NXP Semiconductors MC9S08GT16ACFDER
- Part No.:
- MC9S08GT16ACFDER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC9S08GT16ACFDER.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 48QFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,420
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC9S08GT16ACFDER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring a 40-MHz CPU, 16 KB on-chip FLASH, 2 KB RAM, and integrated peripherals including dual SCI, SPI, I²C, 10-bit ATD, and dual TPM timer/PWM modules. It operates from 1.8–3.6 V and supports three low-power stop modes - used in industrial sensor nodes, motor control interfaces, and battery-powered metering systems.
For engineers reviewing the MC9S08GT16ACFDER datasheet, MC9S08GT16ACFDER pinout, MC9S08GT16ACFDER application, or MC9S08GT16ACFDER equivalent, key selection criteria include its 32-pin QFN package with exposed thermal pad, single-wire background debug interface, internal FLL clock generator with ±0.5% accuracy across voltage/temperature, and FLASH security block protection for firmware IP protection.
Technical Context
The MC9S08GT16ACFDER implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and real-time interrupt (RTI) capability active in run, wait, and stop modes. Its internal clock generator (ICG) provides multiple operating modes - FEI, FEE, FBE - with frequency-locked-loop (FLL) engagement using internal or external crystal/resonator sources.
Peripherals are memory-mapped and share bus arbitration via the on-chip crossbar switch. The dual TPM modules deliver flexible PWM generation (3-channel + 2-channel), while the 8-channel 10-bit ATD supports software-triggered and hardware-synchronized conversions with configurable sample time and reference selection (VREFH/VREFL).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz max bus frequency and BGND instruction for BDM debugging |
| Memory | 16 KB FLASH (programmable down to 1.8 V) + 2 KB RAM; supports block protection and security lock |
| Analog-to-Digital | 10-bit ATD with 8 input channels, programmable sample time, and selectable VREFH/VREFL references |
| Timers | Dual Timer/PWM modules: one 3-channel TPM and one 2-channel TPM, supporting edge-aligned and center-aligned PWM |
| Communication | Two SCI modules (UART), one SPI, one I²C bus interface - all independently clocked and interrupt-capable |
| Power Management | Three stop modes (Stop1/Stop2/Stop3), reduced-power wait mode, and RTI wake-up from all low-power states |
| Debug Interface | Single-wire background debug (BDM) with on-chip ICE module, two comparators, nine trigger modes, and 8-deep FIFO |
Pinout & Package
MC9S08GT16ACFDER is housed in a 32-pin QFN package (98ASA00473D) with 5 mm × 5 mm footprint, 0.5 mm pitch, and exposed thermal pad (EPAD) for enhanced thermal dissipation. Pinout conforms to Freescale's MC9S08GT16A series mechanical drawing and electrical pin assignment per Rev. 1 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Primary 1.8–3.6 V digital supply pair; decoupling required within 10 mm of pins |
| VDDAD, VSSAD | Analog power and ground | Separate analog domain supply for ATD and internal references; must be filtered independently |
| VREFH, VREFL | ATD reference inputs | Configurable high/low reference pair for 10-bit ADC; can be tied to VDDAD/VSSAD or external sources |
| PTG1/XTAL, PTG2/EXTAL | Crystal/resonator interface | Supports 32 kHz watch crystal or 1–20 MHz resonator; internal load caps configurable via register |
| RESET | Active-low reset input | Internal pullup enabled; accepts external push-pull or open-drain assertion; triggers cold/warm reset sequence |
| BKGD/MS | Background debug and mode select | Single-wire BDM communication channel; also selects boot mode (internal FLASH vs. ROM vector table) |
| IRQ | External interrupt request | Edge- or level-sensitive interrupt source; internal pullup enabled by default; masks other interrupts during service |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with keyboard interrupt (KBI) capability; each pin supports software-selectable pullups |
