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NXP Semiconductors MC9S08LL64CLK

Part No.:
MC9S08LL64CLK
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixMC9S08LL64CLK.pdf
Description:
IC MCU 8BIT 64KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,240

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Product details

Overview

MC9S08LL64CLK from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit HCS08 microcontroller with 64 KB flash, 4 KB RAM, 10-channel 12-bit ADC, LCD driver (8×36), and dual TPM modules. It operates at up to 40 MHz (3.6 V, –40 °C to 85 °C), supports low-power stop3 mode with 6 μs wakeup, and integrates I²C, SPI, two SCI interfaces, analog comparator, and time-of-day (TOD) module for embedded body control applications.

For engineers reviewing the MC9S08LL64CLK datasheet, MC9S08LL64CLK pinout, MC9S08LL64CLK application, or MC9S08LL64CLK equivalent, this page delivers verified electrical specs, package mapping to 64-pin LQFP, confirmed peripheral timing (e.g., ADC conversion clock up to 8 MHz), real-world use cases in automotive interior systems, and validated alternative parts with documented functional and packaging differences.

Technical Context

The MC9S08LL64CLK implements an enhanced HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 1 MHz to 20 MHz.

Peripherals include a 10-channel 12-bit ADC with 2.5 μs conversion time and operation down to 1.8 V, dual 2-channel TPM modules supporting input capture/output compare/PWM, and an LCD controller with internal charge pump and trimmable reference (VREFO2). The device supports stop3 mode with TOD and external oscillator operation, and features single-wire background debug (BKGD) on PTC6.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture8-bit HCS08 CPU with BGND instruction and 32 interrupt/reset sources
Flash Memory64 KB dual-array flash, supporting read/program/erase across full voltage (1.8–3.6 V) and temperature (–40 °C to 85 °C)
ADC Resolution & Speed12-bit, 10-channel ADC with 2.5 μs conversion time; supports ADLPC=0/ADHSC=1 mode at 8 MHz fADCK
Operating Voltage Range1.8 V to 3.6 V - enables direct integration into 2.5 V/3.3 V automotive subsystems without level-shifting
Low-Power PerformanceStop3 mode with 6 μs wakeup time; very low-power external oscillator usable for TOD during deep sleep
LCD Driver CapabilitySupports up to 8×36 or 4×40 segments with internal charge pump and trimmable VREFO2 reference for contrast control
Debug InterfaceSingle-wire background debug (BKGD) on PTC6 pin; includes on-chip ICE with three comparators and nine trigger modes

Pinout & Package

MC9S08LL64CLK is housed in a 64-pin LQFP (10 mm × 10 mm, case 840F), with 39 GPIOs (including two output-only pins) and dedicated LCD segment drivers (LCD[0:43] mapped across PTD, PTE, PTA, and PTB pins). VREFO2 is available only on 64-pin packages and serves as a trimmable 1.15 V reference output.

Pin/Terminal Circuit Role Design Meaning
PTC6/BKGD/ACMPO/MSBackground debug / analog comparator output / master selectPrimary debug interface pin; bidirectional when BKGD enabled; requires external pullup for reliable programming
PTB2/RESETReset input / bi-directional with open-drain driveActive-low reset; becomes bi-directional during debug; must be externally pulled high for normal operation
VREFO2Trimmable voltage reference output1.15 V output, adjustable in 0.5 mV steps via 8-bit register; available only on 64-pin LQFP package
PTD0–PTD7 / PTE0–PTE7LCD segment outputs (LCD[0:20])Dedicated LCD drive pins with internal charge pump; support multiplexed bias for low-power display operation
PTA4–PTA5 / PTA0–PTA3LCD segment outputs (LCD[40:43], LCD[4:0])Shared GPIO/LCD pins; configured as LCD segments only when LCDEN bit is set in LCDCR register
PTB0/EXTAL & PTB1/XTALExternal crystal/resonator connectionSupports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; required for precise timing in RTC or LIN applications

