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NXP Semiconductors MC9S08GT16CFBE

Part No.:
MC9S08GT16CFBE
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
44-QFP
Datasheet:
AetrixMC9S08GT16CFBE.pdf
Description:
IC MCU 8BIT 16KB FLASH 44QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,321

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Product details

Overview

MC9S08GT16CFBE from NXP (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB Flash, 1 KB RAM, and integrated peripherals including SCI, SPI, I²C, TPM, ATD, and KBI. It operates at up to 40 MHz bus frequency, supports FLL-based clock generation, and targets cost-sensitive embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the MC9S08GT16CFBE datasheet, MC9S08GT16CFBE pinout, MC9S08GT16CFBE application, or MC9S08GT16CFBE equivalent, key selection criteria include its 48-pin QFN package, 16 KB Flash/1 KB RAM memory map, FBE/FEE/FEI clock mode flexibility, 10-bit ATD with 8 channels, and background debug interface support.

Technical Context

The MC9S08GT16CFBE implements the HCS08 CPU core with 16-bit index register, 8-bit accumulator, and 5-cycle MOV instruction. Its Internal Clock Generator (ICG) supports multiple modes-FLL Bypassed External (FBE), FLL Engaged External (FEE), and FLL Engaged Internal (FEI)-enabling precise bus frequency derivation from external crystals (e.g., 32 kHz or 4 MHz) or internal reference.

Peripherals include a 10-bit Analog-to-Digital Converter (ATD) with 8 input channels and configurable sample time, two Timer/PWM modules (TPM1 and TPM2) supporting input capture, output compare, and edge-aligned PWM, plus dual serial interfaces: one SCI (UART) and one SPI, alongside I²C for multi-master communication.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS08 8-bit CPU with 16-bit index register and 5-cycle MOV instruction
Flash Memory16 KB on-chip Flash with block protection, 47 µs typical program time per word
RAM Size1 KB on-chip RAM, accessible in all operating modes including Stop
Bus FrequencyUp to 40 MHz (FEE mode with 4 MHz crystal × 10), or 4.19 MHz (FBE mode with 32 kHz crystal)
ADC Resolution10-bit ATD with 8 analog inputs, programmable conversion time (2–21 µs)
Timer ModulesTwo TPM modules: TPM1 (6-channel) and TPM2 (2-channel), supporting PWM, input capture, and output compare
Serial InterfacesOne SCI (UART), one SPI, one I²C - all independently clocked and interrupt-capable

Pinout & Package

MC9S08GT16CFBE is housed in a 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined across Ports A–G, supporting multiplexed peripheral signals including BKGD/MS, SCI1/SCI2, SPI, I²C, TPM channels, ATD inputs, and KBI.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 2.7–5.5 V supply pins; separate analog/digital ground not implemented - shared VSS
PTA0–PTA7Port A I/O with KBI8-bit general-purpose port; PTA0–PTA3 double as Keyboard Interrupt inputs
PTB0–PTB7Port B I/O with ATD8-bit port; PTB0–PTB7 serve as ATD0–ATD7 analog inputs
PTC0–PTC7Port C I/O with SCI2/IIC8-bit port; PTC0/PTC1 = SCI2 TX/RX; PTC6/PTC7 = I²C SCL/SDA
PTD0–PTD7Port D I/O with TPM18-bit port; PTD0–PTD5 = TPM1 CH0–CH5; PTD6/PTD7 = RESET/IRQ
PTE0–PTE7Port E I/O with SCI1/SPI8-bit port; PTE0/PTE1 = SCI1 TX/RX; PTE2–PTE4 = SPI MOSI/MISO/SCK
PTF0–PTF7Port F I/O with high-current drivers8-bit port; PTF0–PTF3 support 20 mA sink capability for LED/relay drive
PTG0Background Debug / Mode SelectSingle-wire BDM interface pin; also used for mode selection during reset
EXTAL/XTALCrystal oscillator terminalsSupports 32 kHz watch crystal or 1–8 MHz parallel-resonant crystal

Key Features

FeatureDesign Value
FLL-based clock generationEnables stable 40 MHz bus clock from low-cost 4 MHz crystal, reducing external timing component count
Background Debug Module (BDM)Single-pin (PTG0) debug interface supporting full-speed execution, breakpoints, and memory access without halting real-time operation
Low-voltage detection (LVD)Configurable trip points (2.5 V, 2.7 V, 3.0 V, 3.3 V) with reset or interrupt output to prevent erratic behavior during brownout
Flash security and protectionProgrammable flash block protection (FPROT) and security byte (FOPT) prevent unauthorized read/write access to firmware
Stop mode power consumption1.5 µA typical current draw in Stop3 mode with RTI enabled, enabling battery-powered sleep operation

Applications

Automotive Body ControlIndustrial Sensor Node

Use Scenario: Central body controller managing door locks, window lifts, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Main system MCU executing CAN-adjacent logic, driving discrete loads via PTF high-current outputs, and sampling switch states via KBI.

Use Value: Integrated 16 KB Flash stores vehicle-specific configuration; FBE mode ensures reliable startup from 32 kHz crystal during cold cranking.

Use Scenario: Battery-powered temperature/humidity sensor node transmitting data over UART to gateway.