| PTB0–PTB7 | Port B general-purpose I/O / ATD inputs | 8-bit port with alternate ATD channel mapping (AN0–AN7); supports analog input and digital I/O |
| PTC0–PTC7 | Port C general-purpose I/O / peripheral functions | 8-bit port with SCI2, I²C, and high-current driver (20 mA) capability on selected pins |
| PTD0–PTD7 | Port D general-purpose I/O / TPM1/TPM2 | 8-bit port with dual TPM channel mapping (CH0–CH4); supports PWM output and input capture |
| PTE0–PTE7 | Port E general-purpose I/O / SCI1/SPI | 8-bit port with SCI1 TX/RX and SPI MOSI/MISO/SCK mapping; supports synchronous serial communication |
| PTG0 | Port G bit 0 / BKGD/MS | Shared with background debug signal; configured as I/O only when BDM disabled in normal operation |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Security & Protection | Programmable block protection and full FLASH security lock prevent unauthorized read-out or reprogramming |
| Low-Voltage Detection (LVD) | Configurable LVD threshold (1.9–2.7 V) with reset or interrupt output - enables safe brownout recovery |
| Internal Clock Generator (ICG) | FLL-based clock synthesis with ±0.2% trimming resolution and ±0.5% deviation over voltage/temperature range |
| High-Current I/O Pins | Eight pins rated for 20 mA sink/source - eliminate external drivers in LED or relay interface applications |
| Real-Time Interrupt (RTI) | Free-running 16-bit counter with programmable period (0.125–512 ms) - enables precise wake-up timing from stop modes |
| On-Chip Debug Module | Two hardware breakpoints, real-time bus capture, and event-triggered trace storage - reduces debug cycle time |
Applications
| Industrial Sensor Node | Smart Meter Interface |
|---|---|
|
Use Scenario: Standalone temperature/humidity node with RS-485 backhaul and local LCD display. IC Role / Device Role / Timing Role: Main system controller managing ATD sampling, SCI-driven Modbus RTU protocol, and low-power sleep scheduling. Use Value: Integrated dual SCI and RTI enable reliable periodic wake-up and data transmission without external timing components. |
Use Scenario: Electricity meter front-end handling pulse counting, tariff switching, and tamper detection. IC Role / Device Role / Timing Role: Real-time event processor interfacing with optical coupler inputs, EEPROM, and IR/RF communication stack. Use Value: 20 mA I/O pins drive opto-isolators directly; FLASH security prevents firmware tampering in revenue-critical devices. |
| Brushless DC Motor Control | Home Appliance UI Controller |
|
Use Scenario: 3-phase BLDC commutation board with Hall-effect feedback and PWM-driven gate drivers. IC Role / Device Role / Timing Role: Timing-critical PWM generator synchronizing six-step commutation with Hall sensor edges. Use Value: Dual TPM modules provide independent 3-channel and 2-channel PWM outputs with dead-time insertion support. |
Use Scenario: Microwave oven control panel with keypad scan, buzzer, display backlight, and safety interlock monitoring. IC Role / Device Role / Timing Role: Human interface manager handling KBI scanning, PWM dimming, and fault-safe shutdown logic. Use Value: Keyboard interrupt module scans 8-key matrix without CPU polling; internal pullups reduce BOM count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9KEAZ128AMLH | ARM Cortex-M0+ core, 48 MHz, 128 KB FLASH, 16 KB RAM; lacks KBI but adds USB and CAN | Requires firmware rewrite; better suited for USB-connected appliances or CAN-based building automation | Select when migrating to ARM ecosystem or requiring USB/CAN - not drop-in compatible |
| MC9S08AC128CFUE | Same HCS08 core, 128 KB FLASH, 8 KB RAM, 48-pin QFN; identical peripheral set but larger memory and package | Direct pin-compatible upgrade path; retains same debug interface, clock architecture, and I/O structure | Choose for higher code footprint or future-proofing where PCB layout allows 48-pin QFN |
Compared with MC9S08GT16ACFDER, S9KEAZ128AMLH offers modern ARM performance and connectivity at the cost of architectural discontinuity, while MC9S08AC128CFUE delivers seamless scalability within the HCS08 family - preserving toolchain, debug workflow, and peripheral register compatibility.
