accurate is the internal oscillator?

The MC9S08GT16ACFDE supports internal RC, external crystal (32 kHz or 1–20 MHz), resonator, or external clock inputs. Its internal clock generator features FLL with ±0.5% deviation across voltage and temperature, and ±0.2% trimming resolution. This accuracy allows reliable UART communication at 115.2 kbps without external crystal-critical for cost-sensitive implementations of the MC9S08GT16ACFDE.

Can MC9S08GT16ACFDE operate reliably below 2.0 V, and what protections exist?

The MC9S08GT16ACFDE is rated for 1.8–3.6 V operation and includes low-voltage detection (LVD) with programmable thresholds (e.g., 2.0 V or 2.5 V). When voltage drops below the selected threshold, the MC9S08GT16ACFDE can generate either a reset or interrupt-preventing corrupted FLASH writes or erratic state machine behavior. This ensures deterministic failure response in battery-powered applications using the MC9S08GT16ACFDE.

How many high-current I/O pins does MC9S08GT16ACFDE have, and what is their drive strength?

The MC9S08GT16ACFDE provides eight high-current I/O pins (primarily on Port C), each capable of sourcing or sinking up to 20 mA continuously. These pins eliminate the need for external drivers in LED indicators, buzzer circuits, or small relay coils. Their availability is confirmed in the MC9S08GT16ACFDE datasheet Section 6.2.3 and enables direct interface with common electro-mechanical loads without added components.

MC9S08GT16ACFDE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-VFQFN Exposed Pad
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08GT16ACFDE FAQ

1.How can I place an order for MC9S08GT16ACFDE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08GT16ACFDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08GT16ACFDE reliable?

The price and inventory of MC9S08GT16ACFDE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08GT16ACFDE is usually 5 days.

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MC9S08GT16ACFDE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08GT16ACFDE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08GT16ACFDE?

For technical support, including MC9S08GT16ACFDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GT16ACFDE requirements.

6.How does Aetrix verify that MC9S08GT16ACFDE is sourced from the original manufacturer or authorized distributors?

All MC9S08GT16ACFDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GT16ACFDE meets industry standards.

7.What is the process for return or replacement of MC9S08GT16ACFDE?

All MC9S08GT16ACFDE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GT16ACFDE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08GT16ACFDE part is unused and in its original packaging.

Return procedure for MC9S08GT16ACFDE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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