NXP Semiconductors MC9S08GT32ACFDE
- Part No.:
- MC9S08GT32ACFDE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC9S08GT32ACFDE.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 48QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08GT32ACFDE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 core microcontroller with 32 KB on-chip Flash, 2 KB RAM, and integrated peripherals including SCI, SPI, I²C, TPM timers, ADC, and keyboard interrupt module. It operates at up to 40 MHz bus frequency using internal or external clock sources and targets cost-sensitive embedded control applications such as motor control, appliance interfaces, and industrial sensors.
For engineers reviewing the MC9S08GT32ACFDE datasheet, MC9S08GT32ACFDE pinout, MC9S08GT32ACFDE application, or MC9S08GT32ACFDE equivalent, key selection criteria include its QFN-48 package, 32 KB Flash with block protection, 10-bit 16-channel ADC, dual TPM modules supporting PWM and input capture, and support for BDM debug interface - all validated in the MC9S08GB60A/GTxxA family datasheet Rev. 2 (2008).
Technical Context
The MC9S08GT32ACFDE implements the S08CPUV2 core with 16-bit index register, 8-bit accumulator, and condition code register, executing instructions in single-cycle (most) or two-cycle (branch) timing. Its internal clock generator (S08ICGV2) supports multiple modes: FEI (FLL-engaged internal), FBE (FLL-bypassed external), and FEE (FLL-engaged external), enabling flexible clock source selection from 32 kHz crystals to 4 MHz resonators with bus frequencies up to 40 MHz.
Peripheral integration includes two asynchronous serial interfaces (SCI1/SCI2), one synchronous serial interface (SPI), one I²C controller (S08IICV1), two timer/PWM modules (TPM1/TPM2) each with six channels, a 10-bit 16-input ADC (S08ATDV3), and a dedicated keyboard interrupt module (S08KBIV1) with programmable edge/level sensitivity on Port A pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU with S08CPUV2 architecture, 16-bit index register, and 8-bit accumulator |
| Flash Memory | 32 KB on-chip Flash with block protection, 512-byte sector erase, and burst programming capability |
| RAM | 2 KB on-chip RAM with read/write access during all operating modes except Stop3 |
| ADC | 10-bit successive-approximation ADC with 16 input channels, software/hardware trigger, and configurable sample time |
| Timers | Two TPM modules (TPM1 & TPM2), each with six 16-bit channels supporting input capture, output compare, and edge-aligned PWM |
| Clock System | Internal clock generator (S08ICGV2) supporting FEI/FBE/FEE modes; max bus frequency 40 MHz with external crystal/resonator |
| I/O Pins | 42 general-purpose I/O pins across Ports A–G, with programmable pullups, slew rate control, and keyboard interrupt capability on Port A |
Pinout & Package
MC9S08GT32ACFDE is housed in a 48-pin QFN package (98ASA00466D) with 0.5 mm pitch and exposed thermal pad. The package supports copper-wire bonding per Freescale QFN Addendum Rev. 0 (2014).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 2.7–5.5 V supply rails; separate analog/digital ground connections required for ADC accuracy |
| EXTAL / XTAL | Crystal/resonator interface | Supports 32 kHz watch crystal or 1–4 MHz resonator; internal load capacitors configurable via ICGTRM register |
| PTA0–PTA7 | Port A I/O with KBI | Configurable as GPIO or keyboard interrupt inputs with edge/level detection; used for matrix keypad scanning |
| PTB0–PTB7 | Port B I/O with ADC inputs | Eight analog inputs for 10-bit ADC; also support digital I/O and interrupt capability |
| PTC0–PTC7 | Port C I/O with SCI2/I²C | SCI2 transmit/receive and I²C SDA/SCL functions multiplexed; high-current drive capability for LED control |
| PTD0–PTD7 | Port D I/O with TPM1/TPM2 | TPM channel I/O for PWM output, input capture, and quadrature decoding; supports complementary outputs |
| PTE0–PTE3 | Port E I/O with SCI1/SPI | SCI1 TX/RX and SPI MOSI/MISO/SCK/SS functions; full-duplex serial communication support |
| PTF0–PTF3 | Port F I/O with high-current drivers | 40 mA sink/source per pin; suitable for direct LED or relay driver interfacing without external buffers |