Availability
MC9S08GT16ACFDER is available at Aetrix Electronics and suitable for industrial sensor nodes, smart meter interfaces, and BLDC motor control applications requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for MC9S08GT16ACFDER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.
The MC9S08GT16ACFDER belongs to the legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control in industrial and consumer equipment where deterministic real-time response and debug reliability are critical.
FAQ
What is the package type and thermal pad configuration of the MC9S08GT16ACFDER?
The MC9S08GT16ACFDER uses a 32-pin QFN package (98ASA00473D) measuring 5 mm × 5 mm with 0.5 mm pitch and an exposed thermal pad (EPAD) centered on the bottom. This EPAD must be soldered to a thermally conductive PCB copper area for effective heat dissipation and optimal electrical noise immunity - recommended via at least nine thermal vias to inner ground planes.
Does the MC9S08GT16ACFDER support in-circuit debugging, and what interface does it use?
Yes, the MC9S08GT16ACFDER supports full in-circuit debugging via a single-wire background debug (BDM) interface using the BKGD/MS pin. It includes an on-chip debug module with two hardware breakpoints, real-time bus capture, and eight-deep FIFO for change-of-flow tracing - enabling non-intrusive code inspection and real-time variable monitoring without halting execution.
What are the supported clock sources and accuracy specifications for the MC9S08GT16ACFDER?
The MC9S08GT16ACFDER supports internal RC, external crystal (32 kHz or 1–20 MHz), resonator, or external clock input. Its internal clock generator features an FLL with ±0.2% trimming resolution and maintains ±0.5% frequency accuracy across the full 1.8–3.6 V supply range and –40°C to +105°C temperature range - verified per Freescale MC9S08GT16A Rev. 1 datasheet Section 9.1.1.
Can the MC9S08GT16ACFDER operate reliably at 1.8 V, and which peripherals remain functional?
Yes, the MC9S08GT16ACFDER guarantees full functionality - including FLASH programming/erasing, ATD conversion, and all communication peripherals (SCI, SPI, I²C) - down to 1.8 V. Its low-voltage detection (LVD) circuit remains operational across this range, and all three stop modes retain wake-up capability via RTI or external IRQ, making it suitable for primary-cell battery applications.
How many I/O pins with 20 mA drive capability does the MC9S08GT16ACFDER provide, and which ports are they assigned to?
The MC9S08GT16ACFDER provides eight high-current I/O pins, each capable of sourcing or sinking up to 20 mA. These are assigned to Port C (PTC0–PTC7) as defined in the MC9S08GT16A Rev. 1 datasheet Section 6.2.3 - enabling direct driving of LEDs, small relays, or optocouplers without external buffer transistors.
MC9S08GT16ACFDER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08GT16ACFDER FAQ
1.How can I place an order for MC9S08GT16ACFDER through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08GT16ACFDER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08GT16ACFDER reliable?
The price and inventory of MC9S08GT16ACFDER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08GT16ACFDER is usually 5 days.
3.What payment methods are accepted for MC9S08GT16ACFDER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08GT16ACFDER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC9S08GT16ACFDER?
MC9S08GT16ACFDER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08GT16ACFDER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08GT16ACFDER?
For technical support, including MC9S08GT16ACFDER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GT16ACFDER requirements.
6.How does Aetrix verify that MC9S08GT16ACFDER is sourced from the original manufacturer or authorized distributors?
All MC9S08GT16ACFDER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GT16ACFDER meets industry standards.
7.What is the process for return or replacement of MC9S08GT16ACFDER?
All MC9S08GT16ACFDER units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GT16ACFDER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08GT16ACFDER part is unused and in its original packaging.
Return procedure for MC9S08GT16ACFDER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC9S08GT16ACFDER Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