IC Role / Device Role / Timing Role: System-on-chip controller acquiring analog sensor data via ATD, formatting packets in RAM, and transmitting via SCI1.

Use Value: 1.5 µA Stop3 current extends 10-year battery life; internal FLL eliminates need for second crystal, reducing BOM cost.

Smart Appliance UILED Lighting Controller

Use Scenario: Keypad and display driver in washing machine control panel with touch feedback.

IC Role / Device Role / Timing Role: KBI-scan MCU detecting matrix keypad presses while running real-time LED indicators via TPM PWM.

Use Value: PTA0–PTA3 KBI inputs enable low-power wake-on-keypress; TPM2 generates precise 1 kHz dimming waveform for status LEDs.

Use Scenario: Constant-current LED driver for architectural lighting with thermal foldback.

IC Role / Device Role / Timing Role: Closed-loop controller reading thermistor via ATD, adjusting PWM duty cycle via TPM1 to regulate LED current.

Use Value: 10-bit ATD resolution enables ±1°C thermal sensing; 6-channel TPM1 supports independent dimming of RGB+white channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08AC128CPJ128 KB Flash, 8 KB RAM, same HCS08 core but higher memory density and enhanced I/O drive strengthTargeted at more complex control tasks requiring larger code footprint and higher current outputsSelect when >16 KB Flash or >1 KB RAM is required; shares same toolchain and peripheral register map
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, 48 MHz max, native USB and CANDesigned for next-generation designs needing protocol stack support (USB/CAN) and higher compute throughputChoose for migration path beyond 8-bit constraints; requires toolchain and firmware rearchitecture

Compared with MC9S08AC128CPJ and S9KEAZ128AMLH, the MC9S08GT16CFBE offers optimal balance of cost, power efficiency, and peripheral integration for legacy-compatible, resource-constrained embedded control - especially where BDM debug, low-stop-current, and crystal-flexible clocking are critical.

Availability

MC9S08GT16CFBE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance UIs, and LED lighting controllers requiring stable component supply and long-term lifecycle support.

Supply support for MC9S08GT16CFBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The MC9S08GT16CFBE belongs to the HCS08 microcontroller family, designed specifically for cost-sensitive, low-power embedded control in automotive body electronics and industrial automation systems.

FAQ

What is the maximum bus frequency supported by the MC9S08GT16CFBE?

The MC9S08GT16CFBE supports a maximum bus frequency of 40 MHz when operating in FLL Engaged External (FEE) mode using a 4 MHz crystal and FLL multiplication factor of 10. In FLL Bypassed External (FBE) mode with a 32 kHz crystal, the bus frequency is fixed at 4.194304 MHz. These values are confirmed in Section 7.3.4 and Table A-9 of the MC9S08GB/GT Data Sheet Rev. 2.3.

Does the MC9S08GT16CFBE include hardware debug capability?

Yes, the MC9S08GT16CFBE integrates a Background Debug Module (BDM) accessible via the PTG0 pin. This single-wire interface supports full-speed execution, breakpoint setting, memory inspection, and register read/write without halting real-time peripheral operation - essential for development and field diagnostics of the MC9S08GT16CFBE.

What ADC resolution and channel count does the MC9S08GT16CFBE provide?

The MC9S08GT16CFBE features a 10-bit Analog-to-Digital Converter (ATD) with 8 input channels (ATD0–ATD7), mapped directly to Port B pins PTA0–PTA7. Conversion time is programmable between 2 µs and 21 µs, and the module supports both single-ended and differential input modes as documented in Chapter 14 of the MC9S08GB/GT Data Sheet.

Which package type is used for the MC9S08GT16CFBE?

The MC9S08GT16CFBE uses a 48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad, designated as "QFN48" in Freescale's ordering information (Appendix B). This package is explicitly listed for the MC9S08GT16 variant in Revision 2.2 of the MC9S08GB/GT Data Sheet.

Can the MC9S08GT16CFBE operate from a 32 kHz watch crystal?

Yes, the MC9S08GT16CFBE supports 32 kHz crystal operation in FLL Bypassed External (FBE) mode, delivering a precise 4.194304 MHz bus clock. This configuration is validated in Example #1 (Section 7.4.2) of the MC9S08GB/GT Data Sheet Rev. 2.3 and enables low-power, high-accuracy timing for RTC and sleep-mode wake-up in the MC9S08GT16CFBE.

MC9S08GT16CFBE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
44-QFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08GT16CFBE FAQ

1.How can I place an order for MC9S08GT16CFBE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08GT16CFBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08GT16CFBE reliable?

The price and inventory of MC9S08GT16CFBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08GT16CFBE is usually 5 days.

3.What payment methods are accepted for MC9S08GT16CFBE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08GT16CFBE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC9S08GT16CFBE?

MC9S08GT16CFBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08GT16CFBE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08GT16CFBE?

For technical support, including MC9S08GT16CFBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GT16CFBE requirements.

6.How does Aetrix verify that MC9S08GT16CFBE is sourced from the original manufacturer or authorized distributors?

All MC9S08GT16CFBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GT16CFBE meets industry standards.

7.What is the process for return or replacement of MC9S08GT16CFBE?

All MC9S08GT16CFBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GT16CFBE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08GT16CFBE part is unused and in its original packaging.

Return procedure for MC9S08GT16CFBE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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