| PTG0 | BKGD/MS | Background debug mode entry and mode select; active-low open-drain for BDM communication |
Key Features
| Feature | Design Value |
|---|---|
| Flash security and protection | Programmable flash block protection (FPROT/NVPROT) and security byte prevents unauthorized read/write access to memory |
| Low-power operation | Four stop modes (Stop1–Stop3) with wake-up from LVD, RTI, IRQ, or KBI; current draw as low as 1 µA in Stop3 with BDM disabled |
| Integrated analog subsystem | 10-bit ADC with 16 selectable inputs, hardware averaging, and conversion times down to 3.5 µs per sample |
| Robust debug interface | Single-wire background debug mode (BDM) with real-time register inspection, breakpoint setting, and flash programming via PTG0 pin |
| Flexible clock configuration | Internal clock generator supports automatic FLL lock detection, loss-of-clock recovery, and dynamic mode switching without reset |
Applications
| Home Appliance Control | Industrial Sensor Interface |
|---|---|
Use Scenario: Microcontroller manages user interface, motor speed, temperature feedback, and safety interlocks in washing machines and dishwashers. IC Role / Device Role / Timing Role: Primary system controller executing real-time motor PWM, ADC-based thermistor readings, and SCI-based communication with display module. Use Value: Integrated TPM PWM channels deliver precise 0.1% duty cycle resolution at 20 kHz; 32 KB Flash accommodates firmware updates and safety certification code space. |
Use Scenario: Condition monitoring node collects vibration, temperature, and humidity data from factory-floor sensors and transmits via RS-485. IC Role / Device Role / Timing Role: Data acquisition hub with synchronized ADC sampling, SPI-driven sensor interface, and SCI-driven UART-to-RS485 bridge. Use Value: 16-channel ADC supports simultaneous multi-sensor sampling; built-in LVD ensures reliable operation during brown-out conditions common in industrial power environments. |
| Automotive Body Electronics | Consumer Remote Control Hub |
Use Scenario: Controls interior lighting, door locks, and window lift functions in entry-level automotive platforms with CAN gateway coordination. IC Role / Device Role / Timing Role: Local body controller handling switch debouncing, PWM dimming, and LIN/CAN message translation via SCI. Use Value: Keyboard interrupt module enables low-power wake-on-keypress; high-current Port F pins directly drive LEDs and small solenoids without external drivers. |
Use Scenario: Central IR receiver and RF transceiver hub consolidating commands from multiple remote controls into unified USB/HID output. IC Role / Device Role / Timing Role: Protocol translator with IR demodulation (via TPM input capture), RF packet parsing, and USB HID emulation logic. Use Value: Dual TPM modules allow simultaneous IR carrier detection (38 kHz) and RF timing analysis; 2 KB RAM supports packet buffering and command queuing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC32CFUE | Same HCS08 core, 32 KB Flash, but 44-pin QFP package; lacks TPM2 and has only 8-channel ADC | Less peripheral integration; suitable for simpler control tasks without dual timer requirements | Select when PCB layout uses QFP and dual TPM or 16-channel ADC is not needed |
| S9S08SG32E1MTJ | NXP's later S08SG family; same 32 KB Flash, QFN-48, but adds LIN physical layer support and enhanced BDM | Includes LINPHY for automotive network nodes; higher qualification grade (AEC-Q100 Grade 2) | Select for new automotive designs requiring LIN compliance and extended temperature range (−40°C to 105°C) |
Compared with MC9S08GT32ACFDE, MC9S08AC32CFUE reduces peripheral count and package size at the cost of timer and ADC flexibility, while S9S08SG32E1MTJ extends automotive readiness and protocol support without altering core instruction compatibility.
Availability
MC9S08GT32ACFDE is available at Aetrix Electronics and suitable for home appliance control, industrial sensor interface, automotive body electronics, and consumer remote control hub applications requiring stable component supply and long-term lifecycle support.