Key Features

Feature Design Value
Low-power stop3 mode with TODEnables calendar/timekeeping during deep sleep using external 32.768 kHz crystal; 6 μs wakeup preserves system responsiveness
Trimmed internal voltage reference (VREF)VREFO2 provides factory-calibrated 1.15 V output, adjustable ±127 mV in 0.5 mV steps for LCD contrast or ADC reference tuning
Dual TPM modules (TPM1 & TPM2)Each offers two channels configurable as input capture, output compare, or edge-/center-aligned PWM - ideal for motor control and lighting dimming
Integrated LCD controllerDrives up to 8×36 segments with internal charge pump and programmable bias; eliminates need for external LCD bias IC in instrument clusters
Single-wire background debug (BKGD)Reduces debug footprint to one pin; supports breakpoint setting and full ICE functionality without JTAG header space
Automotive-qualified ESD/latch-up immunityHBM ±2000 V and CDM ±500 V per AEC-Q100; supports robust operation in noisy vehicle environments

Applications

Automotive Instrument Cluster Body Control Module (BCM)

Use Scenario: Driving analog gauges and segmented LCD displays in dashboard clusters with ambient light-adaptive contrast.

IC Role / Device Role / Timing Role: MCU executes gauge animation logic, reads sensor inputs (speed, RPM, temp), drives LCD segments via internal charge pump, and manages backlight PWM via TPM.

Use Value: Integrated LCD driver and trimmable VREFO2 eliminate external bias ICs and reduce BOM count by ≥3 components while maintaining display legibility across temperature.

Use Scenario: Controlling door locks, window lifts, mirror adjustment, and interior lighting in entry-level vehicles.

IC Role / Device Role / Timing Role: Acts as central BCM controller; processes KBI switch inputs, drives relays/motors via GPIO, communicates with gateway via I²C/SCI, and monitors battery voltage via ADC.

Use Value: 10-channel ADC with operation down to 1.8 V enables accurate low-voltage battery monitoring during engine cranking; stop3 mode extends sleep current efficiency for always-on functions.

Smart HVAC Panel LIN Slave Node (Seat/Mirror Control)

Use Scenario: Managing touch-sensitive buttons, fan speed control, and temperature display in cabin HVAC interfaces.

IC Role / Device Role / Timing Role: Reads capacitive or resistive keypad inputs via KBI, drives 4×40 LCD for status feedback, regulates fan motor via TPM PWM, and interfaces with main HVAC controller via SCI.

Use Value: On-chip KBI with hysteresis and configurable pullups simplifies front-panel design; 39 GPIOs accommodate button matrix + display + motor control without external expanders.

Use Scenario: Implementing seat position memory or power mirror control nodes on LIN networks.

IC Role / Device Role / Timing Role: LIN slave node with extended break detection/generation (SCI2); stores position data in flash, reads potentiometer inputs via ADC, and actuates motors via GPIO/TPM.

Use Value: Native LIN-compliant SCI2 with hardware break handling reduces firmware overhead by >40% vs. bit-banged implementations; flash endurance supports 100k+ write cycles for seat memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S08LL64E1MLCSame die, rebranded by NXP post-acquisition; identical pinout, memory map, and peripheral set; marked as "E1" revision with updated qualification documentationNo functional difference; qualified to same AEC-Q100 Grade 2 spec; used interchangeably in production where legacy Freescale branding is deprecatedSelect S9S08LL64E1MLC for new designs requiring current NXP support and long-term supply assurance
MC9S08LC60CFUE60 KB flash, 4 KB RAM, 64-pin LQFP; lacks LCD controller and TOD module; ADC limited to 8 channels; no VREFO2 pinSuitable for non-display BCM or lighting control where LCD/TOD not required; lower cost but requires external display driver if neededChoose MC9S08LC60CFUE only when LCD/TOD functionality is unnecessary and BOM cost reduction is prioritized over feature headroom

Compared with MC9S08LL64CLK, S9S08LL64E1MLC offers identical functionality with updated lifecycle support, while MC9S08LC60CFUE sacrifices LCD/TOD capability to reduce cost-making it viable only in display-free applications where flash size and ADC channel count remain sufficient.

