NXP Semiconductors MC9S08GT60ACBE
- Part No.:
- MC9S08GT60ACBE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 42-SDIP (0.600", 15.24mm)
- Datasheet:
-
MC9S08GT60ACBE.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 42DIP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC9S08GT60ACBE from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller featuring 60 KB on-chip Flash, 4 KB RAM, and a 20 MHz bus frequency. It integrates a 10-bit ADC with 16 channels, two 16-bit Timer/PWM modules (TPM1/TPM2), SCI/IIC/SPI serial interfaces, and keyboard interrupt capability. It targets cost-sensitive industrial control and automotive body electronics applications requiring deterministic real-time response.
For engineers reviewing the MC9S08GT60ACBE datasheet, MC9S08GT60ACBE pinout, MC9S08GT60ACBE application, or MC9S08GT60ACBE equivalent, key selection criteria include its QFN-48 package with exposed thermal pad, internal clock generator supporting FEE/FBE/FEI modes, low-voltage detect (LVD) with reset/interrupt options, and background debug mode (BDM) support for in-circuit development.
Technical Context
The MC9S08GT60ACBE implements the S08CPUV2 core with 16-bit index register, 8-bit accumulator, and condition code register. Its internal clock generator (S08ICGV2) supports multiple modes including FLL-engaged external (FEE) and bypassed external (FBE), enabling stable bus frequencies up to 20 MHz using external crystals from 32 kHz to 4 MHz or external clocks.
Peripheral integration includes two independent TPM modules (each with six channels), a 16-channel 10-bit ADC with configurable sample time and conversion triggers, and dual serial interfaces: one SCI (UART-compatible) and one IIC (standard-mode, 100 kHz). All peripherals are clocked from the same bus clock domain and support stop-mode wake-up via interrupt.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with S08CPUV2 instruction set and 16-bit index register |
| Flash Memory | 60 KB program Flash with block protection, 512-byte sector erase, and burst programming |
| RAM Size | 4 KB on-chip RAM with retention in Stop1/Stop2 modes |
| Bus Frequency | Up to 20 MHz - determines maximum peripheral timing resolution and instruction throughput |
| ADC Resolution | 10-bit successive approximation ADC with 16 input channels and software-selectable sample time |
| Timer Modules | Two 16-bit TPM modules (TPM1/TPM2), each with six channels supporting input capture, output compare, and edge-aligned PWM |
| Serial Interfaces | One SCI (asynchronous UART), one IIC (standard-mode, 100 kHz), one SPI (master/slave, 1–8 MHz) |
| Operating Voltage | 2.7–5.5 V - supports direct interface with 3.3 V and 5 V logic systems without level translation |
Pinout & Package
MC9S08GT60ACBE is housed in a 48-pin QFN package (98ASA00466D) with 7 × 7 mm footprint and exposed thermal pad. The copper-wire bonded variant replaces earlier gold-wire versions per Freescale QFN Addendum Rev. 0 (2014).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual VDD pins (Pins 1, 48) and four VSS pins (Pins 2, 3, 47, 46) ensure low-noise power distribution and EMI reduction |
| EXTAL / XTAL | Crystal oscillator input/output | Supports 32 kHz watch crystal or 1–4 MHz main crystal; enables FEE/FBE clock modes with automatic FLL lock detection |
| PTA0–PTA7 | Port A general-purpose I/O | Configurable as GPIO or keyboard interrupt inputs (KBI); internal pullups enabled via PTAPE register |
| PTB0–PTB7 | Port B analog/digital I/O | 16-channel ADC inputs (AD0–AD15) mapped across PTB0–PTB7 and PTC0–PTC7; selectable analog/digital mode per pin |
| PTC0–PTC7 | Port C peripheral multiplexing | Shares pins with IIC (SCL/SDA), SCI2 (TX/RX), and high-current drivers (up to 20 mA sink/source) |
| PTD0–PTD7 | Port D timer and PWM outputs | TPM1 and TPM2 channel outputs (TPM1CH0–TPM1CH5, TPM2CH0–TPM2CH1) with programmable polarity and dead-time insertion |
| PTE0–PTE7 | Port E serial and SPI interface | SCI1 (TX/RX), SPI (MOSI/MISO/SCK/SS), and optional IRQ input - all with slew-rate control |
| PTF0–PTF7 | Port F high-current drivers | Eight dedicated high-current outputs (20 mA sink/source) for LED driving or relay control without external buffers |