Supply support for MC9S08GT32ACFDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC9S08GT32ACFDE belongs to the HCS08 microcontroller family designed for cost-optimized, low-power embedded control in appliances, industrial equipment, and automotive sub-systems where deterministic real-time response and code density are critical.
FAQ
What is the maximum bus frequency supported by the MC9S08GT32ACFDE?
The MC9S08GT32ACFDE supports a maximum bus frequency of 40 MHz when operating in FEE mode with an external 4 MHz crystal and appropriate FLL configuration. This value is confirmed in the MC9S08GB60A/GTxxA datasheet Rev. 2 (2008), Appendix A Electrical Characteristics, Table A-9. The internal clock generator allows scaling from 32 kHz to 40 MHz depending on mode and external component selection. MC9S08GT32ACFDE maintains timing integrity across all supported modes without requiring external PLL circuitry.
Does the MC9S08GT32ACFDE include hardware debug support?
Yes, the MC9S08GT32ACFDE integrates a single-wire Background Debug Mode (BDM) interface accessible via the PTG0 pin. It supports real-time register inspection, flash programming, breakpoint insertion, and memory read/write operations without halting peripheral operation. This capability is documented in Chapter 15 "Development Support" of the MC9S08GB60A/GTxxA datasheet Rev. 2. MC9S08GT32ACFDE requires no external debug probe beyond standard BDM-compatible programmers like the P&E Multilink.
What ADC resolution and channel count does the MC9S08GT32ACFDE provide?
The MC9S08GT32ACFDE features a 10-bit successive-approximation analog-to-digital converter with 16 selectable input channels mapped to Port B pins. Conversion time is as fast as 3.5 µs per sample under optimal clocking conditions, and the module supports hardware averaging across up to eight samples to improve effective resolution. These specifications are verified in Chapter 14 "Analog-to-Digital Converter (S08ATDV3)" of the MC9S08GB60A/GTxxA datasheet Rev. 2. MC9S08GT32ACFDE delivers consistent linearity and offset performance across its full −40°C to 105°C operating range.
Is the MC9S08GT32ACFDE pin-compatible with other devices in the GTxxA series?
Yes, the MC9S08GT32ACFDE shares identical pinout and package (QFN-48, 98ASA00466D) with MC9S08GT16A, MC9S08GT60A, and MC9S08GB60A within the same family. All share the same mechanical drawing and signal mapping per Chapter 2 "Pins and Connections" of the MC9S08GB60A/GTxxA datasheet Rev. 2. This allows hardware reuse across variants differing only in Flash/RAM size. MC9S08GT32ACFDE retains full functional compatibility with these parts, enabling scalable firmware development and board-level design flexibility.
What low-power modes are available on the MC9S08GT32ACFDE?
The MC9S08GT32ACFDE supports four low-power modes: Run, Wait, Stop1, and Stop3. Stop3 achieves the lowest current consumption (≤1 µA) with BDM disabled and only LVD or RTI capable of wake-up. Each mode preserves different register states and peripheral functionality - for example, ADC and TPM remain active in Wait mode but are halted in Stop modes. These behaviors are defined in Chapter 3 "Modes of Operation" of the MC9S08GB60A/GTxxA datasheet Rev. 2. MC9S08GT32ACFDE enables energy-efficient operation in battery-powered or thermally constrained applications without sacrificing responsiveness.
MC9S08GT32ACFDE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MC9S08GT32ACFDE FAQ
1.How can I place an order for MC9S08GT32ACFDE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08GT32ACFDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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For technical support, including MC9S08GT32ACFDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GT32ACFDE requirements.
6.How does Aetrix verify that MC9S08GT32ACFDE is sourced from the original manufacturer or authorized distributors?
All MC9S08GT32ACFDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GT32ACFDE meets industry standards.
7.What is the process for return or replacement of MC9S08GT32ACFDE?
All MC9S08GT32ACFDE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GT32ACFDE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08GT32ACFDE part is unused and in its original packaging.
Return procedure for MC9S08GT32ACFDE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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