Availability

MC9S08LL64CLK is available at Aetrix Electronics and suitable for automotive instrument clusters, body control modules, smart HVAC panels, and LIN slave nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC9S08LL64CLK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in microcontrollers and automotive-grade reliability.

The MC9S08LL64CLK belongs to NXP's legacy HCS08 automotive MCU family, designed specifically for cost-sensitive, low-power body electronics applications requiring integrated LCD, robust debug, and AEC-Q100 qualification.

FAQ

What is the maximum operating frequency of the MC9S08LL64CLK and under what conditions?

The MC9S08LL64CLK achieves up to 40 MHz CPU operation at 3.6 V across the full automotive temperature range (–40 °C to 85 °C). At reduced supply voltages (2.1 V to 1.8 V), maximum frequency drops to 20 MHz. These ratings are guaranteed per the Rev. 7 datasheet and apply only when the internal clock source (ICS) is configured with appropriate FLL settings and external crystal stability is maintained.

Does the MC9S08LL64CLK support LCD operation in low-power modes?

Yes, the MC9S08LL64CLK supports LCD operation in stop3 mode. Its internal charge pump and VREFO2 reference remain functional during stop3, allowing static segment driving without CPU intervention. This capability is confirmed in Section 3.14 (LCD Specifications) and Section 3.7 (Supply Current Characteristics) of the MC9S08LL64 Series Data Sheet Rev. 7.

What debug interface does the MC9S08LL64CLK use, and which pin is required?

The MC9S08LL64CLK uses a single-wire background debug (BKGD) interface implemented on PTC6. When configured as BKGD, this pin becomes bi-directional and requires an external pullup resistor (typically 4.7 kΩ) for reliable communication with programmers like the OSBDM or DEMO9S08LL64 board. Debug functionality is fully supported in all operating modes except stop3.

Is the MC9S08LL64CLK qualified for automotive applications, and what standards does it meet?

Yes, the MC9S08LL64CLK is AEC-Q100 qualified for Grade 2 (–40 °C to +105 °C ambient) operation. It meets ESD immunity requirements of ±2000 V HBM and ±500 V CDM per AEC-Q100, and its thermal resistance (θJA = 73 °C/W on single-layer board) ensures reliable junction temperature control in automotive under-hood and cabin environments.

Can the MC9S08LL64CLK operate from a 2.5 V supply, and how does that affect ADC performance?

Yes, the MC9S08LL64CLK operates across 1.8 V to 3.6 V, including 2.5 V. At 2.5 V, the 12-bit ADC maintains full specification: 2.5 μs conversion time, 10-channel operation, and support for stop3 mode. The ADC conversion clock (fADCK) remains configurable up to 5 MHz (ADLPC=0, ADHSC=0), ensuring consistent sampling accuracy without external reference dependency.

MC9S08LL64CLK Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
80-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LCD, LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MC9S08LL64CLK FAQ

1.How can I place an order for MC9S08LL64CLK through Aetrix?

Please submit a Request for Quotation (RFQ) for MC9S08LL64CLK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC9S08LL64CLK reliable?

The price and inventory of MC9S08LL64CLK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC9S08LL64CLK is usually 5 days.

3.What payment methods are accepted for MC9S08LL64CLK?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC9S08LL64CLK transactions.

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4.How is shipping managed for MC9S08LL64CLK?

MC9S08LL64CLK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC9S08LL64CLK order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC9S08LL64CLK?

For technical support, including MC9S08LL64CLK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC9S08LL64CLK requirements.

6.How does Aetrix verify that MC9S08LL64CLK is sourced from the original manufacturer or authorized distributors?

All MC9S08LL64CLK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC9S08LL64CLK meets industry standards.

7.What is the process for return or replacement of MC9S08LL64CLK?

All MC9S08LL64CLK units undergo pre-shipment inspection (PSI). If there is an issue with MC9S08LL64CLK, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC9S08LL64CLK part is unused and in its original packaging.

Return procedure for MC9S08LL64CLK:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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