NXP Semiconductors MC9S08GT60ACFDER

Overview

MC9S08GT60ACFDER from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and integrated peripherals including dual SCI, SPI, I²C, 16-channel 10-bit ADC, and two 16-bit TPM timer/PWM modules. It operates at up to 40 MHz bus frequency using internal or external clock sources and targets embedded control in automotive body electronics, industrial sensors, and appliance motor control.

For engineers reviewing the MC9S08GT60ACFDER datasheet, MC9S08GT60ACFDER pinout, MC9S08GT60ACFDER application, or MC9S08GT60ACFDER equivalent, key selection criteria include Flash endurance (100k erase/write cycles), low-power stop modes (down to 1.2 µA in Stop3), QFN-48 package thermal performance, and BDM debug interface compatibility with standard Freescale/NXP tools.

Technical Context

The MC9S08GT60ACFDER implements the S08CPUV2 core with 16-bit index register, 8-bit accumulator, and condition code register, supporting 7 addressing modes and 115 instructions. Its internal clock generator (S08ICGV2) supports FEE, FBE, FEI, and SCM modes with programmable FLL multiplication and crystal oscillator support from 32 kHz to 8 MHz.

Peripheral integration includes two asynchronous serial interfaces (SCI1/SCI2), one synchronous serial interface (SPI), one Inter-Integrated Circuit (I²C) module, a 16-channel 10-bit ADC with 4 µs conversion time, and two 16-bit Timer/PWM modules (TPM1/TPM2) each with six channels and flexible input capture/output compare modes.

Key Specifications

Pinout & Package

MC9S08GT60ACFDER is housed in a 48-pin QFN (Quad Flat No-lead) package with 7 × 7 mm body and 0.5 mm pitch, featuring an exposed thermal pad for enhanced heat dissipation in compact industrial and automotive PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with MC9S08AC60CFDE, MC9S08GT60ACFDER adds I²C and second SCI for richer peripheral connectivity in sensor-rich environments; compared with S9KEAZN64AMLH, it offers mature BDM tooling and deterministic 8-bit real-time behavior at lower power in simple control loops.

Availability

MC9S08GT60ACFDER is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and home appliance motor control requiring stable component supply across extended product lifecycles.

Supply support for MC9S08GT60ACFDER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.

The MC9S08GT60ACFDER belongs to the HCS08 microcontroller family designed for cost-effective, low-power embedded control in resource-constrained environments where deterministic real-time response and long-term supply stability are essential.

FAQ

What is the maximum operating frequency of the MC9S08GT60ACFDER?

The MC9S08GT60ACFDER supports a maximum bus frequency of 40 MHz, achieved via its internal clock generator's FLL-engaged external clock (FEE) mode using an external crystal or oscillator. This frequency governs instruction execution speed, peripheral timing resolution, and ADC sampling rate - all verified in the device's electrical characteristics table under conditions of VDD = 3.3 V and TA = 25°C.

Does the MC9S08GT60ACFDER support in-circuit debugging?

Yes, the MC9S08GT60ACFDER includes a single-wire Background Debug Mode (BDM) interface accessible via the PTG0 pin. This allows full in-circuit programming, real-time register inspection, breakpoint setting, and flash memory erasure without requiring external JTAG hardware - a feature confirmed in Chapter 15 of the official datasheet and supported by CodeWarrior Development Studio v6.3 and later.

What package type and pin count does the MC9S08GT60ACFDER use?

The MC9S08GT60ACFDER is packaged in a 48-pin QFN (Quad Flat No-lead) with 7 × 7 mm body size and 0.5 mm pitch, as documented in Freescale's QFN Addendum Rev. 0 (2014) and mechanical drawings in Appendix C of the MC9S08GB60A/MC9S08GT60A datasheet. The exposed thermal pad enhances thermal performance in high-density PCB layouts.

How much Flash and RAM memory does the MC9S08GT60ACFDER have?

The MC9S08GT60ACFDER integrates 60 KB of on-chip Flash memory and 4 KB of RAM. Flash endurance is rated at 100,000 erase/write cycles with 10-year data retention at 85°C, while RAM provides volatile storage for variables, stack, and heap operations - specifications confirmed in Chapter 4 of the MC9S08GB60A/MC9S08GT60A datasheet Rev. 2 (2008).

Which communication interfaces are integrated into the MC9S08GT60ACFDER?

The MC9S08GT60ACFDER integrates dual asynchronous serial interfaces (SCI1 and SCI2), one synchronous serial interface (SPI), and one Inter-Integrated Circuit (I²C) module. These are physically mapped to Port E (SCI1), Port C (SCI2 and I²C), and Port E (SPI), enabling concurrent communication with UART-based modems, SPI flash memory, and I²C temperature/humidity sensors - details validated in Chapters 11–13 of the datasheet.