| PTG0 | Background debug / mode select | BKGD/MS pin - single-wire BDM interface for programming and real-time debugging; also selects boot mode at reset |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® technology | Enables 100,000 write/erase cycles and 20-year data retention at 85°C - critical for field-updatable firmware |
| Low-voltage detect (LVD) | Programmable trip points (2.5 V, 2.7 V, 2.9 V, 3.1 V) with reset or interrupt output - prevents erratic operation during brownout |
| Real-time interrupt (RTI) | Independent 16-bit counter driven by internal reference clock - provides precise periodic wake-up from Stop3 mode without external components |
| Keyboard interrupt (KBI) | Hardware scan of up to 8 Port A pins with edge/level sensitivity and debounce filtering - reduces CPU overhead in keypad monitoring |
| Thermal pad QFN | Exposed die paddle improves thermal resistance (θJA ≈ 42°C/W) - enables sustained 20 MHz operation in compact industrial enclosures |
| Background debug mode (BDM) | Single-pin, non-intrusive debug interface supporting flash programming, breakpoint setting, and register inspection - eliminates need for JTAG header space |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle systems. IC Role / Device Role / Timing Role: Main system MCU coordinating CAN/LIN gateway functions, analog sensor acquisition (temperature, position), and PWM-driven motor control. Use Value: Integrated high-current port F drivers eliminate external driver ICs; LVD ensures fail-safe shutdown during battery voltage sag below 9 V. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via analog and digital sensors in factory settings. IC Role / Device Role / Timing Role: Low-power host MCU managing ADC sampling, IIC sensor reads, and SCI-based RS-485 reporting every 30 seconds. Use Value: Stop3 mode with RTI wake-up achieves <2.5 µA standby current; internal clock generator eliminates external 32 kHz crystal for BOM reduction. |
| Smart Appliance Control Board | LED Lighting Driver |
|
Use Scenario: Embedded controller in washing machine or HVAC unit handling user interface, motor sequencing, and safety interlocks. IC Role / Device Role / Timing Role: Real-time task scheduler interfacing with keypad (KBI), display backlight (PWM), and fault-sensing ADC inputs. Use Value: Keyboard interrupt hardware offloads 100% of key-scan processing; 60 KB Flash accommodates bootloader + dual-application firmware images. |
Use Scenario: Constant-current LED driver for commercial signage with dimming, thermal foldback, and fault reporting. IC Role / Device Role / Timing Role: PWM generator and thermal monitor using ADC channel to read NTC thermistor; SCI transmits status to master controller. Use Value: Six independent TPM channels enable simultaneous dimming of three RGB LED strings; high-current port F drives indicator LEDs directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08AC128CPUE | 128 KB Flash, 8 KB RAM, same HCS08 core and peripheral set; uses 64-pin LQFP instead of QFN-48 | Higher memory capacity suits larger protocol stacks (e.g., LIN slave with diagnostics); larger package eases hand-soldering but increases board area | Select when firmware size exceeds 60 KB or when PCB layout requires through-hole or larger pitch for reliability testing |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB Flash, 16 KB RAM; pin-compatible QFN-48 but different register map and toolchain | Offers higher performance (40 MHz core), floating-point unit, and enhanced security features - suitable for next-gen designs requiring scalability | Choose for new designs targeting long-term roadmap continuity; not drop-in compatible due to architecture change and BDM replacement with SWD |
Compared with MC9S08AC128CPUE and S9KEAZ128AMLH, the MC9S08GT60ACBE delivers optimal balance of Flash density, thermal performance in QFN-48, and mature toolchain support - making it ideal for cost-constrained, volume-manufactured automotive and industrial controllers where legacy code reuse and qualification stability are priorities.
Availability
MC9S08GT60ACBE is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control boards, and LED lighting drivers requiring stable component supply across multi-year production cycles.
Supply support for MC9S08GT60ACBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's HCS08 MCU lineage.
The MC9S08GT60ACBE belongs to the HCS08 GT-series - designed specifically for cost-sensitive, real-time embedded control in harsh environments where robustness, low power, and proven qualification (AEC-Q100 Grade 2) are mandatory.
FAQ
What is the maximum bus frequency supported by the MC9S08GT60ACBE?
The MC9S08GT60ACBE supports a maximum bus frequency of 20 MHz. This is achieved in FEE (FLL Engaged External) mode using a 4 MHz crystal with 5× multiplication, or in FBE (FLL Bypassed External) mode with direct 20 MHz external clock input. The internal clock generator (S08ICGV2) ensures stable operation across voltage (2.7–5.5 V) and temperature (−40°C to 105°C) ranges specified in the datasheet.
Does the MC9S08GT60ACBE support in-circuit debugging?
Yes, the MC9S08GT60ACBE supports single-wire background debug mode (BDM) via the PTG0 pin. This allows full in-circuit programming, real-time register inspection, breakpoint setting, and memory read/write without halting peripheral operation. BDM is fully supported by CodeWarrior Development Studio and compatible third-party tools, and requires no additional pins beyond BKGD/MS.
What packaging variant is used for the MC9S08GT60ACBE?
The MC9S08GT60ACBE is supplied in a 48-pin QFN package with 7 × 7 mm body and exposed thermal pad, documented under package code 98ASA00466D. This copper-wire bonded variant supersedes earlier gold-wire versions per Freescale's QFN Addendum Rev. 0 (July 2014), offering improved wirebond reliability and thermal performance.
Can the MC9S08GT60ACBE operate from a 3.3 V supply?
Yes, the MC9S08GT60ACBE operates over a supply range of 2.7 V to 5.5 V, making it fully compatible with standard 3.3 V systems. All I/O pins are 5 V tolerant when configured as inputs, and internal peripherals-including the 10-bit ADC and TPM modules-function correctly at 3.3 V with appropriate reference voltage configuration (e.g., AVDD as VREFH).
How many ADC channels does the MC9S08GT60ACBE provide?
The MC9S08GT60ACBE integrates a 10-bit successive approximation ADC with 16 input channels. These are distributed across Port B (AD0–AD7) and Port C (AD8–AD15), with flexible software configuration for single-ended or differential acquisition, programmable sample time, and trigger sources including TPM overflow and software start.
MC9S08GT60ACBE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 42-SDIP (0.600", 15.24mm)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 33
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
MC9S08GT60ACBE FAQ
1.How can I place an order for MC9S08GT60ACBE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC9S08GT60ACBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC9S08GT60ACBE reliable?
The price and inventory of MC9S08GT60ACBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08GT60ACBE is usually 5 days.
3.What payment methods are accepted for MC9S08GT60ACBE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08GT60ACBE transactions.
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4.How is shipping managed for MC9S08GT60ACBE?
MC9S08GT60ACBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC9S08GT60ACBE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC9S08GT60ACBE?
For technical support, including MC9S08GT60ACBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08GT60ACBE requirements.
6.How does Aetrix verify that MC9S08GT60ACBE is sourced from the original manufacturer or authorized distributors?
All MC9S08GT60ACBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08GT60ACBE meets industry standards.
7.What is the process for return or replacement of MC9S08GT60ACBE?
All MC9S08GT60ACBE units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08GT60ACBE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC9S08GT60ACBE part is unused and in its original packaging.
Return procedure for MC9S08GT60ACBE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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